YUNHYEOK IM

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including composite molding structure
- Patent number 11,908,774
- Issue date Feb 20, 2024
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,837,581
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Youngsang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,502,061
- Issue date Nov 15, 2022
- Samsung Electronics Co., Ltd.
- Youngsang Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including composite molding structure
- Patent number 11,373,933
- Issue date Jun 28, 2022
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including heat dissipation layer
- Patent number 11,251,102
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,037,913
- Issue date Jun 15, 2021
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,665,574
- Issue date May 26, 2020
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor chips having heat dissipation layers and gro...
- Patent number 9,978,661
- Issue date May 22, 2018
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 9,583,430
- Issue date Feb 28, 2017
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat exhaust part
- Patent number 9,391,009
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 9,356,002
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package devices, methods of fabricating the same, and se...
- Patent number 9,324,696
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Mi-Na Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a heat slug and a spacer
- Patent number 9,190,338
- Issue date Nov 17, 2015
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 9,029,998
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Eon Soo Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,024,434
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including heat diffusion vias and interconne...
- Patent number 9,013,031
- Issue date Apr 21, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A HEAT DISSIPATION STRUCTURE
- Publication number 20230290701
- Publication date Sep 14, 2023
- Samsung Electronics Co., Ltd.
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT DISSIPATION CHARACTERISTICS
- Publication number 20230207414
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- YOUNGSANG CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230207417
- Publication date Jun 29, 2023
- YOUNGSANG CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230061795
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Youngsang CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE
- Publication number 20220328381
- Publication date Oct 13, 2022
- Samsung Electronics Co., Ltd.
- HEESEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20210296198
- Publication date Sep 23, 2021
- Samsung Electronics Co., Ltd.
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE
- Publication number 20210272880
- Publication date Sep 2, 2021
- Samsung Electronics Co., Ltd.
- HEESEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20200381400
- Publication date Dec 3, 2020
- Samsung Electronics Co., Ltd.
- HEESEOK LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200328187
- Publication date Oct 15, 2020
- Samsung Electronics Co., Ltd.
- Youngsang CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200251455
- Publication date Aug 6, 2020
- Samsung Electronics Co., Ltd.
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20190229100
- Publication date Jul 25, 2019
- Samsung Electronics Co., Ltd.
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20180269126
- Publication date Sep 20, 2018
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20170047264
- Publication date Feb 16, 2017
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150357269
- Publication date Dec 10, 2015
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150171028
- Publication date Jun 18, 2015
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICE
- Publication number 20150115467
- Publication date Apr 30, 2015
- Kyol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICES, METHODS OF FABRICATING THE SAME, AND SE...
- Publication number 20150061095
- Publication date Mar 5, 2015
- Mi-Na Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...
- Publication number 20140367860
- Publication date Dec 18, 2014
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A SYSTEM-IN-PACKAGE STRUCTURE
- Publication number 20140353813
- Publication date Dec 4, 2014
- Samsung Electronics Co., Ltd.
- Kyol Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20140339708
- Publication date Nov 20, 2014
- Eon Soo JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120280382
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175782
- Publication date Jul 12, 2012
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120139097
- Publication date Jun 7, 2012
- JEONGGI JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20120119346
- Publication date May 17, 2012
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS

YUNHYEOK IM

Person

Patents Grantslast 30 patents

Semiconductor package including composite molding structure

Semiconductor package

Semiconductor package

Semiconductor package including composite molding structure

Semiconductor module including heat dissipation layer

Semiconductor package

Semiconductor package

Packaged semiconductor chips having heat dissipation layers and gro...

Package-on-package device

Semiconductor packages including heat exhaust part

Semiconductor package and method for manufacturing the same

Package-on-package devices, methods of fabricating the same, and se...

Semiconductor package having a heat slug and a spacer

Semiconductor package device

Semiconductor packages

Semiconductor packages including heat diffusion vias and interconne...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A HEAT DISSIPATION STRUCTURE

SEMICONDUCTOR PACKAGE HAVING IMPROVED HEAT DISSIPATION CHARACTERISTICS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE

SEMICONDUCTOR MODULE INCLUDING HEAT DISSIPATION LAYER

SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE-ON-PACKAGE DEVICE

PACKAGE-ON-PACKAGE DEVICES, METHODS OF FABRICATING THE SAME, AND SE...

SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNE...

SEMICONDUCTOR PACKAGE HAVING A SYSTEM-IN-PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME