Yunrae Cho

Person

Guri-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 12,154,881
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,119,329
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including low-k dielectric layer
- Patent number 11,776,894
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,769,755
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device having redistribution pattern
- Patent number 11,640,951
- Issue date May 2, 2023
- Samsung Electronics Co., Ltd.
- Yunrae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,335,668
- Issue date May 17, 2022
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170429
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420355
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Eunkyul Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230387083
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20230230915
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20230223374
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20230086202
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Aenee Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005883
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Hyunkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220262769
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210134761
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- EUNKYUL OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN
- Publication number 20210066231
- Publication date Mar 4, 2021
- Samsung Electronics Co., Ltd.
- Yunrae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER
- Publication number 20210057328
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Yeonjin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit device having redistribution pattern

Semiconductor package and method of fabricating the same

Semiconductor chip including low-k dielectric layer

Semiconductor package and method of fabricating the same

Integrated circuit device having redistribution pattern

Semiconductor package and method of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INTEGRATED CIRCUIT DEVICE HAVING REDISTRIBUTION PATTERN

SEMICONDUCTOR CHIP INCLUDING LOW-K DIELECTRIC LAYER