Claims
- 1. A process for producing a semiconductor device comprising, in encapsulating a semiconductor device with a resin using a mold, temporarily fixing a metal foil material on a face of a mold cavity having a surface roughness determined by 10 point average roughness, R.sub.z, according to JIS B 0601-1982 of from 4 to 15 .mu.m, and injecting an encapsulating resin followed by molding to adhere the metal foil material on the surface of the semiconductor device.
Priority Claims (2)
Number |
Date |
Country |
Kind |
6-159796 |
Jul 1994 |
JPX |
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7-33677 |
Feb 1995 |
JPX |
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Parent Case Info
This is a divisional of FWC application Ser No. 08/702,792 filed Aug. 26, 1996, U.S. Pat. No. 5,834,850, which is a continuation of application Ser. No. 08/501,142 filed Jul. 11, 1995, abandoned.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
4524098 |
Shimizu et al. |
Jun 1985 |
|
4867839 |
Sato et al. |
Sep 1989 |
|
5674343 |
Hotta et al. |
Oct 1997 |
|
Divisions (1)
|
Number |
Date |
Country |
Parent |
702792 |
Aug 1996 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
501142 |
Jul 1995 |
|