Yu-Cheng Pai

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier structure and package structure
- Patent number 11,239,125
- Issue date Feb 1, 2022
- Siliconware Precision Industries Co., Ltd.
- Hsien-Lung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,205,644
- Issue date Dec 21, 2021
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,629,572
- Issue date Apr 21, 2020
- Silicon Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of package structure
- Patent number 10,147,615
- Issue date Dec 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package structure
- Patent number 10,141,266
- Issue date Nov 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a packaging substrate including a carrier hav...
- Patent number 10,096,491
- Issue date Oct 9, 2018
- Silicon Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer wiring package substrate, single-layer wiring package...
- Patent number 10,068,842
- Issue date Sep 4, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of fabricating the same
- Patent number 10,043,757
- Issue date Aug 7, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure with an embedded electronic...
- Patent number 10,002,825
- Issue date Jun 19, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing package substrate and semiconductor package
- Patent number 9,905,438
- Issue date Feb 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of coreless packaging substrate
- Patent number 9,899,249
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer wiring package substrate, single-layer wiring package...
- Patent number 9,735,080
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with an embedded electronic component and method...
- Patent number 9,716,060
- Issue date Jul 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having a laminated release layer and method for f...
- Patent number 9,673,140
- Issue date Jun 6, 2017
- Siliconware Precision Industries Co., Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate, semiconductor package and method of manufacturin...
- Patent number 9,640,503
- Issue date May 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure and fabrication method thereof
- Patent number 9,607,860
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless packaging substrate and fabrication method thereof
- Patent number 9,510,463
- Issue date Nov 29, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 9,490,225
- Issue date Nov 8, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package
- Patent number 9,112,063
- Issue date Aug 18, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,796,867
- Issue date Aug 5, 2014
- Siliconware Precision Industries Co., Ltd.
- Wei Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 8,471,383
- Issue date Jun 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Liang-Yi Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240332149
- Publication date Oct 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yuan-Chang NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230027120
- Publication date Jan 26, 2023
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...
- Publication number 20200328142
- Publication date Oct 15, 2020
- Siliconware Precision Industries Co., Ltd.
- Don-Son Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20200212019
- Publication date Jul 2, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20200035573
- Publication date Jan 30, 2020
- Siliconware Precision Industries Co., Ltd.
- Hsien-Lung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190164941
- Publication date May 30, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20180247891
- Publication date Aug 30, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...
- Publication number 20170352615
- Publication date Dec 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...
- Publication number 20170309537
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE
- Publication number 20170301658
- Publication date Oct 19, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20170287840
- Publication date Oct 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE
- Publication number 20170236725
- Publication date Aug 17, 2017
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE
- Publication number 20170229319
- Publication date Aug 10, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SUBSTRATE STRUCTURE
- Publication number 20170171981
- Publication date Jun 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Chun-Hsien Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION METHOD OF CORELESS PACKAGING SUBSTRATE
- Publication number 20170047240
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160225642
- Publication date Aug 4, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...
- Publication number 20160163621
- Publication date Jun 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...
- Publication number 20160155716
- Publication date Jun 2, 2016
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160118323
- Publication date Apr 28, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160093546
- Publication date Mar 31, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
- Publication number 20160086879
- Publication date Mar 24, 2016
- Siliconware Precision Industries Co., Ltd.
- Ming-Chen Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160081186
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chun-Hsien Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC COMPONENT AND METHOD...
- Publication number 20160079151
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160079170
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160071780
- Publication date Mar 10, 2016
- Siliconware Precision Industries Co., Ltd.
- Shih-Chao Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF
- Publication number 20160021743
- Publication date Jan 21, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160013123
- Publication date Jan 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150348929
- Publication date Dec 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Wei-Chung Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150333029
- Publication date Nov 19, 2015
- Siliconware Precision Industries Co., Ltd.
- Yu-cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS

Yu-Cheng Pai

Person

Patents Grantslast 30 patents

Carrier structure and package structure

Method for fabricating electronic package

Electronic package and method for fabricating the same

Fabrication method of package structure

Method of fabricating semiconductor package structure

Method of fabricating a packaging substrate including a carrier hav...

Single-layer wiring package substrate, single-layer wiring package...

Semiconductor package structure and method of fabricating the same

Method of fabricating package structure with an embedded electronic...

Method of manufacturing package substrate and semiconductor package

Fabrication method of coreless packaging substrate

Single-layer wiring package substrate, single-layer wiring package...

Package structure with an embedded electronic component and method...

Package structure having a laminated release layer and method for f...

Package substrate, semiconductor package and method of manufacturin...

Electronic package structure and fabrication method thereof

Coreless packaging substrate and fabrication method thereof

Package structure and fabrication method thereof

Fabrication method of semiconductor package

Semiconductor package and fabrication method thereof

Semiconductor package and fabrication method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STACK STRUCTURE, METHOD FOR FABRICATING THE SAME, AND CARRI...

METHOD FOR FABRICATING ELECTRONIC PACKAGE

CARRIER STRUCTURE AND PACKAGE STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC...

SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...

FABRICATION METHOD OF PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE

FABRICATION METHOD OF PACKAGE STRUCTURE

METHOD OF FABRICATING SUBSTRATE STRUCTURE

FABRICATION METHOD OF CORELESS PACKAGING SUBSTRATE

ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SINGLE-LAYER WIRING PACKAGE SUBSTRATE, SINGLE-LAYER WIRING PACKAGE...

PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURIN...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME

SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE WITH AN EMBEDDED ELECTRONIC COMPONENT AND METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME