Yuji Hara

Person

Akishima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for multilayer wiring connections and bonding pad adhesion...
- Patent number 6,573,170
- Issue date Jun 3, 2003
- Hitachi, Ltd.
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type-semiconductor device having a conductor film
- Patent number 5,583,381
- Issue date Dec 10, 1996
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,552,639
- Issue date Sep 3, 1996
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,539,257
- Issue date Jul 23, 1996
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,468,998
- Issue date Nov 21, 1995
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,371,411
- Issue date Dec 6, 1994
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,229,642
- Issue date Jul 20, 1993
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 5,023,699
- Issue date Jun 11, 1991
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded type semiconductor device having a conductor film
- Patent number 4,625,227
- Issue date Nov 25, 1986
- Hitachi, Ltd.
- Yuji Hara
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor integrated circuit device and process for manufacturi...
- Publication number 20010019180
- Publication date Sep 6, 2001
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor integrated circuit device and process for manufacturi...
- Publication number 20010005624
- Publication date Jun 28, 2001
- Takashi Aoyagi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Process for multilayer wiring connections and bonding pad adhesion...

Resin molded type-semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Resin molded type semiconductor device having a conductor film

Patents Applicationslast 30 patents

Semiconductor integrated circuit device and process for manufacturi...

Semiconductor integrated circuit device and process for manufacturi...