Yuji Yano

Person

Tenri-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Optical element, optical element wafer, optical element wafer modul...
- Patent number 9,085,111
- Issue date Jul 21, 2015
- Sharp Kabushiki Kaisha
- Yuji Yano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical element module and manufacturing method thereof, electronic...
- Patent number 8,866,949
- Issue date Oct 21, 2014
- Sharp Kabushiki Kaisha
- Yuji Yano
- B32 - LAYERED PRODUCTS
Information Patent Grant
Optical element, optical element module, electronic element module,...
- Patent number 8,649,111
- Issue date Feb 11, 2014
- Sharp Kabushiki Kaisha
- Yuji Yano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical element, optical element wafer, optical element wafer modul...
- Patent number 8,547,470
- Issue date Oct 1, 2013
- Sharp Kabushiki Kaisha
- Yuji Yano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Optical element wafer module, optical element module, method for ma...
- Patent number 8,482,926
- Issue date Jul 9, 2013
- Sharp Kabushiki Kaisha
- Yuji Yano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical element, optical element wafer, optical element wafer modul...
- Patent number 8,405,756
- Issue date Mar 26, 2013
- Sharp Kabushiki Kaisha
- Yuji Yano
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Grant
Semiconductor device, stacked semiconductor device, and manufacturi...
- Patent number 7,723,839
- Issue date May 25, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, method of forming bump structure, and semiconductor...
- Patent number 7,683,484
- Issue date Mar 23, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,528,011
- Issue date May 5, 2009
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,276,437
- Issue date Oct 2, 2007
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, semiconductor device and package stack semiconduc...
- Patent number 6,731,013
- Issue date May 4, 2004
- Sharp Kabushiki Kaisha
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL ELEMENT, OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT MODULE,...
- Publication number 20120229916
- Publication date Sep 13, 2012
- Sharp Kabushiki Kaisha
- Yuji Yano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical element module and manufacturing method thereof, electronic...
- Publication number 20110050988
- Publication date Mar 3, 2011
- Sharp Kabushiki Kaisha
- Yuji Yano
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical element module and manufacturing method thereof, electronic...
- Publication number 20110050978
- Publication date Mar 3, 2011
- Sharp Kabushiki Kaisha
- Yuji Yano
- G02 - OPTICS
Information Patent Application
OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD FOR MA...
- Publication number 20100079635
- Publication date Apr 1, 2010
- Sharp Kabushiki Kaisha
- Yuji YANO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical element wafer and method for manufacturing optical element...
- Publication number 20100079642
- Publication date Apr 1, 2010
- Sharp Kabushiki Kaisha
- Hideyuki Kurimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Optical element, optical element wafer, optical element wafer modul...
- Publication number 20100073532
- Publication date Mar 25, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODUL...
- Publication number 20100073531
- Publication date Mar 25, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Optical element, optical element wafer, optical element wafer modul...
- Publication number 20100073534
- Publication date Mar 25, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Optical element, optical element wafer, optical element wafer modul...
- Publication number 20100073533
- Publication date Mar 25, 2010
- Sharp Kabushiki Kaisha
- Yuji Yano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK,...
- Publication number 20080237898
- Publication date Oct 2, 2008
- Yuji YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump structure, method of forming bump structure, and semiconductor...
- Publication number 20070252272
- Publication date Nov 1, 2007
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070232054
- Publication date Oct 4, 2007
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, stacked semiconductor device, and manufacturi...
- Publication number 20060278970
- Publication date Dec 14, 2006
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20060151206
- Publication date Jul 13, 2006
- Sharp Kabushiki Kaisha
- Tomoyo Maruyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050148175
- Publication date Jul 7, 2005
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20020158325
- Publication date Oct 31, 2002
- Sharp Kabushiki Kaisha
- Yuji Yano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring substrate, semiconductor device and package stack semiconduc...
- Publication number 20020000327
- Publication date Jan 3, 2002
- Hiroyuki Juso
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Optical element, optical element wafer, optical element wafer modul...

Optical element module and manufacturing method thereof, electronic...

Optical element, optical element module, electronic element module,...

Optical element, optical element wafer, optical element wafer modul...

Optical element wafer module, optical element module, method for ma...

Optical element, optical element wafer, optical element wafer modul...

Semiconductor device, stacked semiconductor device, and manufacturi...

Bump structure, method of forming bump structure, and semiconductor...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Wiring substrate, semiconductor device and package stack semiconduc...

Patents Applicationslast 30 patents

OPTICAL ELEMENT, OPTICAL ELEMENT MODULE, ELECTRONIC ELEMENT MODULE,...

Optical element module and manufacturing method thereof, electronic...

Optical element module and manufacturing method thereof, electronic...

OPTICAL ELEMENT WAFER MODULE, OPTICAL ELEMENT MODULE, METHOD FOR MA...

Optical element wafer and method for manufacturing optical element...

Optical element, optical element wafer, optical element wafer modul...

OPTICAL ELEMENT, OPTICAL ELEMENT WAFER, OPTICAL ELEMENT WAFER MODUL...

Optical element, optical element wafer, optical element wafer modul...

Optical element, optical element wafer, optical element wafer modul...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK,...

Bump structure, method of forming bump structure, and semiconductor...

Semiconductor device and manufacturing method thereof

Semiconductor device, stacked semiconductor device, and manufacturi...

Semiconductor device and manufacturing method therefor

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Wiring substrate, semiconductor device and package stack semiconduc...