Yung-Haw Liaw

Person

Hsin, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for controlling exhaust flow in wafer processing module
- Patent number 9,892,982
- Issue date Feb 13, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Shu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge damage prevention method on masks
- Patent number 6,365,303
- Issue date Apr 2, 2002
- Taiwan Semiconductor Manufacturing Company
- Chang-Cheng Hung
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrostatic discharge-free container equipped with metal shield
- Patent number 6,247,599
- Issue date Jun 19, 2001
- Taiwan Semiconductor Manufacturing Company, Ltd
- Dong-Hsu Cheng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Procedure for elimating flourine degradation of WSi.sub.x /oxide/po...
- Patent number 6,143,618
- Issue date Nov 7, 2000
- Taiwan Semiconductor Manufacturing Company
- Hsin-Pai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing sheet resistance uniformity of chemical vapor...
- Patent number 6,127,269
- Issue date Oct 3, 2000
- Taiwan Semiconductor Manufacturing Company
- Yung-Haw Liaw
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning residue on a semiconductor wafer bonding pad
- Patent number 5,731,243
- Issue date Mar 24, 1998
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-min Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOG coated apparatus to solve SOG non-uniformity in the VLSI process
- Patent number 5,454,871
- Issue date Oct 3, 1995
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Haw Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent silicide bubble in the VLSI process
- Patent number 5,434,096
- Issue date Jul 18, 1995
- Taiwan Semiconductor Manufacturing Company LTD.
- Cheng-Te Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to solve sog non-uniformity in the VLSI process
- Patent number 5,371,046
- Issue date Dec 6, 1994
- Taiwan Semiconductor Manufacturing Company
- Yung-Haw Liaw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitrogen plasma treatment to prevent field device leakage in VLSI p...
- Patent number 5,334,554
- Issue date Aug 2, 1994
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kwang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR CONTROLLING EXHAUST FLOW IN WAFER PROCESSING MODULE
- Publication number 20150191816
- Publication date Jul 9, 2015
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Shu TSENG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Yung-Haw Liaw

Person

Patents Grantslast 30 patents

Method for controlling exhaust flow in wafer processing module

Electrostatic discharge damage prevention method on masks

Electrostatic discharge-free container equipped with metal shield

Procedure for elimating flourine degradation of WSi.sub.x /oxide/po...

Method for enhancing sheet resistance uniformity of chemical vapor...

Method of cleaning residue on a semiconductor wafer bonding pad

SOG coated apparatus to solve SOG non-uniformity in the VLSI process

Method to prevent silicide bubble in the VLSI process

Method to solve sog non-uniformity in the VLSI process

Nitrogen plasma treatment to prevent field device leakage in VLSI p...

Patents Applicationslast 30 patents

METHOD FOR CONTROLLING EXHAUST FLOW IN WAFER PROCESSING MODULE