Yu-Chiao Chi

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,165,946
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,062,604
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with dummy boundary cells
- Patent number 11,941,338
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yi Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of forming power grid structures
- Patent number 11,935,833
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and associated method with envelope tracking...
- Patent number 11,870,397
- Issue date Jan 9, 2024
- Mediatek Inc.
- Shi-Wen Liu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Package structure and method of forming the same
- Patent number 11,855,057
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
- Patent number 11,824,032
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,784,106
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,749,594
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,705,408
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,616,037
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Demand forecasting method and demand forecasting apparatus
- Patent number 11,568,429
- Issue date Jan 31, 2023
- Wistron Corporation
- Chi Lin Tsai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,508,640
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of inserting dummy boundary cells for macro/IP and IC
- Patent number 11,443,094
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yi Hu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for implementing inter-process communications
- Patent number 11,431,820
- Issue date Aug 30, 2022
- Industrial Technology Research Institute
- Ping-Hsien Chi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages and methods of forming same
- Patent number 11,387,118
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and multiplexer circuit thereof
- Patent number 11,355,045
- Issue date Jun 7, 2022
- AU OPTRONICS CORPORATION
- Rong-Fu Lin
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,355,461
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,315,862
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and associated method for manufacturing the...
- Patent number 11,264,304
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power grid structures and method of forming the same
- Patent number 11,251,124
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hiranmay Biswas
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package
- Patent number 11,244,879
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Focalized microwave plasma reactor
- Patent number 11,183,369
- Issue date Nov 23, 2021
- Industrial Technology Research Institute
- Chih-Chen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with anti-acid layer and method for...
- Patent number 11,158,659
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yin-Shuo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,145,639
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization of semiconductor packages and structures resulting th...
- Patent number 11,127,644
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via rail solution for high power electromigration
- Patent number 11,088,092
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via rail solution for high power electromigration
- Patent number 11,063,005
- Issue date Jul 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kam-Tou Sio
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387457
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...
- Publication number 20240371774
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME
- Publication number 20240234321
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED CIRCUIT WITH DUMMY BOUNDARY CELLS
- Publication number 20240202420
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yi HU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240071888
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240047322
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages and Methods of Forming the Same
- Publication number 20240038646
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20230387061
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378021
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230352389
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230307385
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY CELLS PLACED ADJACENT FUNCTIONAL BLOCKS
- Publication number 20230289508
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yeh Yu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY MODULE AND ASSOCIATED METHOD WITH ENVELOPE TRACKING...
- Publication number 20230268887
- Publication date Aug 24, 2023
- MEDIATEK INC.
- Shi-Wen LIU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20230238360
- Publication date Jul 27, 2023
- MEDIATEK INC.
- Li-Huan CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE RENDERING SYSTEM, METHOD AND DEVICE BASED ON VIRTUAL MOBILE...
- Publication number 20230153137
- Publication date May 18, 2023
- Industrial Technology Research Institute
- Ping-Hsien Chi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOLDING SYSTEM FOR FABRICATING FIBER REINFORCEMENT POLYMER COMPOSIT...
- Publication number 20230115965
- Publication date Apr 13, 2023
- CORETECH SYSTEM CO., LTD.
- CHI-HUA YU
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230009553
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367315
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220367414
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- CHI-YANG YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH DUMMY BOUNDARY CELLS
- Publication number 20220358276
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yi HU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220352109
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming Same
- Publication number 20220301889
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...
- Publication number 20220302064
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220270994
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220270987
- Publication date Aug 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220246513
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Lin Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
End-to-End Deep Learning Approach to Predict Complex Stress and Str...
- Publication number 20220215233
- Publication date Jul 7, 2022
- Massachusetts Institute of Technology
- Markus J. Buehler
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
METHOD OF FORMING POWER GRID STRUCTURES
- Publication number 20220093513
- Publication date Mar 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hiranmay BISWAS
- G06 - COMPUTING CALCULATING COUNTING

Yu-Chiao Chi

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Integrated circuit with dummy boundary cells

Method of forming power grid structures

Semiconductor structure and manufacturing method thereof

Radio frequency module and associated method with envelope tracking...

Package structure and method of forming the same

Die corner removal for underfill crack suppression in semiconductor...

Semiconductor package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor package

Integrated fan-out package and manufacturing method thereof

Demand forecasting method and demand forecasting apparatus

Semiconductor package and manufacturing method thereof

Method of inserting dummy boundary cells for macro/IP and IC

Method and system for implementing inter-process communications

Semiconductor structure and manufacturing method thereof

Integrated circuit packages and methods of forming same

Display device and multiplexer circuit thereof

Integrated fan-out package and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor structure and associated method for manufacturing the...

Power grid structures and method of forming the same

Semiconductor package

Focalized microwave plasma reactor

Semiconductor device structure with anti-acid layer and method for...

Semiconductor package and manufacturing method thereof

Planarization of semiconductor packages and structures resulting th...

Via rail solution for high power electromigration

Via rail solution for high power electromigration

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

PACKAGE MODULE INCLUDING A RECESSED UPPER SURFACE AND METHODS OF FO...

CONDUCTIVE LINE STRUCTURES AND METHOD OF FORMING SAME

INTEGRATED CIRCUIT WITH DUMMY BOUNDARY CELLS

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND FORMING METHOD THEREOF

Semiconductor Device Packages and Methods of Forming the Same

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

DUMMY CELLS PLACED ADJACENT FUNCTIONAL BLOCKS

RADIO FREQUENCY MODULE AND ASSOCIATED METHOD WITH ENVELOPE TRACKING...

SEMICONDUCTOR PACKAGE ASSEMBLY AND ELECTRONIC DEVICE

REMOTE RENDERING SYSTEM, METHOD AND DEVICE BASED ON VIRTUAL MOBILE...

MOLDING SYSTEM FOR FABRICATING FIBER REINFORCEMENT POLYMER COMPOSIT...

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT WITH DUMMY BOUNDARY CELLS

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit Packages and Methods of Forming Same

DIE CORNER REMOVAL FOR UNDERFILL CRACK SUPPRESSION IN SEMICONDUCTOR...

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

End-to-End Deep Learning Approach to Predict Complex Stress and Str...

METHOD OF FORMING POWER GRID STRUCTURES