Claims
- 1. A mounting method of a semiconductor device on a mounting board, said semiconductor device having a plurality of outer leads extending from sides thereof, said semiconductor device being attached on a mounting member having a plurality of connecting leads extending therefrom, said mounting method comprising the steps of:
- a) mounting said mounting member onto said mounting board by using said connecting leads; and
- b) attaching said semiconductor device to said mounting member mounted on said mounting board so that said outer leads make a contact with said connecting leads, wherein at least one of the outer leads and the connecting leads are elastically deformed in a direction perpendicular to a direction of insertion or mounting such that the semiconductor device is secured to the mounting member by elastic force.
- 2. The mounting method as claimed in claim 1, further comprising the step of:
- c) fixing said semiconductor device to said mounting member by using adhesive after the step b).
Priority Claims (1)
Number |
Date |
Country |
Kind |
6-041497 |
Mar 1994 |
JPX |
|
Parent Case Info
This is a Divisional of application Ser. No. 08/401,441 filed Mar. 9, 1995, now U.S. Pat. No. 5,557,145.
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
55-134998 |
Oct 1980 |
JPX |
4-297058 |
Oct 1992 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
401441 |
Mar 1995 |
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