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Tsing Yi, HK
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last 30 patents
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Patent Grant
Leadframe for enhanced downbond registration during automatic wire...
Patent number
6,822,319
Issue date
Nov 23, 2004
QPL Limited
Yung Piu Lau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for enhanced downbond registration during automatic wire...
Patent number
6,667,073
Issue date
Dec 23, 2003
Quality Platers Limited
Yung Piu Lau
H01 - BASIC ELECTRIC ELEMENTS