Yutaka Hashimoto

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Atsugi-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,551,449
- Issue date Apr 22, 2003
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,340,109
- Issue date Jan 22, 2002
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Thin electronic circuit component and method and apparatus for prod...
- Patent number 6,203,655
- Issue date Mar 20, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 6,196,441
- Issue date Mar 6, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Method and apparatus for measuring the height of an object
- Patent number 6,069,701
- Issue date May 30, 2000
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Solder bump measuring method and apparatus
- Patent number 5,906,309
- Issue date May 25, 1999
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING
Information Patent Grant
Deposition apparatus and profile-following device suitable for appa...
- Patent number 5,520,733
- Issue date May 28, 1996
- Hitachi, Ltd.
- Hiroyuki Doi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thin electronic circuit component and method and apparatus for prod...
- Publication number 20010050138
- Publication date Dec 13, 2001
- Hitachi, Ltd.
- Keiji Fujikawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Solder bump measuring method and apparatus
- Publication number 20010000904
- Publication date May 10, 2001
- Hitachi, Ltd.
- Yutaka Hashimoto
- G01 - MEASURING TESTING