Yukio OZAKI

Person

Kawasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Non-transitory computer-readable storage medium, robot transfer tim...
- Patent number 10,712,725
- Issue date Jul 14, 2020
- Fujitsu Limited
- Yasuyuki Masuda
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Ultrasonic bonding apparatus
- Patent number 7,938,160
- Issue date May 10, 2011
- Fujitsu Limited
- Yasuyuki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic bonding apparatus
- Patent number 7,905,268
- Issue date Mar 15, 2011
- Fujitsu Limited
- Yasuyuki Masuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding apparatus
- Patent number 7,823,618
- Issue date Nov 2, 2010
- Fujitsu Limited
- Yasuyuki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resonator, ultrasonic die bonding head, and ultrasonic die bonding...
- Patent number 7,595,582
- Issue date Sep 29, 2009
- Fujitsu Limited
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,566,586
- Issue date Jul 28, 2009
- Fujitsu Limited
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic tool and ultrasonic bonder
- Patent number 7,264,146
- Issue date Sep 4, 2007
- Fujitsu Limited
- Shuichi Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Servo track writing device and method thereof
- Patent number 7,233,453
- Issue date Jun 19, 2007
- Fujitsu Limited
- Tohru Harada
- G11 - INFORMATION STORAGE
Information Patent Grant
Oscillating apparatus
- Patent number 7,218,030
- Issue date May 15, 2007
- Fujitsu Limited
- Toshinori Kasuga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Servo track writer and driving method therefor
- Patent number 6,760,180
- Issue date Jul 6, 2004
- Fujitsu Limited
- Seiji Kino
- G11 - INFORMATION STORAGE
Information Patent Grant
Game machine
- Patent number 6,254,479
- Issue date Jul 3, 2001
- Konami Co., Ltd.
- Genichiro Okitani
- G07 - CHECKING-DEVICES

Patents Applicationslast 30 patents

Information Patent Application
INFORMATION PROCESSING DEVICE, NON-TRANSITORY COMPUTER READABLE STO...
- Publication number 20190266547
- Publication date Aug 29, 2019
- Fujitsu Limited
- Koji Yoshioka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, ROBOT TRANSFER TIM...
- Publication number 20180299858
- Publication date Oct 18, 2018
- Fujitsu Limited
- Yasuyuki Masuda
- G05 - CONTROLLING REGULATING
Information Patent Application
NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, PROCESS PLANNING M...
- Publication number 20180276590
- Publication date Sep 27, 2018
- Fujitsu Limited
- MITSURU KUBO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CLEANING APPARATUS AND METHOD
- Publication number 20110240059
- Publication date Oct 6, 2011
- Fujitsu Limited
- Yukio OZAKI
- B08 - CLEANING
Information Patent Application
POSITION MEASURING APPARATUS AND COATING APPARATUS
- Publication number 20100174398
- Publication date Jul 8, 2010
- Fujitsu Limited
- Taizan Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING APPARATUS
- Publication number 20100038406
- Publication date Feb 18, 2010
- Fujitsu Limited
- Yasuyuki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC BONDING APPARATUS
- Publication number 20100006621
- Publication date Jan 14, 2010
- Fujitsu Limited
- Yasuyuki MASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRASONIC BONDING APPARATUS
- Publication number 20100006231
- Publication date Jan 14, 2010
- Fujitsu Limited
- Yasuyuki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING...
- Publication number 20080087708
- Publication date Apr 17, 2008
- FUJITSU LIMITED
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonator, ultrasonic head, and ultrasonic bonder using the same
- Publication number 20080048003
- Publication date Feb 28, 2008
- FUJITSU LIMITED
- Yukio Ozaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resonator, ultrasonic head, and ultrasonic bonder using the same
- Publication number 20080048004
- Publication date Feb 28, 2008
- FUJITSU LIMITED
- Yukio Ozaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20070264752
- Publication date Nov 15, 2007
- FUJITSU LIMITED
- Norio Kainuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrasonic tool and ultrasonic bonder
- Publication number 20060231592
- Publication date Oct 19, 2006
- FUJITSU LIMITED
- Shuichi Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Oscillating apparatus
- Publication number 20060208615
- Publication date Sep 21, 2006
- FUJITSU LIMITED
- Toshinori Kasuga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resonator, ultrasonic die bonding head, and ultrasonic die bonding...
- Publication number 20060169746
- Publication date Aug 3, 2006
- FUJITSU LIMITED
- Yukio Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resonator, ultrasonic head, and ultrasonic bonder using the same
- Publication number 20060113350
- Publication date Jun 1, 2006
- Yukio Ozaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic head
- Publication number 20060113351
- Publication date Jun 1, 2006
- FUJITSU LIMITED
- Yukio Ozaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of flip-chip bonding
- Publication number 20060097029
- Publication date May 11, 2006
- FUJITSU LIMITED
- Norio Kainuma
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ultrasonic tool and ultrasonic bonder
- Publication number 20050205641
- Publication date Sep 22, 2005
- FUJITSU LIMITED
- Shuichi Takeuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Servo track writing device and method thereof
- Publication number 20040105184
- Publication date Jun 3, 2004
- FUJITSU LIMITED
- Tohru Harada
- G11 - INFORMATION STORAGE
Information Patent Application
Servo track writer and driving method therefor
- Publication number 20020145819
- Publication date Oct 10, 2002
- FUJITSU LIMITED
- Seiji Kino
- G11 - INFORMATION STORAGE

Yukio OZAKI

Person

Patents Grantslast 30 patents

Non-transitory computer-readable storage medium, robot transfer tim...

Ultrasonic bonding apparatus

Ultrasonic bonding apparatus

Ultrasonic bonding apparatus

Resonator, ultrasonic die bonding head, and ultrasonic die bonding...

Method of manufacturing a semiconductor device

Ultrasonic tool and ultrasonic bonder

Servo track writing device and method thereof

Oscillating apparatus

Servo track writer and driving method therefor

Game machine

Patents Applicationslast 30 patents

INFORMATION PROCESSING DEVICE, NON-TRANSITORY COMPUTER READABLE STO...

NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, ROBOT TRANSFER TIM...

NON-TRANSITORY COMPUTER-READABLE STORAGE MEDIUM, PROCESS PLANNING M...

CLEANING APPARATUS AND METHOD

POSITION MEASURING APPARATUS AND COATING APPARATUS

ULTRASONIC BONDING APPARATUS

ULTRASONIC BONDING APPARATUS

ULTRASONIC BONDING APPARATUS

RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING...

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Method of manufacturing a semiconductor device

Ultrasonic tool and ultrasonic bonder

Oscillating apparatus

Resonator, ultrasonic die bonding head, and ultrasonic die bonding...

Resonator, ultrasonic head, and ultrasonic bonder using the same

Ultrasonic head

Method of flip-chip bonding

Ultrasonic tool and ultrasonic bonder

Servo track writing device and method thereof

Servo track writer and driving method therefor