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Yung-Li Lu

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  • Linyuan Township, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Stackable semiconductor package
    • Patent number 7,589,408
    • Issue date Sep 15, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stackable semiconductor package
    • Patent number 7,550,832
    • Issue date Jun 23, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package with a ring having a buffer groove that surrounds the...
    • Patent number 7,547,962
    • Issue date Jun 16, 2009
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip package and package process thereof
    • Patent number 7,432,127
    • Issue date Oct 7, 2008
    • Advanced Semiconductor Engineering Inc.
    • Yung-Li Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stackable semiconductor package
    • Patent number 7,365,427
    • Issue date Apr 29, 2008
    • Advanced Semiconductor Engineering, Inc.
    • Yung-Li Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Sensor chip packaging structure
    • Patent number 7,187,067
    • Issue date Mar 6, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Semiconductor package
    • Patent number 7,126,221
    • Issue date Oct 24, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Contact sensor package structure
    • Patent number 7,122,757
    • Issue date Oct 17, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Shih-Chang Lee
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Semiconductor package structure
    • Patent number 7,122,893
    • Issue date Oct 17, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Chip on glass package
    • Patent number 7,049,689
    • Issue date May 23, 2006
    • Advanced Semiconductor Engineering, Inc.
    • Ying-Tsai Yeh
    • G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

  • Information Patent Application

    Stackable semiconductor package
    • Publication number 20080042251
    • Publication date Feb 21, 2008
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stackable semiconductor package
    • Publication number 20070278640
    • Publication date Dec 6, 2007
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Stackable semiconductor package
    • Publication number 20070278696
    • Publication date Dec 6, 2007
    • Yung-Li Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKABLE SEMICONDUCTOR PACKAGE
    • Publication number 20070246815
    • Publication date Oct 25, 2007
    • Yung-Li Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Chip package
    • Publication number 20070222041
    • Publication date Sep 27, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CHIP PACKAGE STRUCTURE
    • Publication number 20070075441
    • Publication date Apr 5, 2007
    • Advanced Semiconductor Engineering, Inc.
    • Cheng-Yin Lee
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Chip Package and Package Process Thereof
    • Publication number 20070042534
    • Publication date Feb 22, 2007
    • ADVANCED SEMICONDUCTOR ENGINEERING INC.
    • Yung-Li Lu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Sensor chip packaging structure
    • Publication number 20060091515
    • Publication date May 4, 2006
    • Gwo-Liang Weng
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Semiconductor package and method of manufacturing the same
    • Publication number 20050275074
    • Publication date Dec 15, 2005
    • Gwo-Liang Weng
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Contact sensor package structure
    • Publication number 20050274597
    • Publication date Dec 15, 2005
    • Shih-Chang Lee
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Application

    Chip on glass package
    • Publication number 20050062142
    • Publication date Mar 24, 2005
    • Advanced Semiconductor Engineering, Inc.
    • Ying-Tsai Yeh
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    Semiconductor package structure
    • Publication number 20050051885
    • Publication date Mar 10, 2005
    • Gwo-Liang Weng
    • H01 - BASIC ELECTRIC ELEMENTS