Yung-Hsiang Lin

Person

Sijhih City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for improving gut microbiota with lactiplantibacillus planta...
- Patent number 12,161,683
- Issue date Dec 10, 2024
- TCI Co., Ltd.
- Yung-Hsiang Lin
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Grant
High electron mobility transistor and fabrication method thereof
- Patent number 12,132,103
- Issue date Oct 29, 2024
- Vanguard International Semiconductor Corporation
- Yung-Fong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switch and scheduling method for packet forwarding of the same
- Patent number 12,120,038
- Issue date Oct 15, 2024
- Realtek Semiconductor Corp.
- Kuo-Cheng Lu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Pipe plier structure
- Patent number 12,109,669
- Issue date Oct 8, 2024
- Yung-Sheng Lin
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bluetooth audio broadcasting system and related multi-member Blueto...
- Patent number 12,101,608
- Issue date Sep 24, 2024
- Realtek Semiconductor Corp.
- Yu Hsuan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bluetooth communication system capable of increasing generation eff...
- Patent number 12,096,209
- Issue date Sep 17, 2024
- Realtek Semiconductor Corp.
- Yu Hsuan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Isolation bonding film for semiconductor packages and methods of fo...
- Patent number 12,087,732
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for skin brightening using Chenopodium formosanum (Djulis) e...
- Patent number 12,076,435
- Issue date Sep 3, 2024
- TCI Co., Ltd.
- Yung-Hsiang Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Titanium catalyst and synthesizing polyester resins
- Patent number 12,064,754
- Issue date Aug 20, 2024
- National Tsing Hua University
- Yi-Chou Tsai
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,057,670
- Issue date Aug 6, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for promoting intestinal health and for enhancing antioxida...
- Patent number 12,048,725
- Issue date Jul 30, 2024
- TCI Co., Ltd.
- Yung-Hsiang Lin
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Motor cover
- Patent number D1036381
- Issue date Jul 23, 2024
- Champ Tech Optical (Foshan) Corporation
- Yu-Ching Lin
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Bump structure and method of making the same
- Patent number 12,033,870
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsiung Lu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 12,027,413
- Issue date Jul 2, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 12,015,008
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip structure and method for forming the same
- Patent number 12,015,002
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution lines with protection layers and method forming same
- Patent number 12,009,256
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bluetooth communication system capable of increasing generation eff...
- Patent number 11,997,480
- Issue date May 28, 2024
- Realtek Semiconductor Corp.
- Yu Hsuan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for closed-loop camera shutter control and rem...
- Patent number 11,994,787
- Issue date May 28, 2024
- Dell Products L.P.
- Geroncio O. Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bluetooth communication system and related computer program product...
- Patent number 11,991,767
- Issue date May 21, 2024
- Realtek Semiconductor Corp.
- Qing Gu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,990,440
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bluetooth communication system capable of increasing generation eff...
- Patent number 11,991,517
- Issue date May 21, 2024
- Realtek Semiconductor Corp.
- Yu Hsuan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3DIC structure and methods of forming
- Patent number 11,984,431
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding method
- Patent number 11,973,055
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automatic nucleic acid detection system and method thereof
- Patent number 11,965,898
- Issue date Apr 23, 2024
- TCI GENE INC
- Yung-Hsiang Lin
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,955,542
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Hsin-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,955,397
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Shin-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damage prevention during wafer edge trimming
- Patent number 11,951,569
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,955,522
- Issue date Apr 9, 2024
- Vanguard International Semiconductor Corporation
- Cheng-Wei Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, and sem...
- Patent number 11,948,920
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- I-Chun Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMPELLER FOR HEAT DISSIPATION FAN, HEAT DISSIPATION FAN HAVING THE...
- Publication number 20240410388
- Publication date Dec 12, 2024
- CHAMP TECH OPTICAL (FOSHAN) CORPORATION
- XIAO-GUANG MA
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
METHODS FOR ENHANCING SKIN RESISTANCE, IMPROVING SKIN SMOOTHNESS, O...
- Publication number 20240390260
- Publication date Nov 28, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR IMPROVING BONE HEALTH BY USING MANGOSTEEN SHELL EXTRACT
- Publication number 20240390441
- Publication date Nov 28, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHODS FOR SUPPLEMENTING IRON, PROMOTING IRON ABSORPTION, AND/OR I...
- Publication number 20240390447
- Publication date Nov 28, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20240387465
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LACTOBACILLUS SAKEI TCI147 AND METHOD FOR IMPROVING SKIN CONDITION...
- Publication number 20240374505
- Publication date Nov 14, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
Bond Films for Reduced Thermal Resistance and Methods Forming the Same
- Publication number 20240379505
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stealth Patterning Formation for Bonding Improvement
- Publication number 20240363359
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
- Publication number 20240355784
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240332235
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20240321626
- Publication date Sep 26, 2024
- Vanguard International Semiconductor Corporation
- Yang Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240321694
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240312836
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Tsu Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Semiconductor Dies Through Wafer Bonding Processes
- Publication number 20240312952
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEPETA CATARIA L. EXTRACT AND METHODS FOR IMPROVING SLEEP AND RESIS...
- Publication number 20240299479
- Publication date Sep 12, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME
- Publication number 20240290656
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROJECTOR AND CONTROL METHOD THEREOF
- Publication number 20240281217
- Publication date Aug 22, 2024
- CORETRONIC CORPORATION
- Tzu-Hai Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...
- Publication number 20240274461
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chia-Yin CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MANAGING SETTINGS BASED UPON INFORMATION HA...
- Publication number 20240272675
- Publication date Aug 15, 2024
- DELL PRODUCTS, L.P.
- Todd Erick Swierk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP STRUCTURE AND METHOD OF MAKING THE SAME
- Publication number 20240266190
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung LU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR MANAGING NOTIFICATIONS IN RESPONSE TO MULTI...
- Publication number 20240264885
- Publication date Aug 8, 2024
- DELL PRODUCTS, L.P.
- Daniel L. Hamlin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR IMPROVING BONE QUALITY AND PROMOTING CARTILAGE DIFFEREN...
- Publication number 20240261354
- Publication date Aug 8, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS
- Publication number 20240258259
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Min HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LACTICASEIBACILLUS PARACASEI TCI077 AND METHOD FOR CONDITIONING SKI...
- Publication number 20240245734
- Publication date Jul 25, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
Information Patent Application
METHOD FOR REGULATING IMMUNITY BY USING BLACK HULLESS BARLEY EXTRACT
- Publication number 20240245746
- Publication date Jul 25, 2024
- TCI Co., Ltd.
- YUNG-HSIANG LIN
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WAFER BONDING METHOD
- Publication number 20240250061
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chi Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOMOGENEOUS COMPOSITE SUBSTRATE
- Publication number 20240227347
- Publication date Jul 11, 2024
- TAIWAN TEXTILE RESEARCH INSTITUTE
- Shang-Chih CHOU
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for Sigulating Semiconductor Devices and Package Device Incl...
- Publication number 20240222292
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Ju Tsou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20240213403
- Publication date Jun 27, 2024
- EPISTAR CORPORATION
- Tien-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS

Yung-Hsiang Lin

Person

Patents Grantslast 30 patents

Method for improving gut microbiota with lactiplantibacillus planta...

High electron mobility transistor and fabrication method thereof

Switch and scheduling method for packet forwarding of the same

Pipe plier structure

Bluetooth audio broadcasting system and related multi-member Blueto...

Bluetooth communication system capable of increasing generation eff...

Isolation bonding film for semiconductor packages and methods of fo...

Method for skin brightening using Chenopodium formosanum (Djulis) e...

Titanium catalyst and synthesizing polyester resins

Semiconductor package structure and method for manufacturing the same

Methods for promoting intestinal health and for enhancing antioxida...

Motor cover

Bump structure and method of making the same

Semiconductor structure and method of fabricating the same

Wafer bonding method

Chip structure and method for forming the same

Redistribution lines with protection layers and method forming same

Bluetooth communication system capable of increasing generation eff...

Method and apparatus for closed-loop camera shutter control and rem...

Bluetooth communication system and related computer program product...

Structure and formation method of semiconductor device with conduct...

Bluetooth communication system capable of increasing generation eff...

3DIC structure and methods of forming

Wafer bonding method

Automatic nucleic acid detection system and method thereof

Semiconductor device

Semiconductor structure

Damage prevention during wafer edge trimming

Semiconductor structure and method of forming the same

Semiconductor device and method for manufacturing the same, and sem...

Patents Applicationslast 30 patents

IMPELLER FOR HEAT DISSIPATION FAN, HEAT DISSIPATION FAN HAVING THE...

METHODS FOR ENHANCING SKIN RESISTANCE, IMPROVING SKIN SMOOTHNESS, O...

METHOD FOR IMPROVING BONE HEALTH BY USING MANGOSTEEN SHELL EXTRACT

METHODS FOR SUPPLEMENTING IRON, PROMOTING IRON ABSORPTION, AND/OR I...

INTEGRATED CIRCUIT PACKAGES AND METHOD OF FORMING THE SAME

Method for Forming a Semiconductor Device Having TSV Formed Through...

LACTOBACILLUS SAKEI TCI147 AND METHOD FOR IMPROVING SKIN CONDITION...

Bond Films for Reduced Thermal Resistance and Methods Forming the Same

Stealth Patterning Formation for Bonding Improvement

HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Bonding Semiconductor Dies Through Wafer Bonding Processes

NEPETA CATARIA L. EXTRACT AND METHODS FOR IMPROVING SLEEP AND RESIS...

REDISTRIBUTION LINES WITH PROTECTION LAYERS AND METHOD FORMING SAME

PROJECTOR AND CONTROL METHOD THEREOF

BONDING TOOL FOR PROVIDING CHIP ON WAFER BOND AND METHODS FOR PERFO...

SYSTEMS AND METHODS FOR MANAGING SETTINGS BASED UPON INFORMATION HA...

BUMP STRUCTURE AND METHOD OF MAKING THE SAME

SYSTEMS AND METHODS FOR MANAGING NOTIFICATIONS IN RESPONSE TO MULTI...

METHODS FOR IMPROVING BONE QUALITY AND PROMOTING CARTILAGE DIFFEREN...

SEMICONDUCTOR DEVICE STRUCTURE WITH CONDUCTIVE BUMPS

LACTICASEIBACILLUS PARACASEI TCI077 AND METHOD FOR CONDITIONING SKI...

METHOD FOR REGULATING IMMUNITY BY USING BLACK HULLESS BARLEY EXTRACT

WAFER BONDING METHOD

HOMOGENEOUS COMPOSITE SUBSTRATE

Method for Sigulating Semiconductor Devices and Package Device Incl...

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME