Yun Ling Tan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Via structures of passive semiconductor devices
- Patent number 11,610,837
- Issue date Mar 21, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film conductive material with conductive etch stop layer
- Patent number 11,315,876
- Issue date Apr 26, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for producing integrated circuits with magnets and a wet et...
- Patent number 10,784,332
- Issue date Sep 22, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated circuits with solutions to interlayer...
- Patent number 10,566,441
- Issue date Feb 18, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hao Nong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for reducing contamination for reliable bond pads
- Patent number 10,410,854
- Issue date Sep 10, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Honghui Mou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for removal of hard mask
- Patent number 10,115,625
- Issue date Oct 30, 2018
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Liang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits having nickel silicide contacts and methods for...
- Patent number 9,548,371
- Issue date Jan 17, 2017
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jingyan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 9,230,886
- Issue date Jan 5, 2016
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through silicon via with wafer backside protection
- Patent number 8,940,637
- Issue date Jan 27, 2015
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to reduce thermal variations within an integra...
- Patent number 8,860,142
- Issue date Oct 14, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Debora Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-K metal gate device
- Patent number 8,853,796
- Issue date Oct 7, 2014
- GLOBALFOUNDIERS Singapore Pte. Ltd.
- Young Way Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer profile engineering using films with continuously increased...
- Patent number 8,828,858
- Issue date Sep 9, 2014
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step-like spacer profile
- Patent number 8,492,236
- Issue date Jul 23, 2013
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus to reduce thermal variations within an integra...
- Patent number 8,293,544
- Issue date Oct 23, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Debora Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 7,326,609
- Issue date Feb 5, 2008
- Chartered Semiconductor Manufacturing, Ltd.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin gate oxide through post decoupled plasma nitridation anneal
- Patent number 7,176,094
- Issue date Feb 13, 2007
- Chartered Semiconductor Manufacturing Ltd.
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES
- Publication number 20220093508
- Publication date Mar 24, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XUESONG RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CONDUCTIVE MATERIAL WITH CONDUCTIVE ETCH STOP LAYER
- Publication number 20210257300
- Publication date Aug 19, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XUESONG RAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH MAGNETS AND A WET ET...
- Publication number 20190296100
- Publication date Sep 26, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUITS WITH SOLUTIONS TO INTERLAYER...
- Publication number 20190252515
- Publication date Aug 15, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hao Nong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS
- Publication number 20190206676
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Honghui MOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR REMOVAL OF HARD MASK
- Publication number 20180190537
- Publication date Jul 5, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Liang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS HAVING NICKEL SILICIDE CONTACTS AND METHODS FOR...
- Publication number 20150311221
- Publication date Oct 29, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Jingyan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20150137359
- Publication date May 21, 2015
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION
- Publication number 20140008810
- Publication date Jan 9, 2014
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lup San Leong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...
- Publication number 20130187202
- Publication date Jul 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STEP-LIKE SPACER PROFILE
- Publication number 20130181259
- Publication date Jul 18, 2013
- Global Foundries Singapore PTE. Ltd.
- Xuesong Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO REDUCE THERMAL VARIATIONS WITHIN AN INTEGRA...
- Publication number 20130099321
- Publication date Apr 25, 2013
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Debora Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-K METAL GATE DEVICE
- Publication number 20120292719
- Publication date Nov 22, 2012
- International Business Machines Corporation
- Young Way TEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus to reduce thermal variations within an integra...
- Publication number 20100019329
- Publication date Jan 28, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Debora Chyiu Hyia Poon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DOPED TRANSISTOR
- Publication number 20080087958
- Publication date Apr 17, 2008
- Chartered Semiconductor Manufacturing LTD.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD
- Publication number 20060252188
- Publication date Nov 9, 2006
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-thin gate oxide through post decoupled plasma nitridation anneal
- Publication number 20030170956
- Publication date Sep 11, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Dong Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Yun Ling Tan

Person

Patents Grantslast 30 patents

Via structures of passive semiconductor devices

Thin film conductive material with conductive etch stop layer

Methods for producing integrated circuits with magnets and a wet et...

Methods of forming integrated circuits with solutions to interlayer...

Method and device for reducing contamination for reliable bond pads

Methods for removal of hard mask

Integrated circuits having nickel silicide contacts and methods for...

Method for forming through silicon via with wafer backside protection

Method for forming through silicon via with wafer backside protection

Method and apparatus to reduce thermal variations within an integra...

High-K metal gate device

Spacer profile engineering using films with continuously increased...

Step-like spacer profile

Method and apparatus to reduce thermal variations within an integra...

Semiconductor device and fabrication method

Ultra-thin gate oxide through post decoupled plasma nitridation anneal

Patents Applicationslast 30 patents

VIA STRUCTURES OF PASSIVE SEMICONDUCTOR DEVICES

THIN FILM CONDUCTIVE MATERIAL WITH CONDUCTIVE ETCH STOP LAYER

METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH MAGNETS AND A WET ET...

METHODS OF FORMING INTEGRATED CIRCUITS WITH SOLUTIONS TO INTERLAYER...

METHOD AND DEVICE FOR REDUCING CONTAMINATION FOR RELIABLE BOND PADS

METHODS FOR REMOVAL OF HARD MASK

INTEGRATED CIRCUITS HAVING NICKEL SILICIDE CONTACTS AND METHODS FOR...

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

METHOD FOR FORMING THROUGH SILICON VIA WITH WAFER BACKSIDE PROTECTION

SPACER PROFILE ENGINEERING USING FILMS WITH CONTINUOUSLY INCREASED...

STEP-LIKE SPACER PROFILE

METHOD AND APPARATUS TO REDUCE THERMAL VARIATIONS WITHIN AN INTEGRA...

HIGH-K METAL GATE DEVICE

Method and apparatus to reduce thermal variations within an integra...

SEMICONDUCTOR DEVICE WITH DOPED TRANSISTOR

SEMICONDUCTOR DEVICE AND FABRICATION METHOD

Ultra-thin gate oxide through post decoupled plasma nitridation anneal