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Yuichi Nakayoshi
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Kitamorokata-gun, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Apparatus for polishing a semiconductor wafer
Patent number
6,517,667
Issue date
Feb 11, 2003
Komatsu Electronic Metals Co., Ltd.
Yuichi Nakayoshi
B24 - GRINDING POLISHING
Information
Patent Grant
Method for fabricating an SOI substrate
Patent number
6,090,688
Issue date
Jul 18, 2000
Komatsu Electronic Metals Co., Ltd.
Tadashi Ogawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
SOI substrate and a method for fabricating the same
Patent number
6,004,860
Issue date
Dec 21, 1999
Komatsu Electronic Metals Co., Ltd.
Tadashi Ogawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Template used for polishing a semiconductor wafer
Patent number
6,001,007
Issue date
Dec 14, 1999
Komatsu Electronic Metals Co., Ltd.
Masahiko Maeda
B24 - GRINDING POLISHING
Information
Patent Grant
Method of polishing a semiconductor wafer
Patent number
5,893,755
Issue date
Apr 13, 1999
Komatsu Electronic Metals Co., Ltd.
Yuichi Nakayoshi
B24 - GRINDING POLISHING
Information
Patent Grant
Process for fabricating SOI substrate
Patent number
5,863,829
Issue date
Jan 26, 1999
Komatsu Electronic Metals Co., Ltd.
Yuichi Nakayoshi
H01 - BASIC ELECTRIC ELEMENTS