Yumin Liu

Person

Suzhou, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,426,953
- Issue date Apr 23, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded semiconductor power modules and packages
- Patent number 8,421,204
- Issue date Apr 16, 2013
- Fairchild Semiconductor Corporation
- Yong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D smart power module
- Patent number 8,088,645
- Issue date Jan 3, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with an embedded printed circuit board and st...
- Patent number 8,030,743
- Issue date Oct 4, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked micro optocouplers and methods of making the same
- Patent number 7,973,393
- Issue date Jul 5, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die packages with multiple integrated substrates, sys...
- Patent number 7,952,204
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Yumin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D smart power module
- Patent number 7,808,101
- Issue date Oct 5, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with overlapping devices
- Patent number 7,791,084
- Issue date Sep 7, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin substrate and package
- Patent number 7,745,244
- Issue date Jun 29, 2010
- Fairchild Semiconductor Corporation
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER MODULE
- Publication number 20250079269
- Publication date Mar 6, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Yumin LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...
- Publication number 20250046682
- Publication date Feb 6, 2025
- Huawei Digital Power Technologies Co.,Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE
- Publication number 20250014964
- Publication date Jan 9, 2025
- Huawei Digital Power Technologies Co., Ltd.
- Andreas MUNDING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR POWER MODULES AND PACKAGES
- Publication number 20120292778
- Publication date Nov 22, 2012
- Yong Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20120001313
- Publication date Jan 5, 2012
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SMART POWER MODULE
- Publication number 20110070699
- Publication date Mar 24, 2011
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Premolded Substrates with Apertures for Semiconductor Die Packages...
- Publication number 20100230792
- Publication date Sep 16, 2010
- Scott Irving
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Micro Optocouplers and Methods of Making the Same
- Publication number 20100193803
- Publication date Aug 5, 2010
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN SUBSTRATE AND PACKAGE
- Publication number 20090315171
- Publication date Dec 24, 2009
- Zhongfa Yuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-Modules with Molded Passive Components, Systems Using the Sam...
- Publication number 20090315162
- Publication date Dec 24, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTR...
- Publication number 20090278241
- Publication date Nov 12, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Packages With Multiple Integrated Substrates, Sys...
- Publication number 20090256252
- Publication date Oct 15, 2009
- Yumin Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked Micro-Module Packages, Systems Using the Same, and Methods...
- Publication number 20090256245
- Publication date Oct 15, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SMART POWER MODULE
- Publication number 20090200657
- Publication date Aug 13, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Compact Semiconductor Die Packages Suitable for Smart-Power Mo...
- Publication number 20090194857
- Publication date Aug 6, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH OVERLAPPING DEVICES
- Publication number 20090173953
- Publication date Jul 9, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...
- Publication number 20090174046
- Publication date Jul 9, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package with an embedded printed circuit board and st...

Embedded semiconductor power modules and packages

3D smart power module

Semiconductor package with an embedded printed circuit board and st...

Stacked micro optocouplers and methods of making the same

Semiconductor die packages with multiple integrated substrates, sys...

3D smart power module

Package with overlapping devices

Pin substrate and package

Patents Applicationslast 30 patents

POWER MODULE

SEMICONDUCTOR POWER ENTITY, METHOD FOR PRODUCING SUCH ENTITY BY HYB...

HYBRID BOND SHEET AND COOLED SEMICONDUCTOR POWER MODULE

EMBEDDED SEMICONDUCTOR POWER MODULES AND PACKAGES

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...

3D SMART POWER MODULE

Premolded Substrates with Apertures for Semiconductor Die Packages...

Stacked Micro Optocouplers and Methods of Making the Same

PIN SUBSTRATE AND PACKAGE

Micro-Modules with Molded Passive Components, Systems Using the Sam...

SEMICONDUCTOR DIE PACKAGE INCLUDING DIE STACKED ON PREMOLDED SUBSTR...

Semiconductor Die Packages With Multiple Integrated Substrates, Sys...

Stacked Micro-Module Packages, Systems Using the Same, and Methods...

3D SMART POWER MODULE

Thin Compact Semiconductor Die Packages Suitable for Smart-Power Mo...

PACKAGE WITH OVERLAPPING DEVICES

SEMICONDUCTOR PACKAGE WITH AN EMBEDDED PRINTED CIRCUIT BOARD AND ST...