Yung-Tsung Wei

Person

Pai-Ho Chen, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Adaptive scan method for image/video coding
- Patent number 8,000,546
- Issue date Aug 16, 2011
- National Cheng Kung University
- Jar-Ferr Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method of removing contaminants from a silicon wafer after chemical...
- Patent number 7,232,752
- Issue date Jun 19, 2007
- United Microelectronics Corp.
- Shao-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post-CMP removal of surface contaminants from silicon wafer
- Patent number 6,696,361
- Issue date Feb 24, 2004
- United Microelectronics Corp.
- Shao-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method for copper
- Patent number 6,616,510
- Issue date Sep 9, 2003
- United Microelectronics Corp.
- Chia-Lin Hsu
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head for chemical mechanical polishing
- Patent number 6,569,771
- Issue date May 27, 2003
- United Microelectronics Corp.
- Juen-Kuen Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Method for stabilizing low dielectric constant materials
- Patent number 6,486,079
- Issue date Nov 26, 2002
- United Microelectronics Corp.
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing carbon-rich particles adhered on a copper surface
- Patent number 6,455,432
- Issue date Sep 24, 2002
- United Microelectronics Corp.
- Teng-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing micro-scratch on metal layer
- Patent number 6,380,069
- Issue date Apr 30, 2002
- United Microelectronics Corp.
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE SCAN METHOD FOR IMAGE/VIDEO CODING
- Publication number 20100027902
- Publication date Feb 4, 2010
- National Cheng Kung University
- Jar-Ferr Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CMP PROCESS OF HIGH SELECTIVITY
- Publication number 20060252266
- Publication date Nov 9, 2006
- Chih-Yueh Lee
- B24 - GRINDING POLISHING
Information Patent Application
Post-CMP removal of surface contaminants from silicon wafer
- Publication number 20040033696
- Publication date Feb 19, 2004
- United Microelectronics Corp.
- Shao-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20030079836
- Publication date May 1, 2003
- Juen-Kuen Lin
- B24 - GRINDING POLISHING
Information Patent Application
Method for removing hard-mask layer after metal-CMP in dual-damasce...
- Publication number 20020182853
- Publication date Dec 5, 2002
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for surface treatment protecting metallic surface of semicon...
- Publication number 20020177308
- Publication date Nov 28, 2002
- United Microelectronics Corp.
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post-CMP removal of surface contaminants from silicon
- Publication number 20020155681
- Publication date Oct 24, 2002
- Shao-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a damascene structure
- Publication number 20020137319
- Publication date Sep 26, 2002
- United Microelectronics Corp.
- Chia-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STABILIZING LOW DIELECTRIC CONSTANT MATERIALS
- Publication number 20020115305
- Publication date Aug 22, 2002
- Cheng-Yuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of fabricating a damascene structure
- Publication number 20020106877
- Publication date Aug 8, 2002
- Chia-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing cooper interconnects by using a cap layer
- Publication number 20020102840
- Publication date Aug 1, 2002
- Teng-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving curvature of the polished surface by chemical...
- Publication number 20020090893
- Publication date Jul 11, 2002
- United Microelectronics Corp.
- Chia-Lin Hsu
- B24 - GRINDING POLISHING
Information Patent Application
Method for removing carbon-rich particles adhered on the exposed co...
- Publication number 20020068435
- Publication date Jun 6, 2002
- United Microelectronics Corp.
- Teng-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for removing carbon-rich particles adhered on a copper surface
- Publication number 20020068455
- Publication date Jun 6, 2002
- United Microelectronics Corp.
- Teng-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical mechanical polishing method for copper
- Publication number 20020065025
- Publication date May 30, 2002
- United Microelectronics Corp.
- Chia-Lin Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Yung-Tsung Wei

Person

Patents Grantslast 30 patents

Adaptive scan method for image/video coding

Method of removing contaminants from a silicon wafer after chemical...

Post-CMP removal of surface contaminants from silicon wafer

Chemical mechanical polishing method for copper

Carrier head for chemical mechanical polishing

Method for stabilizing low dielectric constant materials

Method for removing carbon-rich particles adhered on a copper surface

Method of removing micro-scratch on metal layer

Patents Applicationslast 30 patents

ADAPTIVE SCAN METHOD FOR IMAGE/VIDEO CODING

CMP PROCESS OF HIGH SELECTIVITY

Post-CMP removal of surface contaminants from silicon wafer

CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING

Method for removing hard-mask layer after metal-CMP in dual-damasce...

Method for surface treatment protecting metallic surface of semicon...

Post-CMP removal of surface contaminants from silicon

Method of fabricating a damascene structure

METHOD FOR STABILIZING LOW DIELECTRIC CONSTANT MATERIALS

Method of fabricating a damascene structure

Method for manufacturing cooper interconnects by using a cap layer

Method for improving curvature of the polished surface by chemical...

Method for removing carbon-rich particles adhered on the exposed co...

Method for removing carbon-rich particles adhered on a copper surface

Chemical mechanical polishing method for copper