Yutaka Shiomi

Person

Hirakata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Filler-containing resin composition suitable for injection molding...
- Patent number 5,780,145
- Issue date Jul 14, 1998
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,750,789
- Issue date May 12, 1998
- Sumitomo Chemical Company Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Filler-containing resin composition suitable for injection molding...
- Patent number 5,719,225
- Issue date Feb 17, 1998
- Sumitomo Chemical Company, Ltd.
- Yasuhiro Hirano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and resin-encapsulated semiconductor device
- Patent number 5,646,204
- Issue date Jul 8, 1997
- Sumitomo Chemical Company, Limited
- Masatsugu Akiba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition, process for producing the same and resin-s...
- Patent number 5,644,003
- Issue date Jul 1, 1997
- Sumitomo Chemical Company, Ltd.
- Noriyuki Arai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device encapsulated with an epoxy resin and a process...
- Patent number 5,560,968
- Issue date Oct 1, 1996
- Sumitomo Chemical Company, Limited
- Noriaki Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,498,687
- Issue date Mar 12, 1996
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyhydric phenol from naphthaldehyde and epoxy resin obtained usin...
- Patent number 5,478,871
- Issue date Dec 26, 1995
- Sumitomo Chemical Company, Limited
- Kazuo Takebe
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyhydric phenol, and epoxy resin and epoxy resin composition deri...
- Patent number 5,462,997
- Issue date Oct 31, 1995
- Sumitomo Chemical Co., Ltd.
- Noriaki Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,444,165
- Issue date Aug 22, 1995
- Sumitomo Chemical Company, Limited
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyhydric phenol and epoxy resin and epoxy resin composition deriv...
- Patent number 5,395,912
- Issue date Mar 7, 1995
- Sumitomo Chemical Company, Limited
- Noriaki Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Unsaturated imide compounds containing alicyclic structure, process...
- Patent number 5,326,881
- Issue date Jul 5, 1994
- Sumitomo Chemical Company Ltd.
- Yasuhiro Hirano
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition and use thereof for an electronic part
- Patent number 5,252,687
- Issue date Oct 12, 1993
- Sumitomo Chemical Company, Limited
- Yutaka Shiomi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition from alkenyl aryloxy triazine compo...
- Patent number 4,980,436
- Issue date Dec 25, 1990
- Sumitomo Chemical Company, Limited
- Yasuhisa Saito
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Imide compound and composition containing the same
- Patent number 4,960,860
- Issue date Oct 2, 1990
- Sumitomo Chemical Co., Ltd.
- Yasuhisa Saito
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition from alkenylaryloxy triazine
- Patent number 4,913,697
- Issue date Apr 3, 1990
- Sumitomo Chemical Company, Limited
- Yasuhisa Saito
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Thermosetting resin composition
- Patent number 4,908,417
- Issue date Mar 13, 1990
- Sumitomo Chemical Company, Limited
- Yutaka Shiomi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Imide compound and composition containing the same
- Patent number 4,888,407
- Issue date Dec 19, 1989
- Sumitomo Chemical Co., Ltd.
- Saito Yasuhisa
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Epoxy resin composition
- Patent number 4,855,339
- Issue date Aug 8, 1989
- Sumitomo Chemical Company, Limited
- Yasuhisa Saito
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition
- Patent number 4,808,717
- Issue date Feb 28, 1989
- Sumitomo Chemical Company, Limited
- Yasuhisa Saito
- C07 - ORGANIC CHEMISTRY

Yutaka Shiomi

Person

Patents Grantslast 30 patents

Filler-containing resin composition suitable for injection molding...

Unsaturated imide compounds containing alicyclic structure, process...

Filler-containing resin composition suitable for injection molding...

Epoxy resin composition and resin-encapsulated semiconductor device

Epoxy resin composition, process for producing the same and resin-s...

Semiconductor device encapsulated with an epoxy resin and a process...

Unsaturated imide compounds containing alicyclic structure, process...

Polyhydric phenol from naphthaldehyde and epoxy resin obtained usin...

Polyhydric phenol, and epoxy resin and epoxy resin composition deri...

Unsaturated imide compounds containing alicyclic structure, process...

Polyhydric phenol and epoxy resin and epoxy resin composition deriv...

Unsaturated imide compounds containing alicyclic structure, process...

Thermosetting resin composition and use thereof for an electronic part

Thermosetting resin composition from alkenyl aryloxy triazine compo...

Imide compound and composition containing the same

Thermosetting resin composition from alkenylaryloxy triazine

Thermosetting resin composition

Imide compound and composition containing the same

Epoxy resin composition

Thermosetting resin composition