Yu D. Cong

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-step process for depositing copper seed layer in a via
- Patent number 6,893,541
- Issue date May 17, 2005
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for sputtering copper in a self ionized plasma
- Patent number 6,582,569
- Issue date Jun 24, 2003
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for igniting a plasma in a sputter reactor
- Patent number 6,413,383
- Issue date Jul 2, 2002
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for unreacted precursor conversion and effluent removal
- Patent number 6,402,806
- Issue date Jun 11, 2002
- Applied Materials, Inc.
- John Vincent Schmitt
- C30 - CRYSTAL GROWTH
Information Patent Grant
Plasma reactor and shields generating self-ionized plasma for sputt...
- Patent number 6,398,929
- Issue date Jun 4, 2002
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition hot-trap for unreacted precursor conversi...
- Patent number 6,099,649
- Issue date Aug 8, 2000
- Applied Materials, Inc.
- John Vincent Schmitt
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
Multi-step process for depositing copper seed layer in a via
- Publication number 20030124846
- Publication date Jul 3, 2003
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Multi-step process for depositing copper seed layer in a via

Process for sputtering copper in a self ionized plasma

Method for igniting a plasma in a sputter reactor

Method for unreacted precursor conversion and effluent removal

Plasma reactor and shields generating self-ionized plasma for sputt...

Chemical vapor deposition hot-trap for unreacted precursor conversi...

Patents Applicationslast 30 patents

Multi-step process for depositing copper seed layer in a via