Yuichi ASANO

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with heat spreader
- Patent number 8,614,119
- Issue date Dec 24, 2013
- Fujitsu Semiconductor Limited
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat spreader
- Patent number 8,614,505
- Issue date Dec 24, 2013
- Fujitsu Semiconductor Limited
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat spreader
- Patent number 8,564,108
- Issue date Oct 22, 2013
- Fujtsu Semiconductor Limited
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with heat spreader
- Patent number 8,278,743
- Issue date Oct 2, 2012
- Fujitsu Semiconductor Limited
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor using a rigid substrate
- Patent number 7,781,259
- Issue date Aug 24, 2010
- Fujitsu Semiconductor Limited
- Youhei Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method for manufacturing a semiconductor pac...
- Patent number 7,646,089
- Issue date Jan 12, 2010
- Fujitsu Limited
- Futoshi Fukaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a semiconductor device using a rigid substr...
- Patent number 7,122,402
- Issue date Oct 17, 2006
- Fujitsu Limited
- Youhei Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing a semiconductor device
- Patent number 6,222,258
- Issue date Apr 24, 2001
- Fujitsu Limited
- Yuichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and heat sink used therein
- Patent number 5,929,513
- Issue date Jul 27, 1999
- Fujitsu Limited
- Yuichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved heat dissipation efficiency
- Patent number 5,834,831
- Issue date Nov 10, 1998
- Fujitsu Limited
- Akihiro Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing a semiconductor device
- Patent number 5,804,469
- Issue date Sep 8, 1998
- Fujitsu Limited
- Yuichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor device by which deformation of...
- Patent number 5,693,571
- Issue date Dec 2, 1997
- Fujitsu Limited
- Hitoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting construction and method of a semiconductor device by which...
- Patent number 5,557,145
- Issue date Sep 17, 1996
- Fujitsu Limited
- Hitoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20120322209
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20120319264
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20120319275
- Publication date Dec 20, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HEAT SPREADER
- Publication number 20110316131
- Publication date Dec 29, 2011
- FUJITSU SEMICONDUCTOR LIMITED
- Tomoyuki Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PAC...
- Publication number 20090283897
- Publication date Nov 19, 2009
- Fujitsu Limited
- Futoshi FUKAYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20070010046
- Publication date Jan 11, 2007
- FUJITSU LIMITED
- Youhei Nagahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device using a rigid substrate
- Publication number 20050070051
- Publication date Mar 31, 2005
- FUJITSU LIMITED
- Youhei Nagahama
- H01 - BASIC ELECTRIC ELEMENTS

Yuichi ASANO

Person

Patents Grantslast 30 patents

Semiconductor device with heat spreader

Semiconductor device with heat spreader

Semiconductor device with heat spreader

Semiconductor device with heat spreader

Method of manufacturing a semiconductor using a rigid substrate

Semiconductor package, method for manufacturing a semiconductor pac...

Method of manufacturing a semiconductor device using a rigid substr...

Semiconductor device and method for producing a semiconductor device

Semiconductor device and heat sink used therein

Semiconductor device with improved heat dissipation efficiency

Semiconductor device and method for producing a semiconductor device

Method for mounting a semiconductor device by which deformation of...

Mounting construction and method of a semiconductor device by which...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR DEVICE WITH HEAT SPREADER

SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING A SEMICONDUCTOR PAC...

Semiconductor device and method for manufacturing the same

Method of manufacturing a semiconductor device using a rigid substrate