Yuji Araki

Person

Fujisawa-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Gas solution supply device
- Patent number 12,263,452
- Issue date Apr 1, 2025
- Ebara Corporation
- Suguru Ozawa
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 12,191,178
- Issue date Jan 7, 2025
- Ebara Corporation
- Jumpei Fujikata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information processing method and information processing device
- Patent number 11,848,832
- Issue date Dec 19, 2023
- NEC Corporation
- Yuji Araki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Gas solution manufacturing device
- Patent number 11,648,515
- Issue date May 16, 2023
- Ebara Corporation
- Suguru Ozawa
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Gas-dissolved liquid manufacturing device
- Patent number 11,584,669
- Issue date Feb 21, 2023
- Ebara Corporation
- Yoichi Nakagawa
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Gas dissolution supply apparatus and gas dissolution supply method
- Patent number 11,352,274
- Issue date Jun 7, 2022
- Ebara Corporation
- Suguru Ozawa
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Semiconductor manufacturing apparatus, failure prediction method fo...
- Patent number 11,315,812
- Issue date Apr 26, 2022
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus, plating method, and recording medium
- Patent number 10,633,757
- Issue date Apr 28, 2020
- Ebara Corporation
- Masashi Shimoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of adjusting plating apparatus, and measuring apparatus
- Patent number 10,487,415
- Issue date Nov 26, 2019
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of adjusting plating apparatus, and measuring apparatus
- Patent number 10,100,424
- Issue date Oct 16, 2018
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,047,454
- Issue date Aug 14, 2018
- Ebara Corporation
- Yuji Araki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Sn alloy plating apparatus and Sn alloy plating method
- Patent number 9,816,197
- Issue date Nov 14, 2017
- Ebara Corporation
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition and resin molded article
- Patent number 9,695,314
- Issue date Jul 4, 2017
- Fuji Xerox Co., Ltd.
- Akira Imada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Sn alloy plating apparatus and Sn alloy plating method
- Patent number 9,551,084
- Issue date Jan 24, 2017
- Ebara Corporation
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Resin composition and resin molded article
- Patent number 9,475,936
- Issue date Oct 25, 2016
- Fuji Xerox Co., Ltd.
- Yuji Araki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electroplating method and electroplating apparatus for through-hole
- Patent number 9,297,088
- Issue date Mar 29, 2016
- Ebara Corporation
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 8,864,965
- Issue date Oct 21, 2014
- Ebara Corporation
- Jumpei Fujikata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact
- Patent number D669439
- Issue date Oct 23, 2012
- Ebara Corporation
- Jumpei Fujikata
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Sealing ring
- Patent number D659175
- Issue date May 8, 2012
- Ebara Corporation
- Jumpei Fujikata
- D15 - Machines not elsewhere specified
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D651178
- Issue date Dec 27, 2011
- Ebara Corporation
- Jumpei Fujikata
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Sealing ring
- Patent number D649986
- Issue date Dec 6, 2011
- Ebara Corporation
- Jumpei Fujikata
- D15 - Machines not elsewhere specified
Information Patent Grant
Conducting belt for use with anode holder and anode holder
- Patent number 7,897,024
- Issue date Mar 1, 2011
- Ebara Corporation
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D556692
- Issue date Dec 4, 2007
- Ebara Corporation
- Mitsutoshi Yahagi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical contact for use in a plating apparatus
- Patent number D555595
- Issue date Nov 20, 2007
- Ebara Corporation
- Mitsutoshi Yahagi
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Coating, modification and etching of substrate surface with particl...
- Patent number 6,921,722
- Issue date Jul 26, 2005
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Trap apparatus
- Patent number 6,488,774
- Issue date Dec 3, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High energy sputtering method for forming interconnects
- Patent number 6,458,694
- Issue date Oct 1, 2002
- Ebara Corporation
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus and method for processing substrate
- Patent number 6,387,182
- Issue date May 14, 2002
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid feed vaporization system and gas injection device
- Patent number 6,282,368
- Issue date Aug 28, 2001
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid feed vaporization system and gas injection device
- Patent number 6,269,221
- Issue date Jul 31, 2001
- Ebara Corporation
- Kuniaki Horie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
GAS SOLUTION SUPPLY APPARATUS
- Publication number 20240075410
- Publication date Mar 7, 2024
- EBARA CORPORATION
- Suguru OZAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING DEVICE
- Publication number 20240064071
- Publication date Feb 22, 2024
- NEC Corporation
- Yuji Araki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING DEVICE
- Publication number 20220417116
- Publication date Dec 29, 2022
- NEC Corporation
- Yuji Araki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20220181180
- Publication date Jun 9, 2022
- EBARA CORPORATION
- Jumpei FUJIKATA
- G05 - CONTROLLING REGULATING
Information Patent Application
GAS SOLUTION SUPPLY DEVICE
- Publication number 20220105478
- Publication date Apr 7, 2022
- EBARA CORPORATION
- Suguru OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SOLUTION MANUFACTURING DEVICE
- Publication number 20210245115
- Publication date Aug 12, 2021
- EBARA CORPORATION
- Suguru OZAWA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
GAS-DISSOLVED LIQUID MANUFACTURING DEVICE
- Publication number 20210017056
- Publication date Jan 21, 2021
- EBARA CORPORATION
- Yoichi NAKAGAWA
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
GAS DISSOLUTION SUPPLY APPARATUS AND GAS DISSOLUTION SUPPLY METHOD
- Publication number 20200385295
- Publication date Dec 10, 2020
- EBARA CORPORATION
- Suguru OZAWA
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Application
PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM
- Publication number 20190309436
- Publication date Oct 10, 2019
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS
- Publication number 20180371636
- Publication date Dec 27, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...
- Publication number 20180294174
- Publication date Oct 11, 2018
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHOD FOR SUPPLYING PLATING SOLUTION TO PLATING TANK...
- Publication number 20170226656
- Publication date Aug 10, 2017
- EBARA CORPORATION
- Chunhui DOU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS
- Publication number 20160369422
- Publication date Dec 22, 2016
- EBARA CORPORATION
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN COMPOSITION AND RESIN MOLDED ARTICLE
- Publication number 20160060456
- Publication date Mar 3, 2016
- FUJI XEROX CO., LTD
- Akira IMADA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND RESIN MOLDED ARTICLE
- Publication number 20160060455
- Publication date Mar 3, 2016
- FUJI XEROX CO., LTD
- Yuji ARAKI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20150354084
- Publication date Dec 10, 2015
- EBARA CORPORATION
- Yuji ARAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD
- Publication number 20150136609
- Publication date May 21, 2015
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD
- Publication number 20140332393
- Publication date Nov 13, 2014
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Sn ALLOY PLATING APPARATUS AND METHOD
- Publication number 20140166492
- Publication date Jun 19, 2014
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS FOR THROUGH-HOLE
- Publication number 20140042032
- Publication date Feb 13, 2014
- EBARA CORPORATION
- Masashi SHIMOYAMA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING SOLUTION MANAGEMENT METHOD
- Publication number 20130306483
- Publication date Nov 21, 2013
- EBARA CORPORATION
- Yuji ARAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING METHOD
- Publication number 20120160696
- Publication date Jun 28, 2012
- Yuji ARAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE HOLDER AND PLATING APPARATUS
- Publication number 20120043200
- Publication date Feb 23, 2012
- Jumpei FUJIKATA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conducting belt for use with anode holder and anode holder
- Publication number 20090050473
- Publication date Feb 26, 2009
- Mitsutoshi Yahagi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for forming interconnect
- Publication number 20020009883
- Publication date Jan 24, 2002
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Coating, modification and etching of substrate surface with particl...
- Publication number 20010055649
- Publication date Dec 27, 2001
- Naoaki Ogure
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Gas solution supply device

Semiconductor manufacturing apparatus, failure prediction method fo...

Information processing method and information processing device

Gas solution manufacturing device

Gas-dissolved liquid manufacturing device

Gas dissolution supply apparatus and gas dissolution supply method

Semiconductor manufacturing apparatus, failure prediction method fo...

Plating apparatus, plating method, and recording medium

Method of adjusting plating apparatus, and measuring apparatus

Method of adjusting plating apparatus, and measuring apparatus

Plating apparatus and plating method

Sn alloy plating apparatus and Sn alloy plating method

Resin composition and resin molded article

Sn alloy plating apparatus and Sn alloy plating method

Resin composition and resin molded article

Electroplating method and electroplating apparatus for through-hole

Substrate holder and plating apparatus

Electrical contact

Sealing ring

Electrical contact for use in a plating apparatus

Sealing ring

Conducting belt for use with anode holder and anode holder

Electrical contact for use in a plating apparatus

Electrical contact for use in a plating apparatus

Coating, modification and etching of substrate surface with particl...

Trap apparatus

High energy sputtering method for forming interconnects

Apparatus and method for processing substrate

Liquid feed vaporization system and gas injection device

Liquid feed vaporization system and gas injection device

Patents Applicationslast 30 patents

GAS SOLUTION SUPPLY APPARATUS

INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING DEVICE

INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING DEVICE

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

GAS SOLUTION SUPPLY DEVICE

GAS SOLUTION MANUFACTURING DEVICE

GAS-DISSOLVED LIQUID MANUFACTURING DEVICE

GAS DISSOLUTION SUPPLY APPARATUS AND GAS DISSOLUTION SUPPLY METHOD

PLATING APPARATUS, PLATING METHOD, AND RECORDING MEDIUM

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS, FAILURE PREDICTION METHOD FO...

APPARATUS AND METHOD FOR SUPPLYING PLATING SOLUTION TO PLATING TANK...

METHOD OF ADJUSTING PLATING APPARATUS, AND MEASURING APPARATUS

RESIN COMPOSITION AND RESIN MOLDED ARTICLE

RESIN COMPOSITION AND RESIN MOLDED ARTICLE

PLATING APPARATUS AND PLATING METHOD

Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD

Sn ALLOY PLATING APPARATUS AND Sn ALLOY PLATING METHOD

Sn ALLOY PLATING APPARATUS AND METHOD

ELECTROPLATING METHOD AND ELECTROPLATING APPARATUS FOR THROUGH-HOLE

PLATING APPARATUS AND PLATING SOLUTION MANAGEMENT METHOD

ELECTROPLATING METHOD

SUBSTRATE HOLDER AND PLATING APPARATUS

Conducting belt for use with anode holder and anode holder

Method and apparatus for forming interconnect

Coating, modification and etching of substrate surface with particl...