Yuki MIZUTANI

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,207,459
- Issue date Jan 21, 2025
- SanDisk Technologies LLC
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Grant
Non-volatile memory with reduced word line switch area
- Patent number 12,032,837
- Issue date Jul 9, 2024
- SANDISK TECHNOLOGIES LLC
- Yuki Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Three-dimensional memory array with dual-level peripheral circuits...
- Patent number 12,004,348
- Issue date Jun 4, 2024
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with separated contact regions and...
- Patent number 11,996,153
- Issue date May 28, 2024
- SanDisk Technologies LLC
- James Kai
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device with double-sided stepped surfaces...
- Patent number 11,569,259
- Issue date Jan 31, 2023
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory with multiple wells for word line switch transi...
- Patent number 11,404,123
- Issue date Aug 2, 2022
- SanDisk Technologies LLC
- Shiqian Shao
- G11 - INFORMATION STORAGE
Information Patent Grant
Bonded three-dimensional memory devices and methods of making the s...
- Patent number 11,355,486
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly with vertical power and control signal connection a...
- Patent number 11,211,370
- Issue date Dec 28, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing width-modulated connecti...
- Patent number 11,114,459
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device containing dielectric we...
- Patent number 11,081,443
- Issue date Aug 3, 2021
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including contact-level bit-line-co...
- Patent number 11,011,209
- Issue date May 18, 2021
- SanDisk Technologies LLC
- Jee-Yeon Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory device including stepped connection plates...
- Patent number 10,903,237
- Issue date Jan 26, 2021
- SanDisk Technologies LLC
- Naohiro Hosoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 10,381,371
- Issue date Aug 13, 2019
- SanDisk Technologies LLC
- Hiroyuki Ogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures between staircase regions in a...
- Patent number 10,256,248
- Issue date Apr 9, 2019
- SanDisk Technologies LLC
- Zhenyu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory devices including vertically sh...
- Patent number 9,935,050
- Issue date Apr 3, 2018
- SanDisk Technologies LLC
- Mohan Dunga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having non-uniform spacing among me...
- Patent number 9,929,174
- Issue date Mar 27, 2018
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing separately formed drain...
- Patent number 9,922,987
- Issue date Mar 20, 2018
- SanDisk Technologies LLC
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 9,818,693
- Issue date Nov 14, 2017
- SanDisk Technologies LLC
- Fumiaki Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-memory-level via structures for a three-dimensional memory...
- Patent number 9,806,093
- Issue date Oct 31, 2017
- SanDisk Technologies LLC
- Fumiaki Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory device having well contact pillar and meth...
- Patent number 9,768,186
- Issue date Sep 19, 2017
- SanDisk Technologies LLC
- Seiji Shimabukuro
- G11 - INFORMATION STORAGE
Information Patent Grant
Passive devices for integration with three-dimensional memory devices
- Patent number 9,646,981
- Issue date May 9, 2017
- SanDisk Technologies LLC
- Masatoshi Nishikawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Bridge line structure for bit line connection in a three-dimensiona...
- Patent number 9,613,975
- Issue date Apr 4, 2017
- SanDisk Technologies LLC
- Chenche Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Utilizing NAND strings in dummy blocks for faster bit line precharge
- Patent number 9,595,338
- Issue date Mar 14, 2017
- SanDisk Technologies LLC
- Juan Carlos Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional memory device having well contact pillar and meth...
- Patent number 9,412,749
- Issue date Aug 9, 2016
- SanDisk Technologies LLC
- Seiji Shimabukuro
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional memory device having well contact pillar and meth...
- Patent number 9,230,972
- Issue date Jan 5, 2016
- SanDisk Technologies Inc.
- Seiji Shimabukuro
- G11 - INFORMATION STORAGE
Information Patent Grant
Vertical NAND device with shared word line steps
- Patent number 9,224,747
- Issue date Dec 29, 2015
- SanDisk Technologies Inc.
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED COLUMN FLOORPLAN FOR NAND
- Publication number 20240274192
- Publication date Aug 15, 2024
- SANDISK TECHNOLOGIES LLC
- Yuki Mizutani
- G11 - INFORMATION STORAGE
Information Patent Application
NAND PLANE BOUNDARY SHRINK
- Publication number 20240215240
- Publication date Jun 27, 2024
- SANDISK TECHNOLOGIES LLC
- Ohwon Kwon
Information Patent Application
NON-VOLATILE MEMORY WITH REDUCED WORD LINE SWITCH AREA
- Publication number 20240111440
- Publication date Apr 4, 2024
- SANDISK TECHNOLOGIES LLC
- Yuki Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUITRY ARRANGEMENT IN A FLOORPLAN OF A MEMORY DEVICE
- Publication number 20230367944
- Publication date Nov 16, 2023
- SANDISK TECHNOLOGIES LLC
- Yuki Mizutani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LOW POWER READ METHOD AND A MEMORY DEVICE CAPABLE THEREOF
- Publication number 20230282288
- Publication date Sep 7, 2023
- SANDISK TECHNOLOGIES LLC
- Xiang Yang
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...
- Publication number 20230044232
- Publication date Feb 9, 2023
- SANDISK TECHNOLOGIES LLC
- James KAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399362
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...
- Publication number 20220399358
- Publication date Dec 15, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DOUBLE-SIDED STEPPED SURFACES...
- Publication number 20220045089
- Publication date Feb 10, 2022
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...
- Publication number 20210233900
- Publication date Jul 29, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...
- Publication number 20210134827
- Publication date May 6, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...
- Publication number 20210098029
- Publication date Apr 1, 2021
- SANDISK TECHNOLOGIES LLC
- Jee-Yeon KIM
- G11 - INFORMATION STORAGE
Information Patent Application
BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...
- Publication number 20210035965
- Publication date Feb 4, 2021
- SANDISK TECHNOLOGIES LLC
- Yuki MIZUTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...
- Publication number 20170352678
- Publication date Dec 7, 2017
- SanDisk Technologies LLC
- Zhenyu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES INCLUDING VERTICALLY SH...
- Publication number 20170294377
- Publication date Oct 12, 2017
- SanDisk Technologies LLC
- Mohan DUNGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179026
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- Fumiaki Toyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179152
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- Fumiaki TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...
- Publication number 20170179153
- Publication date Jun 22, 2017
- SanDisk Technologies LLC
- Hiroyuki OGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICES FOR INTEGRATION WITH THREE-DIMENSIONAL MEMORY DEVICES
- Publication number 20160365351
- Publication date Dec 15, 2016
- SanDisk Technologies, Inc.
- Masatoshi NISHIKAWA
- G11 - INFORMATION STORAGE
Information Patent Application
THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METH...
- Publication number 20160329341
- Publication date Nov 10, 2016
- Seiji Shimabukuro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BRIDGE LINE STRUCTURE FOR BIT LINE CONNECTION IN A THREE-DIMENSIONA...
- Publication number 20160293621
- Publication date Oct 6, 2016
- SANDISK TECHNOLOGIES INC.
- Chenche Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Utilizing NAND Strings in Dummy Blocks for Faster Bit Line Precharge
- Publication number 20160086671
- Publication date Mar 24, 2016
- SANDISK TECHNOLOGIES INC.
- Juan Carlos Lee
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL NAND DEVICE WITH SHARED WORD LINE STEPS
- Publication number 20150279852
- Publication date Oct 1, 2015
- SANDISK TECHNOLOGIES INC.
- Yuki Mizutani
- H01 - BASIC ELECTRIC ELEMENTS

Yuki MIZUTANI

Person

Patents Grantslast 30 patents

Three-dimensional memory array with dual-level peripheral circuits...

Non-volatile memory with reduced word line switch area

Three-dimensional memory array with dual-level peripheral circuits...

Three-dimensional memory device with separated contact regions and...

Three-dimensional memory device with double-sided stepped surfaces...

Non-volatile memory with multiple wells for word line switch transi...

Bonded three-dimensional memory devices and methods of making the s...

Bonded assembly with vertical power and control signal connection a...

Three-dimensional memory device containing width-modulated connecti...

Multi-tier three-dimensional memory device containing dielectric we...

Three-dimensional memory device including contact-level bit-line-co...

Three-dimensional memory device including stepped connection plates...

Through-memory-level via structures for a three-dimensional memory...

Through-memory-level via structures between staircase regions in a...

Multi-tier three-dimensional memory devices including vertically sh...

Three-dimensional memory device having non-uniform spacing among me...

Three-dimensional memory device containing separately formed drain...

Through-memory-level via structures for a three-dimensional memory...

Through-memory-level via structures for a three-dimensional memory...

Three dimensional memory device having well contact pillar and meth...

Passive devices for integration with three-dimensional memory devices

Bridge line structure for bit line connection in a three-dimensiona...

Utilizing NAND strings in dummy blocks for faster bit line precharge

Three dimensional memory device having well contact pillar and meth...

Three dimensional memory device having well contact pillar and meth...

Vertical NAND device with shared word line steps

Patents Applicationslast 30 patents

STACKED COLUMN FLOORPLAN FOR NAND

NAND PLANE BOUNDARY SHRINK

NON-VOLATILE MEMORY WITH REDUCED WORD LINE SWITCH AREA

CIRCUITRY ARRANGEMENT IN A FLOORPLAN OF A MEMORY DEVICE

LOW POWER READ METHOD AND A MEMORY DEVICE CAPABLE THEREOF

THREE-DIMENSIONAL MEMORY DEVICE WITH SEPARATED CONTACT REGIONS AND...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY ARRAY WITH DUAL-LEVEL PERIPHERAL CIRCUITS...

THREE-DIMENSIONAL MEMORY DEVICE WITH DOUBLE-SIDED STEPPED SURFACES...

BONDED ASSEMBLY WITH VERTICAL POWER AND CONTROL SIGNAL CONNECTION A...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING CONTACT-LEVEL BIT-LINE-CO...

BONDED THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE S...

THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A...

MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES INCLUDING VERTICALLY SH...

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

THROUGH-MEMORY-LEVEL VIA STRUCTURES FOR A THREE-DIMENSIONAL MEMORY...

PASSIVE DEVICES FOR INTEGRATION WITH THREE-DIMENSIONAL MEMORY DEVICES

THREE DIMENSIONAL MEMORY DEVICE HAVING WELL CONTACT PILLAR AND METH...

BRIDGE LINE STRUCTURE FOR BIT LINE CONNECTION IN A THREE-DIMENSIONA...

Utilizing NAND Strings in Dummy Blocks for Faster Bit Line Precharge

VERTICAL NAND DEVICE WITH SHARED WORD LINE STEPS