Yung-Cheng Lee

Person

Boulder, CO, US

People

Patents Grantslast 30 patents

Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 12,188,732
- Issue date Jan 7, 2025
- The Regents of the University of Colorado
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and device for optimization of vapor transport in a thermal...
- Patent number 12,104,856
- Issue date Oct 1, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management planes
- Patent number 11,988,453
- Issue date May 21, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Folding thermal ground plane
- Patent number 11,930,621
- Issue date Mar 12, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 11,898,807
- Issue date Feb 13, 2024
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micropillar-enabled thermal ground plane
- Patent number 11,598,594
- Issue date Mar 7, 2023
- The Regents of the University of Colorado
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conformal thermal ground planes
- Patent number 11,511,377
- Issue date Nov 29, 2022
- ROCCOR, LLC
- Michael Hulse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal ground plane
- Patent number 11,353,269
- Issue date Jun 7, 2022
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single and multi-layer mesh structures for enhanced thermal transport
- Patent number 11,306,983
- Issue date Apr 19, 2022
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Micropillar-enabled thermal ground plane
- Patent number 10,731,925
- Issue date Aug 4, 2020
- The Regents of the University of Colorado, a Body Corporate
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and device for spreading high heat fluxes in thermal ground...
- Patent number 10,724,804
- Issue date Jul 28, 2020
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermal ground plane
- Patent number 10,571,200
- Issue date Feb 25, 2020
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal ground plane
- Patent number 10,527,358
- Issue date Jan 7, 2020
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conformal thermal ground planes
- Patent number 10,458,716
- Issue date Oct 29, 2019
- ROCCOR, LLC
- Michael Hulse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanically improved microelectronic thermal interface structure f...
- Patent number 10,446,466
- Issue date Oct 15, 2019
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer-based microfabricated thermal ground plane
- Patent number 9,921,004
- Issue date Mar 20, 2018
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible thermal ground plane and manufacturing the same
- Patent number 9,909,814
- Issue date Mar 6, 2018
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible thermal ground plane and manufacturing the same
- Patent number 9,651,312
- Issue date May 16, 2017
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible thermal ground plane and manufacturing the same
- Patent number 9,163,883
- Issue date Oct 20, 2015
- KEVLIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Atomic layer deposition on micro-mechanical devices
- Patent number 7,426,067
- Issue date Sep 16, 2008
- Regents of the University of Colorado
- Victor M. Bright
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Article comprising a stacked array of electronic subassemblies
- Patent number 5,049,982
- Issue date Sep 17, 1991
- AT&T Bell Laboratories
- Yung-Cheng Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-Dimensional Meshes and Casings for Thermal Ground Planes
- Publication number 20250031347
- Publication date Jan 23, 2025
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20240369306
- Publication date Nov 7, 2024
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
- Publication number 20240133643
- Publication date Apr 25, 2024
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
- Publication number 20230332841
- Publication date Oct 19, 2023
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Folding Thermal Ground Plane
- Publication number 20230292466
- Publication date Sep 14, 2023
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
- Publication number 20220221233
- Publication date Jul 14, 2022
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20220163268
- Publication date May 26, 2022
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
- Publication number 20220155025
- Publication date May 19, 2022
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20220074673
- Publication date Mar 10, 2022
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Folding Thermal Ground Plane
- Publication number 20210400846
- Publication date Dec 23, 2021
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan J. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT
- Publication number 20210131753
- Publication date May 6, 2021
- The Regents of the University of Colorado, a Body Corporate
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
- Publication number 20200300563
- Publication date Sep 24, 2020
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL GROUND PLANE
- Publication number 20200191495
- Publication date Jun 18, 2020
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL THERMAL GROUND PLANES
- Publication number 20200149820
- Publication date May 14, 2020
- Roccor, LLC
- Michael Hulse
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
- Publication number 20190390919
- Publication date Dec 26, 2019
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Microfluidic Devices And Methods For Cellular Thermal Shift Assays
- Publication number 20190358630
- Publication date Nov 28, 2019
- The Regents of the University of Colorado, a Body Corporate
- William Old
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE F...
- Publication number 20190341328
- Publication date Nov 7, 2019
- Raytheon Company
- Jason G. Milne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT PLANES
- Publication number 20180320984
- Publication date Nov 8, 2018
- Ryan J. Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND DEVICE FOR SPREADING HIGH HEAT FLUXES IN THERMAL GROUND...
- Publication number 20180128553
- Publication date May 10, 2018
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD AND DEVICE FOR OPTIMIZATION OF VAPOR TRANSPORT IN A THERMAL...
- Publication number 20180106554
- Publication date Apr 19, 2018
- KELVIN THERMAL TECHNOLOGIES, INC.
- RYAN JOHN LEWIS
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL GROUND PLANE
- Publication number 20170299277
- Publication date Oct 19, 2017
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL GROUND PLANE
- Publication number 20170030654
- Publication date Feb 2, 2017
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE THERMAL GROUND PLANE AND MANUFACTURING THE SAME
- Publication number 20160187070
- Publication date Jun 30, 2016
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ronggui Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE
- Publication number 20160161193
- Publication date Jun 9, 2016
- KELVIN THERMAL TECHNOLOGIES, INC.
- Ryan John Lewis
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROPILLAR-ENABLED THERMAL GROUND PLANE
- Publication number 20160076820
- Publication date Mar 17, 2016
- The Regents of the University of Colorado, a Body Corporate
- Ryan John Lewis
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
VACUUM-ENHANCED HEAT SPREADER
- Publication number 20160081227
- Publication date Mar 17, 2016
- The Regents of the University of Colorado, a Body Corporate
- Yung-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT REACHABLE EXPANDABLE HEAT PLATE
- Publication number 20150129174
- Publication date May 14, 2015
- Robert J. Monson
- F28 - HEAT EXCHANGE IN GENERAL

Yung-Cheng Lee

Person

Patents Grantslast 30 patents

Single and multi-layer mesh structures for enhanced thermal transport

Method and device for optimization of vapor transport in a thermal...

Thermal management planes

Folding thermal ground plane

Single and multi-layer mesh structures for enhanced thermal transport

Micropillar-enabled thermal ground plane

Conformal thermal ground planes

Thermal ground plane

Single and multi-layer mesh structures for enhanced thermal transport

Micropillar-enabled thermal ground plane

Method and device for spreading high heat fluxes in thermal ground...

Thermal ground plane

Thermal ground plane

Conformal thermal ground planes

Mechanically improved microelectronic thermal interface structure f...

Polymer-based microfabricated thermal ground plane

Flexible thermal ground plane and manufacturing the same

Flexible thermal ground plane and manufacturing the same

Flexible thermal ground plane and manufacturing the same

Atomic layer deposition on micro-mechanical devices

Article comprising a stacked array of electronic subassemblies

Patents Applicationslast 30 patents

Three-Dimensional Meshes and Casings for Thermal Ground Planes

THERMAL MANAGEMENT PLANES

SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT

MICROPILLAR-ENABLED THERMAL GROUND PLANE

Folding Thermal Ground Plane

SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT

THERMAL MANAGEMENT PLANES

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

THERMAL MANAGEMENT PLANES

Folding Thermal Ground Plane

SINGLE AND MULTI-LAYER MESH STRUCTURES FOR ENHANCED THERMAL TRANSPORT

MICROPILLAR-ENABLED THERMAL GROUND PLANE

THERMAL GROUND PLANE

CONFORMAL THERMAL GROUND PLANES

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

Microfluidic Devices And Methods For Cellular Thermal Shift Assays

MECHANICALLY IMPROVED MICROELECTRONIC THERMAL INTERFACE STRUCTURE F...

THERMAL MANAGEMENT PLANES

METHOD AND DEVICE FOR SPREADING HIGH HEAT FLUXES IN THERMAL GROUND...

METHOD AND DEVICE FOR OPTIMIZATION OF VAPOR TRANSPORT IN A THERMAL...

THERMAL GROUND PLANE

THERMAL GROUND PLANE

FLEXIBLE THERMAL GROUND PLANE AND MANUFACTURING THE SAME

POLYMER-BASED MICROFABRICATED THERMAL GROUND PLANE

MICROPILLAR-ENABLED THERMAL GROUND PLANE

VACUUM-ENHANCED HEAT SPREADER

COMPONENT REACHABLE EXPANDABLE HEAT PLATE