Yuh-Jier Mii

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Transistorless memory cell
- Patent number 11,990,169
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Katherine Chiang
- G11 - INFORMATION STORAGE
Information Patent Grant
Transistorless memory cell
- Patent number 11,094,361
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Katherine Chiang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 10,361,152
- Issue date Jul 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of forming a via
- Patent number 9,496,217
- Issue date Nov 15, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for bonding 3D semiconductor device
- Patent number 9,123,553
- Issue date Sep 1, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 8,999,839
- Issue date Apr 7, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device including barrier layers fo...
- Patent number 8,975,749
- Issue date Mar 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving gate contact
- Patent number 8,680,597
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layers for copper interconnect
- Patent number 8,653,664
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving gate contact
- Patent number 8,524,570
- Issue date Sep 3, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having an air-gap region and a method of ma...
- Patent number 8,456,009
- Issue date Jun 4, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partial air gap formation for providing interconnect isolation in i...
- Patent number 8,304,906
- Issue date Nov 6, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for SRAM bit cell with low standby current, l...
- Patent number 8,294,212
- Issue date Oct 23, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Contact implement structure for high density design
- Patent number 8,217,469
- Issue date Jul 10, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accurate capacitance measurement for ultra large scale integrated c...
- Patent number 8,115,500
- Issue date Feb 14, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for bonding 3D semiconductor devices
- Patent number 8,048,717
- Issue date Nov 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Accurate capacitance measurement for ultra large scale integrated c...
- Patent number 7,880,494
- Issue date Feb 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Grant
Read-preferred SRAM cell design
- Patent number 7,826,252
- Issue date Nov 2, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Accurate capacitance measurement for ultra large scale integrated c...
- Patent number 7,772,868
- Issue date Aug 10, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Grant
Read-preferred SRAM cell design
- Patent number 7,436,696
- Issue date Oct 14, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit and method for an SRAM with reduced power consumption
- Patent number 7,359,272
- Issue date Apr 15, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Process design for wafer edge in VLSI
- Patent number 6,114,747
- Issue date Sep 5, 2000
- Taiwan Semiconductor Manufacturing Company
- Zin-Chein Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process design for wafer edge in vlsi
- Patent number 5,966,628
- Issue date Oct 12, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zin-Chein Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test site and a method of monitoring via etch depths for semiconduc...
- Patent number 5,900,644
- Issue date May 4, 1999
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Lan Ying
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test site and a method of monitoring via etch depths for semiconduc...
- Patent number 5,702,956
- Issue date Dec 30, 1997
- Taiwan Semiconductor Manufactoring, Company Ltd
- Shu-Lan Ying
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TRANSISTORLESS MEMORY CELL
- Publication number 20240257853
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Katherine Chiang
- G11 - INFORMATION STORAGE
Information Patent Application
TRANSISTORLESS MEMORY CELL
- Publication number 20210366529
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Katherine Chiang
- G11 - INFORMATION STORAGE
Information Patent Application
TRANSISTORLESS MEMORY CELL
- Publication number 20200075074
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Katherine Chiang
- G11 - INFORMATION STORAGE
Information Patent Application
Controlling Gate Formation for High Density Cell Layout
- Publication number 20150318367
- Publication date Nov 5, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...
- Publication number 20150200160
- Publication date Jul 16, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYERS FO...
- Publication number 20140127898
- Publication date May 8, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Improving Gate Contact
- Publication number 20130328134
- Publication date Dec 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...
- Publication number 20130252144
- Publication date Sep 26, 2013
- TAIWAN SEMICONDUCTOR MANUFACTURING COMAPNY, LTD.
- Shu-Hui SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVING GATE CONTACT
- Publication number 20120074498
- Publication date Mar 29, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Bonding 3D Semiconductor Device
- Publication number 20120028441
- Publication date Feb 2, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTIAL AIR GAP FORMATION FOR PROVIDING INTERCONNECT ISOLATION IN I...
- Publication number 20110291281
- Publication date Dec 1, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Lin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Accurate Capacitance Measurement for Ultra Large Scale Integrated C...
- Publication number 20110168995
- Publication date Jul 14, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Application
NOVEL CONTACT IMPLEMENT STRUCTURE FOR HIGH DENSITY DESIGN
- Publication number 20110140203
- Publication date Jun 16, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chin Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for SRAM Bit Cell with Low Standby Current, L...
- Publication number 20110068400
- Publication date Mar 24, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Application
BARRIER LAYERS FOR COPPER INTERCONNECT
- Publication number 20110006429
- Publication date Jan 13, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nai-Wei LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS OF FORMING A VIA
- Publication number 20100308469
- Publication date Dec 9, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Accurate Capacitance Measurement for Ultra Large Scale Integrated C...
- Publication number 20100156453
- Publication date Jun 24, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Application
Accurate Capacitance Measurement for Ultra Large Scale Integrated C...
- Publication number 20090002012
- Publication date Jan 1, 2009
- Yih-Yuh Doong
- G01 - MEASURING TESTING
Information Patent Application
Method and system for bonding 3D semiconductor devices
- Publication number 20080268573
- Publication date Oct 30, 2008
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation process of interconnect structures with air-gaps and side...
- Publication number 20080185722
- Publication date Aug 7, 2008
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT FOR AN SRAM WITH REDUCED POWER CONSUMPTION
- Publication number 20080043561
- Publication date Feb 21, 2008
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Application
Read-preferred SRAM cell design
- Publication number 20070253239
- Publication date Nov 1, 2007
- Ping-Wei Wang
- G11 - INFORMATION STORAGE
Information Patent Application
Bond pad structure for integrated circuit chip
- Publication number 20060091566
- Publication date May 4, 2006
- Chin-Tien Yang
- H01 - BASIC ELECTRIC ELEMENTS

Yuh-Jier Mii

Person

Patents Grantslast 30 patents

Transistorless memory cell

Transistorless memory cell

Semiconductor structure having an air-gap region and a method of ma...

Method and apparatus of forming a via

Method and system for bonding 3D semiconductor device

Semiconductor structure having an air-gap region and a method of ma...

Method of making a semiconductor device including barrier layers fo...

Method and apparatus for improving gate contact

Barrier layers for copper interconnect

Method and apparatus for improving gate contact

Semiconductor structure having an air-gap region and a method of ma...

Partial air gap formation for providing interconnect isolation in i...

Methods and apparatus for SRAM bit cell with low standby current, l...

Contact implement structure for high density design

Accurate capacitance measurement for ultra large scale integrated c...

Method and system for bonding 3D semiconductor devices

Accurate capacitance measurement for ultra large scale integrated c...

Read-preferred SRAM cell design

Accurate capacitance measurement for ultra large scale integrated c...

Read-preferred SRAM cell design

Circuit and method for an SRAM with reduced power consumption

Process design for wafer edge in VLSI

Process design for wafer edge in vlsi

Test site and a method of monitoring via etch depths for semiconduc...

Test site and a method of monitoring via etch depths for semiconduc...

Patents Applicationslast 30 patents

TRANSISTORLESS MEMORY CELL

TRANSISTORLESS MEMORY CELL

TRANSISTORLESS MEMORY CELL

Controlling Gate Formation for High Density Cell Layout

SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...

METHOD OF MAKING A SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYERS FO...

Method and Apparatus for Improving Gate Contact

SEMICONDUCTOR STRUCTURE HAVING AN AIR-GAP REGION AND A METHOD OF MA...

METHOD AND APPARATUS FOR IMPROVING GATE CONTACT

Method and System for Bonding 3D Semiconductor Device

PARTIAL AIR GAP FORMATION FOR PROVIDING INTERCONNECT ISOLATION IN I...

Accurate Capacitance Measurement for Ultra Large Scale Integrated C...

NOVEL CONTACT IMPLEMENT STRUCTURE FOR HIGH DENSITY DESIGN

Methods and Apparatus for SRAM Bit Cell with Low Standby Current, L...

BARRIER LAYERS FOR COPPER INTERCONNECT

METHOD AND APPARATUS OF FORMING A VIA

Accurate Capacitance Measurement for Ultra Large Scale Integrated C...

Accurate Capacitance Measurement for Ultra Large Scale Integrated C...

Method and system for bonding 3D semiconductor devices

Formation process of interconnect structures with air-gaps and side...

CIRCUIT FOR AN SRAM WITH REDUCED POWER CONSUMPTION

Read-preferred SRAM cell design

Bond pad structure for integrated circuit chip