Yukihiro Ueno

Person

Hiroshima, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer circuit board and production method for same
- Patent number 7,525,188
- Issue date Apr 28, 2009
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing printed wiring board
- Patent number 7,455,533
- Issue date Nov 25, 2008
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing multilayer printed wiring board, multilayer pr...
- Patent number 7,240,431
- Issue date Jul 10, 2007
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of soldering semiconductor part and mounted structure of sem...
- Patent number 7,199,329
- Issue date Apr 3, 2007
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board transferring apparatus and method and solder ball mou...
- Patent number 6,976,616
- Issue date Dec 20, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in electronic component and method for prod...
- Patent number 6,948,944
- Issue date Sep 27, 2005
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING PRINTED WIRING BOARD
- Publication number 20090289030
- Publication date Nov 26, 2009
- Yukihiro UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20090114428
- Publication date May 7, 2009
- Yukihiro UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND METHOD FOR FABRICATION THEREOF
- Publication number 20090084583
- Publication date Apr 2, 2009
- Yukihiro UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing multilayer printed wiring board
- Publication number 20080286696
- Publication date Nov 20, 2008
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20080202676
- Publication date Aug 28, 2008
- Yukihiro UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD
- Publication number 20080171139
- Publication date Jul 17, 2008
- Yukihiro UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD MANUFACTURING APPARATUS, PRINTED WIRING BOARD,...
- Publication number 20080118681
- Publication date May 22, 2008
- Yukihiro UENO
- B32 - LAYERED PRODUCTS
Information Patent Application
Multilayer printed wiring board and method for producing the same
- Publication number 20070117261
- Publication date May 24, 2007
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing a multilayer printed wiring board
- Publication number 20070089826
- Publication date Apr 26, 2007
- SHARP KABUSHIKI KAISHA
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer circuit board and production method for same
- Publication number 20070063355
- Publication date Mar 22, 2007
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board fabrication method, printed wiring board photo...
- Publication number 20070034596
- Publication date Feb 15, 2007
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer printed wiring board fabrication method and multilayer p...
- Publication number 20070017698
- Publication date Jan 25, 2007
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring substrate and method for identifying printed wiring...
- Publication number 20060157270
- Publication date Jul 20, 2006
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing printed wiring board
- Publication number 20060108145
- Publication date May 25, 2006
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for producing multilayer printed wiring board, multilayer pr...
- Publication number 20060086535
- Publication date Apr 27, 2006
- Sharp Kabushiki Kaisha
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD TRANSFERRING APPARATUS AND METHOD AND SOLDER BALL MOU...
- Publication number 20050035182
- Publication date Feb 17, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SOLDERING SEMICONDUCTOR PART AND MOUNTED STRUCTURE OF SEM...
- Publication number 20050035184
- Publication date Feb 17, 2005
- Niigata Seimitsu Co., Ltd.
- Akihiro Mano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board with built-in electronic component and method for prod...
- Publication number 20030087538
- Publication date May 8, 2003
- Yukihiro Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yukihiro Ueno

Person

Patents Grantslast 30 patents

Multilayer circuit board and production method for same

Method for producing printed wiring board

Method for producing multilayer printed wiring board, multilayer pr...

Method of soldering semiconductor part and mounted structure of sem...

Circuit board transferring apparatus and method and solder ball mou...

Wiring board with built-in electronic component and method for prod...

Patents Applicationslast 30 patents

METHOD OF FABRICATING PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER PRINTED WIRING BOARD AND METHOD FOR FABRICATION THEREOF

Method for manufacturing multilayer printed wiring board

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

PRINTED WIRING BOARD MANUFACTURING APPARATUS, PRINTED WIRING BOARD,...

Multilayer printed wiring board and method for producing the same

Method for producing a multilayer printed wiring board

Multilayer circuit board and production method for same

Printed wiring board fabrication method, printed wiring board photo...

Multilayer printed wiring board fabrication method and multilayer p...

Printed wiring substrate and method for identifying printed wiring...

Method for producing printed wiring board

Method for producing multilayer printed wiring board, multilayer pr...

CIRCUIT BOARD TRANSFERRING APPARATUS AND METHOD AND SOLDER BALL MOU...

METHOD OF SOLDERING SEMICONDUCTOR PART AND MOUNTED STRUCTURE OF SEM...

Wiring board with built-in electronic component and method for prod...