Claims
- 1. A leadframe comprising:a die attach pad for mounting a semiconductor die thereon; a plurality of contacts circumscribing said die attach pad; silver plating disposed on a portion of said die attach pad, around a periphery thereof; and a layer of organo-metallic complexes disposed on portions of the die attach pad not covered by said silver plating.
- 2. The leadframe according to claim 1, wherein said silver plating comprises at least one of a ring, a line and an array of dots on said die attach pad.
- 3. An integrated circuit package comprising:a die attach pad; a semiconductor die mounted to a portion of said die attach pad; at least one row of contacts circumscribing said die attach pad; silver plating disposed on a portion of said die attach pad, around a periphery of said die attach pad and outside a perimeter of said semiconductor die; a plurality of wire bonds connecting said die to ones of said contact pads and connecting said die to said portion of said die attach pad with silver plating; and a layer of organo-metallic complexes disposed on portions of the die attach pad not covered by said silver plating.
- 4. The integrated circuit package according to claim 3 wherein said silver plating comprises at least one of a ring, a line and an array of dots on said die attach pad.
- 5. The integrated circuit package according to claim 3 wherein said silver plating comprises said semiconductor die and all except one surface of said at least one row of contact pads and said die attach pad.
- 6. The integrated circuit package according to claim 3, wherein said contacts comprise contact pads.
- 7. The integrated circuit package according to claim 3, wherein said organo-metallic complex improves the adhesion of epoxy molding compound to the copper leadframe surface.
Parent Case Info
This application is a Divisional of U.S. patent application Ser. No. 10/140,318 filed May 7, 2002, now U.S. Pat. No. 6,667,013.
US Referenced Citations (7)
Foreign Referenced Citations (2)
Number |
Date |
Country |
63010547 |
Jan 1988 |
JP |
2002-110879 |
Apr 2002 |
JP |