Yueh-Ching CHANG

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Kaohsiung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,711,468
- Issue date Jul 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure with dense via array
- Patent number 9,041,204
- Issue date May 26, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han Tsai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20150214165
- Publication date Jul 30, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD STRUCTURE WITH DENSE VIA ARRAY
- Publication number 20130256893
- Publication date Oct 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Han TSAI
- H01 - BASIC ELECTRIC ELEMENTS