Yubin LIN

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Jiangyin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Process of package-then-etch three-dimensional package structure el...
- Patent number 11,823,911
- Issue date Nov 21, 2023
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-before-etch three-dimensional package structure electricall...
- Patent number 11,217,459
- Issue date Jan 4, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of surface-mounting three-dimensional package structure ele...
- Patent number 10,763,128
- Issue date Sep 1, 2020
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO, LTD.
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...
- Publication number 20220084841
- Publication date Mar 17, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-BEFORE-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE ELECTRICALL...
- Publication number 20190385865
- Publication date Dec 19, 2019
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS OF SURFACE-MOUNTING THREE-DIMENSIONAL PACKAGE STRUCTURE ELE...
- Publication number 20190333780
- Publication date Oct 31, 2019
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY., LTD.
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS