Yu-Hong Du

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Hsinchu, TW

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Patents Applicationslast 30 patents

Information Patent Application
BONDING APPARATUS AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT...
- Publication number 20250062274
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jen-Hao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TOOL WITH MOVABLE COMPONENT FOR IMPROVED DIE PROTRUSION...
- Publication number 20250054786
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chih-Yuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS