Yun Chen Teng

Person

New Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Laser de-bonding carriers and composite carriers thereof
- Patent number 11,908,708
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion implantation with annealing for substrate cutting
- Patent number 11,855,040
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,728,406
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a FinFET structure that prevents or reduces defo...
- Patent number 11,183,426
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,868,137
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20240387445
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING
- Publication number 20240379616
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF
- Publication number 20240153786
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING
- Publication number 20240120314
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055480
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun Chen TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20230352563
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIEL...
- Publication number 20230282751
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Method of Manufacture, and System of Manufacture
- Publication number 20230063975
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING
- Publication number 20230067088
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER BONDING SYSTEM AND METHOD OF USING THE SAME
- Publication number 20230067346
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flowable Chemical Vapor Deposition (FcvD) Using Multi-Step Anneal T...
- Publication number 20230042726
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic Bonding Gap Control and Tool for Wafer Bonding
- Publication number 20230019415
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser De-Bonding Carriers and Composite Carriers Thereof
- Publication number 20220406621
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ion Implantation with Annealing for Substrate Cutting
- Publication number 20220367410
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huicheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20220367249
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210134984
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A FINFET DEVICE
- Publication number 20200105605
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun Chen Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20200044048
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS

Yun Chen Teng

Person

Patents Grantslast 30 patents

Laser de-bonding carriers and composite carriers thereof

Ion implantation with annealing for substrate cutting

Semiconductor device and method

Method for forming a FinFET structure that prevents or reduces defo...

Semiconductor device and method

Patents Applicationslast 30 patents

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

DYNAMIC BONDING GAP CONTROL AND TOOL FOR WAFER BONDING

LASER DE-BONDING CARRIERS AND COMPOSITE CARRIERS THEREOF

ION IMPLANTATION WITH ANNEALING FOR SUBSTRATE CUTTING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method

BOTTOM DIELECTRIC ISOLATION AND METHODS OF FORMING THE SAME IN FIEL...

Semiconductor Device, Method of Manufacture, and System of Manufacture

TEMPERATURE CONTROLLABLE BONDER EQUIPMENT FOR SUBSTRATE BONDING

WAFER BONDING SYSTEM AND METHOD OF USING THE SAME

Flowable Chemical Vapor Deposition (FcvD) Using Multi-Step Anneal T...

Dynamic Bonding Gap Control and Tool for Wafer Bonding

Laser De-Bonding Carriers and Composite Carriers Thereof

Ion Implantation with Annealing for Substrate Cutting

BONDING SYSTEM AND METHOD FOR USING THE SAME

Semiconductor Device and Method

METHOD FOR FORMING A FINFET DEVICE

SEMICONDUCTOR DEVICE AND METHOD