Yuji Hotta

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electroluminescence device, planar light source and display using t...
- Patent number 7,722,965
- Issue date May 25, 2010
- Nitto Denko Corporation
- Noriyuki Juni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light pipe for direct-type backlight and direct-type backlight
- Patent number 7,559,681
- Issue date Jul 14, 2009
- Nitto Denko Corporation
- Ichiro Suehiro
- G02 - OPTICS
Information Patent Grant
Process for producing semiconductor device
- Patent number 7,487,586
- Issue date Feb 10, 2009
- Nitto Denko Corporation
- Akiko Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct-type backlight
- Patent number 7,290,902
- Issue date Nov 6, 2007
- Nitto Denko Corporation
- Ichiro Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an anisotropic conductive film
- Patent number 7,231,706
- Issue date Jun 19, 2007
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for optical-semiconductor element encapsulation and process f...
- Patent number 7,221,007
- Issue date May 22, 2007
- Nitto Denko Corporation
- Noriaki Harada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Process for producing light-emitting semiconductor device
- Patent number 7,189,591
- Issue date Mar 13, 2007
- Nitto Denko Corporation
- Ichirou Suehiro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Patent number 7,056,406
- Issue date Jun 6, 2006
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbodiimide copolymer and production method thereof
- Patent number 7,034,101
- Issue date Apr 25, 2006
- Nitto Denko Corporation
- Naoki Sadayori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive film for underfill and semiconductor device using the same
- Patent number 7,018,718
- Issue date Mar 28, 2006
- Nitto Denko Corporation
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Optical semiconductor device
- Patent number 6,978,079
- Issue date Dec 20, 2005
- Nitto Denko Corporation
- Kazuki Uwada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microlens array
- Patent number 6,961,185
- Issue date Nov 1, 2005
- Nitto Denko Corporation
- Ichiro Suehiro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Patent number 6,890,617
- Issue date May 10, 2005
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for underfill and semiconductor device using the same
- Patent number 6,846,550
- Issue date Jan 25, 2005
- Nitto Denko Corporation
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and production method thereof
- Patent number 6,709,606
- Issue date Mar 23, 2004
- Nitto Denko Corporation
- Akiko Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film
- Patent number 6,669,869
- Issue date Dec 30, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film-containing device
- Patent number 6,667,542
- Issue date Dec 23, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing semiconductor wafer with adhesive film
- Patent number 6,652,688
- Issue date Nov 25, 2003
- Nitto Denko Corporation
- Akiko Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with anisotropic conductor film, and method of...
- Patent number 6,613,608
- Issue date Sep 2, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Test method of semiconductor device
- Patent number 6,597,192
- Issue date Jul 22, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- G01 - MEASURING TESTING
Information Patent Grant
Production method of anisotropic conductive film and anisotropic co...
- Patent number 6,566,608
- Issue date May 20, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and circuit board for mounting semiconductor e...
- Patent number 6,538,309
- Issue date Mar 25, 2003
- Nitto Denko Corporation
- Yuji Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polycarbodiimide
- Patent number 6,492,484
- Issue date Dec 10, 2002
- Nitto Denko Corporation
- Sadahito Misumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Anisotropic conductive film and production method thereof
- Patent number 6,394,821
- Issue date May 28, 2002
- Nitto Denko Corporation
- Akiko Matsumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and production method thereof
- Patent number 6,245,175
- Issue date Jun 12, 2001
- Nitto Denko Corporation
- Yuji Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 6,144,108
- Issue date Nov 7, 2000
- Nitto Denko Corporation
- Shinichi Ohizumi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sealing label for sealing semiconductor element
- Patent number 6,114,013
- Issue date Sep 5, 2000
- Nitto Denko Corporation
- Yuji Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting resin composition
- Patent number 6,068,932
- Issue date May 30, 2000
- Nitto Denko Corporation
- Michie Sakamoto
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device having metal foil integral with sealing resin
- Patent number 6,023,096
- Issue date Feb 8, 2000
- Nitto Denko Corporation
- Yuji Hotta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing encapsulated semiconductor device having meta...
- Patent number 5,904,505
- Issue date May 18, 1999
- Nitto Denko Corporation
- Yuji Hotta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKLIGHT SYSTEM AND OPTICAL SHEET WITH PRESSURE-SENSITIVE ADHESIVE
- Publication number 20090162617
- Publication date Jun 25, 2009
- Nitto Denko Corporation
- Yutaka Moroishi
- G02 - OPTICS
Information Patent Application
Sheet for optical-semiconductor-element encapsulation and process f...
- Publication number 20060118973
- Publication date Jun 8, 2006
- NITTO DENKO CORPORATION
- Noriaki Harada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Light pipe for direct-type backlight and direct-type backlight
- Publication number 20060119751
- Publication date Jun 8, 2006
- NITTO DENKO CORPORATION
- Ichiro Suehiro
- G02 - OPTICS
Information Patent Application
Resin composition for optical use
- Publication number 20060089464
- Publication date Apr 27, 2006
- NITTO DENKO CORPORATION
- Kazuki Uwada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition for optical use
- Publication number 20060084766
- Publication date Apr 20, 2006
- NITTO DENKO CORPORATION
- Kazuki Uwada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin for optical-semiconductor element encapsulation
- Publication number 20060022356
- Publication date Feb 2, 2006
- NITTO DENKO CORPORATION
- Kazuki Uwada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
OPTICAL SEMICONDUCTOR DEVICE
- Publication number 20050249480
- Publication date Nov 10, 2005
- NITTO DENKO CORPORATION
- Kazuki Uwada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct-type backlight
- Publication number 20050237765
- Publication date Oct 27, 2005
- NITTO DENKO CORPORATION
- Ichiro Suehiro
- G02 - OPTICS
Information Patent Application
Sheet for optical-semiconductor element encapsulation and process f...
- Publication number 20050220414
- Publication date Oct 6, 2005
- NITTO DENKO CORPORATION
- Noriaki Harada
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Process for producing optical semiconductor device
- Publication number 20050202598
- Publication date Sep 15, 2005
- NITTO DENKO CORPORATION
- Ichirou Suehiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Process for producing circuit board having built-in electronic part
- Publication number 20050158911
- Publication date Jul 21, 2005
- NITTO DENKO CORPORATION
- Kazuki Uwada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Publication number 20050153101
- Publication date Jul 14, 2005
- NITTO DENKO CORPORATION
- Miho Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Process for producing light-emitting semiconductor device
- Publication number 20050148105
- Publication date Jul 7, 2005
- NITTO DENKO CORPORATION
- Ichirou Suehiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Electroluminescence device, planar light source and display using t...
- Publication number 20050142379
- Publication date Jun 30, 2005
- NITTO DENKO CORPORATION
- Noriyuki Juni
- G02 - OPTICS
Information Patent Application
Process for producing optical semiconductor device
- Publication number 20050136570
- Publication date Jun 23, 2005
- NITTO DENKO CORPORATION
- Ichirou Suehiro
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Optical semiconductor device
- Publication number 20050127378
- Publication date Jun 16, 2005
- NITTO DENKO CORPORATION
- Ichirou Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous adhesive sheet, semiconductor wafer with porous adhesive she...
- Publication number 20050074578
- Publication date Apr 7, 2005
- NITTO DENKO CORPORATION
- Miho Yamaguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermosetting resin
- Publication number 20050049385
- Publication date Mar 3, 2005
- NITTO DENKO CORPORATION
- Kazuki Uwada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive film for underfill and semiconductor device using the same
- Publication number 20040178423
- Publication date Sep 16, 2004
- NITTO DENKO CORPORATION
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polycarbodiimide copolymer and production method thereof
- Publication number 20040176547
- Publication date Sep 9, 2004
- NITTO DENKO CORPORATION
- Naoki Sadayori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Microlens array
- Publication number 20040167310
- Publication date Aug 26, 2004
- NITTO DENKO CORPORATION
- Ichiro Suehiro
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polycarbodiimide having high index of refraction and production met...
- Publication number 20040158021
- Publication date Aug 12, 2004
- NITTO DENKO CORPORATION
- Naoki Sadayori
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin for the encapsulation of photosemiconductor element, photosem...
- Publication number 20040157992
- Publication date Aug 12, 2004
- NITTO DENKO CORPORATION
- Kazuki Uwada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor device and process for producing semiconductor device
- Publication number 20040140482
- Publication date Jul 22, 2004
- NITTO DENKO CORPORATION
- Kazuyuki Kuwada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing semiconductor device
- Publication number 20040123456
- Publication date Jul 1, 2004
- NITTO DENKO CORPORATION
- Akiko Matsumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Adhesive film for underfill and semiconductor device using the same
- Publication number 20040096633
- Publication date May 20, 2004
- NITTO DENKO CORPORATION
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Production method of anisotropic conductive film and anisotropic co...
- Publication number 20030201118
- Publication date Oct 30, 2003
- Nitto Denko Corporation
- Miho Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally conductive sheet and semiconductor device using same
- Publication number 20030127727
- Publication date Jul 10, 2003
- Nitto Denko Corporation
- Ichiro Suehiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20030080768
- Publication date May 1, 2003
- Miho Yamaguchi
- G01 - MEASURING TESTING
Information Patent Application
Process of producing semiconductor device and resin composition she...
- Publication number 20030068841
- Publication date Apr 10, 2003
- NITTO DENKO CORPORATION
- Akiko Matsumura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Person

Patents Grantslast 30 patents

Electroluminescence device, planar light source and display using t...

Light pipe for direct-type backlight and direct-type backlight

Process for producing semiconductor device

Direct-type backlight

Method of manufacturing an anisotropic conductive film

Sheet for optical-semiconductor element encapsulation and process f...

Process for producing light-emitting semiconductor device

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Polycarbodiimide copolymer and production method thereof

Adhesive film for underfill and semiconductor device using the same

Optical semiconductor device

Microlens array

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Adhesive film for underfill and semiconductor device using the same

Anisotropic conductive film and production method thereof

Anisotropic conductive film

Anisotropic conductive film-containing device

Process for producing semiconductor wafer with adhesive film

Semiconductor wafer with anisotropic conductor film, and method of...

Test method of semiconductor device

Production method of anisotropic conductive film and anisotropic co...

Semiconductor device and circuit board for mounting semiconductor e...

Polycarbodiimide

Anisotropic conductive film and production method thereof

Anisotropic conductive film and production method thereof

Semiconductor device and method of fabricating the same

Sealing label for sealing semiconductor element

Thermosetting resin composition

Semiconductor device having metal foil integral with sealing resin

Process for producing encapsulated semiconductor device having meta...

Patents Applicationslast 30 patents

BACKLIGHT SYSTEM AND OPTICAL SHEET WITH PRESSURE-SENSITIVE ADHESIVE

Sheet for optical-semiconductor-element encapsulation and process f...

Light pipe for direct-type backlight and direct-type backlight

Resin composition for optical use

Resin composition for optical use

Resin for optical-semiconductor element encapsulation

OPTICAL SEMICONDUCTOR DEVICE

Direct-type backlight

Sheet for optical-semiconductor element encapsulation and process f...

Process for producing optical semiconductor device

Process for producing circuit board having built-in electronic part

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Process for producing light-emitting semiconductor device

Electroluminescence device, planar light source and display using t...

Process for producing optical semiconductor device

Optical semiconductor device

Porous adhesive sheet, semiconductor wafer with porous adhesive she...

Thermosetting resin

Adhesive film for underfill and semiconductor device using the same

Polycarbodiimide copolymer and production method thereof

Microlens array

Polycarbodiimide having high index of refraction and production met...

Resin for the encapsulation of photosemiconductor element, photosem...

Semiconductor device and process for producing semiconductor device

Process for producing semiconductor device

Adhesive film for underfill and semiconductor device using the same

Production method of anisotropic conductive film and anisotropic co...

Thermally conductive sheet and semiconductor device using same

TEST METHOD OF SEMICONDUCTOR DEVICE

Process of producing semiconductor device and resin composition she...