Yu-Hsiang SUN

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Taichung City, TW

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Patents Applicationslast 30 patents

Information Patent Application
ENHANCED CHIP BOARD PACKAGE STRUCTURE
- Publication number 20150271915
- Publication date Sep 24, 2015
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Jun-Chung Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION LAYER STRUCTURE
- Publication number 20150140262
- Publication date May 21, 2015
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Yu-Hsiang SUN
- H01 - BASIC ELECTRIC ELEMENTS