YunSeok CHOI

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Imaging system for generating high dynamic range image
- Patent number 12,212,856
- Issue date Jan 28, 2025
- Samsung Electronics Co., Ltd.
- Jeongguk Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor module, image processing system, and image compression...
- Patent number 12,169,950
- Issue date Dec 17, 2024
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,142,573
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image compression method using saturated pixel, encoder, and electr...
- Patent number 12,087,019
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module, image processing device and image compression method
- Patent number 12,015,803
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package
- Patent number 11,848,307
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Sungwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing apparatus including neural network processor and m...
- Patent number 11,838,651
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Irina Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mobile electronic devices having multi-camera modules
- Patent number 11,838,657
- Issue date Dec 5, 2023
- Samsung Electronics Co., Ltd.
- Soyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, image processing system and image compression method
- Patent number 11,823,417
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor module, image processing system, and image compression...
- Patent number 11,818,369
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,784,131
- Issue date Oct 10, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stiffening structure
- Patent number 11,776,918
- Issue date Oct 3, 2023
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder, image decoder, and image processing method
- Patent number 11,770,541
- Issue date Sep 26, 2023
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor, electronic device including the image sensor and conf...
- Patent number 11,765,467
- Issue date Sep 19, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Device for improving image resolution in camera system having lens...
- Patent number 11,758,288
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Imaging system for generating high dynamic range image
- Patent number 11,653,101
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor and image processing system comprising the same
- Patent number 11,637,963
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image compression method, encoder, and camera module including the...
- Patent number 11,627,250
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring protection layer on an interposer with a through electrode
- Patent number 11,587,859
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module, image processing device and image compression method
- Patent number 11,570,479
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder, image decoder, and image processing method
- Patent number 11,405,623
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method for managing uplink control channels in wirele...
- Patent number 11,395,323
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Youngmin Jeong
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having stiffening structure
- Patent number 11,315,886
- Issue date Apr 26, 2022
- Samsung Electronics Co., Ltd.
- Eunkyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with through electrode having a wiring protection layer
- Patent number 11,195,785
- Issue date Dec 7, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for allocating resources in wireless communica...
- Patent number 10,869,308
- Issue date Dec 15, 2020
- Samsung Electronics Co. Ltd.
- Hyoyol Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package having through silicon via (TSV) interposer a...
- Patent number 8,928,132
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- YunSeok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 8,823,185
- Issue date Sep 2, 2014
- Samsung Electronics Co., Ltd.
- In Won O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a plurality of stacked semiconducto...
- Patent number 8,330,278
- Issue date Dec 11, 2012
- Samsung Electronics Co., Ltd.
- Heeseok Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240222330
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Youngjun YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR EVALUATING URBAN GROUND STABILITY USING TRAFF...
- Publication number 20240125960
- Publication date Apr 18, 2024
- KOREA INSTITUTE OF GEOSCIENCE & MINERAL RESOURCES
- Woohyun Son
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128172
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Inwon O
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096777
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20240071845
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Jaesun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240040806
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING EQUIPMENT
- Publication number 20240006195
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- YUNSEOK Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240006328
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230352411
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Yunseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND IMAGE PROCESSING SYSTEM COMPRISING THE SAME
- Publication number 20230262344
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGING SYSTEM FOR GENERATING HIGH DYNAMIC RANGE IMAGE
- Publication number 20230262345
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Jeongguk LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE, IMAGE PROCESSING DEVICE AND IMAGE COMPRESSION METHOD
- Publication number 20230164362
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Wonseok LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER, IMAGE DECODER, AND IMAGE PROCESSING METHOD
- Publication number 20220368927
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE
- Publication number 20220223543
- Publication date Jul 14, 2022
- Samsung Electronics Co., Ltd.
- Eunkyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220199577
- Publication date Jun 23, 2022
- Samsung Electronics Co., Ltd.
- Sungwoo PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE PROCESSING APPARATUS INCLUDING NEURAL NETWORK PROCESSOR AND M...
- Publication number 20220182537
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Irina KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DEVICE FOR IMPROVING IMAGE RESOLUTION IN CAMERA SYSTEM HAVING LENS...
- Publication number 20220122219
- Publication date Apr 21, 2022
- Samsung Electronics Co., Ltd.
- JEONGGUK LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MOBILE ELECTRONIC DEVICES HAVING MULTI-CAMERA MODULES
- Publication number 20220053150
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Soyoung JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20220051970
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE, IMAGE PROCESSING SYSTEM, AND IMAGE COMPRESSION...
- Publication number 20220021889
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAMERA MODULE, IMAGE PROCESSING SYSTEM AND IMAGE COMPRESSION METHOD
- Publication number 20220020179
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE COMPRESSION METHOD USING SATURATED PIXEL, ENCODER, AND ELECTR...
- Publication number 20220020180
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Wonseok LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMAGE SENSOR MODULE, IMAGE PROCESSING SYSTEM, AND IMAGE COMPRESSION...
- Publication number 20220020181
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Wonseok LEE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210391269
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yukyung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR, ELECTRONIC DEVICE, AND OPERATING METHOD OF IMAGE SENSOR
- Publication number 20210385389
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Jeongguk LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE COMPRESSION METHOD, ENCODER, AND CAMERA MODULE INCLUDING THE...
- Publication number 20210344834
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CAMERA MODULE, IMAGE PROCESSING DEVICE AND IMAGE COMPRESSION METHOD
- Publication number 20210337240
- Publication date Oct 28, 2021
- Samsung Electronics Co., Ltd.
- Wonseok LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20210167001
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE
- Publication number 20210151388
- Publication date May 20, 2021
- Samsung Electronics Co., Ltd.
- Eunkyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ENCODER, IMAGE DECODER, AND IMAGE PROCESSING METHOD
- Publication number 20210136391
- Publication date May 6, 2021
- Samsung Electronics Co., Ltd.
- Wonseok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

YunSeok CHOI

Person

Patents Grantslast 30 patents

Imaging system for generating high dynamic range image

Image sensor module, image processing system, and image compression...

Interposer and semiconductor package including the same

Image compression method using saturated pixel, encoder, and electr...

Camera module, image processing device and image compression method

Semiconductor package

Image processing apparatus including neural network processor and m...

Mobile electronic devices having multi-camera modules

Camera module, image processing system and image compression method

Image sensor module, image processing system, and image compression...

Interposer and semiconductor package including the same

Semiconductor package having stiffening structure

Image encoder, image decoder, and image processing method

Image sensor, electronic device including the image sensor and conf...

Device for improving image resolution in camera system having lens...

Imaging system for generating high dynamic range image

Image sensor and image processing system comprising the same

Image compression method, encoder, and camera module including the...

Wiring protection layer on an interposer with a through electrode

Camera module, image processing device and image compression method

Image encoder, image decoder, and image processing method

Apparatus and method for managing uplink control channels in wirele...

Semiconductor package having stiffening structure

Interposer with through electrode having a wiring protection layer

Apparatus and method for allocating resources in wireless communica...

Semiconductor package having through silicon via (TSV) interposer a...

Semiconductor packages

Semiconductor package including a plurality of stacked semiconducto...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SYSTEM AND METHOD FOR EVALUATING URBAN GROUND STABILITY USING TRAFF...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE

WAFER CLEANING EQUIPMENT

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

IMAGE SENSOR AND IMAGE PROCESSING SYSTEM COMPRISING THE SAME

IMAGING SYSTEM FOR GENERATING HIGH DYNAMIC RANGE IMAGE

CAMERA MODULE, IMAGE PROCESSING DEVICE AND IMAGE COMPRESSION METHOD

IMAGE ENCODER, IMAGE DECODER, AND IMAGE PROCESSING METHOD

SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE

SEMICONDUCTOR PACKAGE

IMAGE PROCESSING APPARATUS INCLUDING NEURAL NETWORK PROCESSOR AND M...

DEVICE FOR IMPROVING IMAGE RESOLUTION IN CAMERA SYSTEM HAVING LENS...

MOBILE ELECTRONIC DEVICES HAVING MULTI-CAMERA MODULES

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME

IMAGE SENSOR MODULE, IMAGE PROCESSING SYSTEM, AND IMAGE COMPRESSION...

CAMERA MODULE, IMAGE PROCESSING SYSTEM AND IMAGE COMPRESSION METHOD

IMAGE COMPRESSION METHOD USING SATURATED PIXEL, ENCODER, AND ELECTR...

IMAGE SENSOR MODULE, IMAGE PROCESSING SYSTEM, AND IMAGE COMPRESSION...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

IMAGE SENSOR, ELECTRONIC DEVICE, AND OPERATING METHOD OF IMAGE SENSOR

IMAGE COMPRESSION METHOD, ENCODER, AND CAMERA MODULE INCLUDING THE...

CAMERA MODULE, IMAGE PROCESSING DEVICE AND IMAGE COMPRESSION METHOD

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGE HAVING STIFFENING STRUCTURE

IMAGE ENCODER, IMAGE DECODER, AND IMAGE PROCESSING METHOD