YoungLyong KIM

Person

Gunpo-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,033,973
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Soohyun Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a first semiconductor chip with a p...
- Patent number 11,817,443
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including non-conductive film between package...
- Patent number 11,676,875
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with improved heat dissipation
- Patent number 11,581,234
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stack structure and method of manufactur...
- Patent number 11,488,937
- Issue date Nov 1, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including dummy chip on a first semiconductor...
- Patent number 11,222,882
- Issue date Jan 11, 2022
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including non-conductive film between package...
- Patent number 11,164,805
- Issue date Nov 2, 2021
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,922,007
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- YoungLyong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321815
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120319
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079349
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240079340
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
- Publication number 20240063167
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240030187
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240021577
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230154819
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...
- Publication number 20230154910
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230144602
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- YOUNGLYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING THROUGH-SILICON VIA AND METHOD OF F...
- Publication number 20230126686
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- INHYO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SUB-PACKAGE
- Publication number 20230111207
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230069511
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT SINKS
- Publication number 20230005814
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- HYUNSOO CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...
- Publication number 20220359469
- Publication date Nov 10, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220189907
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Soohyun NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220093582
- Publication date Mar 24, 2022
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220068887
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220020653
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210167054
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20210111140
- Publication date Apr 15, 2021
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210066148
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING HEAT SPREADER
- Publication number 20200402883
- Publication date Dec 24, 2020
- Samsung Electronics Co., Ltd.
- Younglyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200388549
- Publication date Dec 10, 2020
- Samsung Electronics Co., Ltd.
- Younglyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130256877
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- YoungLyong KIM
- H01 - BASIC ELECTRIC ELEMENTS

YoungLyong KIM

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package including a first semiconductor chip with a p...

Semiconductor package including non-conductive film between package...

Semiconductor package with improved heat dissipation

Semiconductor package with stack structure and method of manufactur...

Semiconductor package including dummy chip on a first semiconductor...

Semiconductor package including non-conductive film between package...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING THROUGH-SILICON VIA AND METHOD OF F...

SEMICONDUCTOR PACKAGE INCLUDING SUB-PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING HEAT SINKS

SEMICONDUCTOR PACKAGE, AND A PACKAGE ON PACKAGE TYPE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES HAVING HEAT SPREADER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE