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Yuen-Kui (Jerry) Wong
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Fremont, CA, US
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last 30 patents
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Patent Grant
Plasma reactor with heated source of a polymer-hardening precursor...
Patent number
6,440,866
Issue date
Aug 27, 2002
Applied Materials, Inc.
Kenneth S. Collins
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Plasma reactor with heated source of a polymer-hardening precursor...
Patent number
6,218,312
Issue date
Apr 17, 2001
Applied Materials Inc.
Kenneth S. Collins
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Dry-etching of indium and tin oxides
Patent number
6,036,876
Issue date
Mar 14, 2000
Applied Komatsu Technology, Inc.
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Plasma reactor with heated source of a polymer-hardening precursor...
Patent number
6,036,877
Issue date
Mar 14, 2000
Applied Materials, Inc.
Kenneth S. Collins
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Tapered dielectric etch in semiconductor devices
Patent number
5,895,937
Issue date
Apr 20, 1999
Applied Komatsu Technology, Inc.
Yuh-Jia (Jim) Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Tapered profile etching method
Patent number
5,893,757
Issue date
Apr 13, 1999
Applied Komatsu Technology, Inc.
Yuh-Jia Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dry-etch of indium and tin oxides with C2H5I gas
Patent number
5,843,277
Issue date
Dec 1, 1998
Applied Komatsu Technology, Inc.
Haruhiro Harry Goto
G02 - OPTICS
Information
Patent Grant
Tapered dielectric etch in semiconductor devices
Patent number
5,728,608
Issue date
Mar 17, 1998
Applied Komatsu Technology, Inc.
Yuh-Jia (Jim) Su
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High-rate dry-etch of indium and tin oxides by hydrogen and halogen...
Patent number
5,607,602
Issue date
Mar 4, 1997
Applied Komatsu Technology, Inc.
Yuh-Jia Su
H01 - BASIC ELECTRIC ELEMENTS