Yueh-Wei Lin

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package dielectric susbtrate including a trench
- Patent number 12,211,782
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 12,159,853
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air channel formation in packaging process
- Patent number 11,984,410
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package dielectric substrate including a trench
- Patent number 11,961,796
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air channel formation in packaging process
- Patent number 11,682,637
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including IPD and method of forming the same
- Patent number 11,587,900
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating transistor with short gate length by two-step...
- Patent number 11,367,615
- Issue date Jun 21, 2022
- National Chiao Tung University
- Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making interconnect of group III-V semiconductor device...
- Patent number 11,322,398
- Issue date May 3, 2022
- National Chiao Tung University
- Edward-Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing integrated fan-out packages without seal rings
- Patent number 11,177,142
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air channel formation in packaging process
- Patent number 11,088,094
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,867,928
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 10,756,037
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-electrical-mechanical chips and...
- Patent number 10,720,409
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with thermal-electrical-mechanical chips and...
- Patent number 10,672,741
- Issue date Jun 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gel electrolyte and precursor composition thereof and battery
- Patent number 10,553,900
- Issue date Feb 4, 2020
- Industrial Technology Research Institute
- Yueh-Wei Lin
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 10,535,696
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna for electronic device
- Patent number 9,905,911
- Issue date Feb 27, 2018
- Hon Hai Precision Industry Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-band antenna
- Patent number 9,905,910
- Issue date Feb 27, 2018
- Hon Hai Precision Industry Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion exchange membrane
- Patent number 9,745,433
- Issue date Aug 29, 2017
- Industrial Technology Research Institute
- Cheng-Hsiu Tsai
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,653,508
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and multi-band antenna
- Patent number 9,577,332
- Issue date Feb 21, 2017
- Hon Hai Precision Industry Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electrode material of lithium secondary battery and lithi...
- Patent number 9,496,547
- Issue date Nov 15, 2016
- Industrial Technology Research Institute
- Li-Duan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anode material with unsaturated compounds bonded to carbon-containi...
- Patent number 9,376,412
- Issue date Jun 28, 2016
- Industrial Technology Research Institute
- Li-Duan Tsai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Pad structure exposed in an opening through multiple dielectric lay...
- Patent number 9,362,329
- Issue date Jun 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced GaN transistor and the forming method thereof
- Patent number 9,240,474
- Issue date Jan 19, 2016
- National Chiao Tung University
- Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cable interface connection structure
- Patent number 9,236,684
- Issue date Jan 12, 2016
- CyberTAN Technology, Inc.
- Yueh-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad structures formed in double openings in dielectric layers
- Patent number 9,184,207
- Issue date Nov 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gel polymer electrolyte and lithium polymer battery
- Patent number 9,166,254
- Issue date Oct 20, 2015
- Industrial Technology Research Institute
- Li-Duan Tsai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Non-aqueous electrolyte and lithium secondary battery including the...
- Patent number 9,136,559
- Issue date Sep 15, 2015
- Industrial Technology Research Institute
- Li-Duan Tsai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hybrid materials using ionic particles
- Patent number 9,136,516
- Issue date Sep 15, 2015
- Industrial Technology Research Institute
- Jason Fang
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STACK, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING PACKAGE...
- Publication number 20240347669
- Publication date Oct 17, 2024
- EPISTAR CORPORATION
- Feng-Wen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIMOLECULAR BLOCK POLYMER AND ELECTROLYTE AND ELECTRICAL DOUBLE LAY...
- Publication number 20240209151
- Publication date Jun 27, 2024
- Industrial Technology Research Institute
- Yueh-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055311
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230386989
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20230333317
- Publication date Oct 19, 2023
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Chung-Hsin FU
- G02 - OPTICS
Information Patent Application
Air Channel Formation in Packaging Process
- Publication number 20230275040
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20230154881
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
- Publication number 20230068082
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yueh-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
- Publication number 20220278067
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua-Wei Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Channel Formation in Packaging Process
- Publication number 20210366845
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING TRANSISTOR WITH SHORT GATE LENGTH BY TWO-STEP...
- Publication number 20210151316
- Publication date May 20, 2021
- National Chiao Tung University
- Yi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MAKING INTERCONNECT OF GROUP III-V SEMICONDUCTOR DEVICE...
- Publication number 20210074582
- Publication date Mar 11, 2021
- NATIONAL CHIAO-TUNG UNIVERSITY
- Edward-Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Channel Formation in Packaging Process
- Publication number 20200381373
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200203499
- Publication date Jun 25, 2020
- NATIONAL CHIAO-TUNG UNIVERSITY
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE FOR ENHANCED BONDABILITY
- Publication number 20200126920
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Ru-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200043855
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Chung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20190355687
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20190164783
- Publication date May 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...
- Publication number 20180374824
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180175185
- Publication date Jun 21, 2018
- NATIONAL CHIAO-TUNG UNIVERSITY
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL-ELECTRICAL-MECHANICAL CHIPS AND...
- Publication number 20180053746
- Publication date Feb 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GEL ELECTROLYTE AND PRECURSOR COMPOSITION THEREOF AND BATTERY
- Publication number 20180019497
- Publication date Jan 18, 2018
- Industrial Technology Research Institute
- Yueh-Wei LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PAD STRUCTURE EXPOSED IN AN OPENING THROUGH MULTIPLE DIELECTRIC LAY...
- Publication number 20170250215
- Publication date Aug 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION EXCHANGE MEMBRANE
- Publication number 20170183464
- Publication date Jun 29, 2017
- Industrial Technology Research Institute
- Cheng-Hsiu TSAI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
ANTENNA FOR ELECTRONIC DEVICE
- Publication number 20170062930
- Publication date Mar 2, 2017
- HON HAI PRECISION INDUSTRY CO., LTD.
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MULTI-BAND ANTENNA
- Publication number 20170047950
- Publication date Feb 16, 2017
- HON HAI PRECISION INDUSTRY CO., LTD.
- WEI-YU CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND MULTI-BAND ANTENNA
- Publication number 20160352014
- Publication date Dec 1, 2016
- HON HAI PRECISION INDUSTRY CO., LTD.
- WEI-YU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Structure Exposed in an Opening Through Multiple Dielectric Lay...
- Publication number 20160260764
- Publication date Sep 8, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20160133738
- Publication date May 12, 2016
- NATIONAL CHIAO-TUNG UNIVERSITY
- Edward Yi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE DRIVING CIRCUIT AND METHOD THEREOF
- Publication number 20160128163
- Publication date May 5, 2016
- KINPO ELECTRONICS, INC.
- Chun-Chieh Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yueh-Wei Lin

Person

Patents Grantslast 30 patents

Semiconductor package dielectric susbtrate including a trench

Package structure including IPD and method of forming the same

Air channel formation in packaging process

Semiconductor package dielectric substrate including a trench

Air channel formation in packaging process

Package structure including IPD and method of forming the same

Method of fabricating transistor with short gate length by two-step...

Process for making interconnect of group III-V semiconductor device...

Method for dicing integrated fan-out packages without seal rings

Air channel formation in packaging process

Semiconductor device and manufacturing method thereof

Package structure and fabricating method thereof

Semiconductor packages with thermal-electrical-mechanical chips and...

Semiconductor packages with thermal-electrical-mechanical chips and...

Gel electrolyte and precursor composition thereof and battery

Pad structure exposed in an opening through multiple dielectric lay...

Antenna for electronic device

Electronic device and multi-band antenna

Ion exchange membrane

Pad structure exposed in an opening through multiple dielectric lay...

Electronic device and multi-band antenna

Composite electrode material of lithium secondary battery and lithi...

Anode material with unsaturated compounds bonded to carbon-containi...

Pad structure exposed in an opening through multiple dielectric lay...

Enhanced GaN transistor and the forming method thereof

Cable interface connection structure

Pad structures formed in double openings in dielectric layers

Gel polymer electrolyte and lithium polymer battery

Non-aqueous electrolyte and lithium secondary battery including the...

Hybrid materials using ionic particles

Patents Applicationslast 30 patents

SEMICONDUCTOR STACK, LIGHT-EMITTING ELEMENT, LIGHT-EMITTING PACKAGE...

BIMOLECULAR BLOCK POLYMER AND ELECTROLYTE AND ELECTRICAL DOUBLE LAY...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

OPTICAL MODULE

Air Channel Formation in Packaging Process

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH

PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME

Air Channel Formation in Packaging Process

METHOD OF FABRICATING TRANSISTOR WITH SHORT GATE LENGTH BY TWO-STEP...

PROCESS FOR MAKING INTERCONNECT OF GROUP III-V SEMICONDUCTOR DEVICE...

Air Channel Formation in Packaging Process

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PAD STRUCTURE FOR ENHANCED BONDABILITY

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME

Semiconductor Packages with Thermal-Electrical-Mechanical Chips and...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES WITH THERMAL-ELECTRICAL-MECHANICAL CHIPS AND...

GEL ELECTROLYTE AND PRECURSOR COMPOSITION THEREOF AND BATTERY

PAD STRUCTURE EXPOSED IN AN OPENING THROUGH MULTIPLE DIELECTRIC LAY...

ION EXCHANGE MEMBRANE

ANTENNA FOR ELECTRONIC DEVICE

ELECTRONIC DEVICE AND MULTI-BAND ANTENNA

ELECTRONIC DEVICE AND MULTI-BAND ANTENNA

Pad Structure Exposed in an Opening Through Multiple Dielectric Lay...

HIGH ELECTRON MOBILITY TRANSISTOR AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING DEVICE DRIVING CIRCUIT AND METHOD THEREOF