Yuki TERADO

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor element driving circuit and semiconductor element dri...
- Patent number 11,990,894
- Issue date May 21, 2024
- Mitsubishi Electric Corporation
- Jun Fukudome
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package with plurality of grooves on lower surface
- Patent number 11,798,869
- Issue date Oct 24, 2023
- Mitsubishi Electric Corporation
- Yuki Terado
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD, INTEGRATED CIRCUIT ELEMENT, AND INTEGRATED CIRCUIT DEVICE
- Publication number 20240258254
- Publication date Aug 1, 2024
- Mitsubishi Electric Corporation
- Yuki TERADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT DRIVING CIRCUIT AND SEMICONDUCTOR ELEMENT DRI...
- Publication number 20230076712
- Publication date Mar 9, 2023
- Mitsubishi Electric Corporation
- Jun FUKUDOME
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220278029
- Publication date Sep 1, 2022
- Mitsubishi Electric Corporation
- Yuki TERADO
- H01 - BASIC ELECTRIC ELEMENTS