Yutaka Yamaguchi

Person

Yuki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Process for connecting circuits and adhesive film used therefor
- Patent number 6,113,728
- Issue date Sep 5, 2000
- Hitachi Chemical Company, Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for connecting circuits and adhesive film used therefor
- Patent number 5,843,251
- Issue date Dec 1, 1998
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for repairing circuit connections
- Patent number 5,155,906
- Issue date Oct 20, 1992
- Hitachi Chemical, Ltd.
- Yasushi Goto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using an anisotropically electroconductive adhesive havin...
- Patent number 5,120,665
- Issue date Jun 9, 1992
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for circuit connection, method for connection using the...
- Patent number 5,001,542
- Issue date Mar 19, 1991
- Hitachi Chemical Company
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for high-frequency circuit and process for making the same
- Patent number 4,751,136
- Issue date Jun 14, 1988
- Hitachi Chemical Co. Ltd.
- Masaki Kamiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic-electroconductive adhesive composition, method for conn...
- Patent number 4,740,657
- Issue date Apr 26, 1988
- Hitachi, Chemical Company, Ltd
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic-electroconductive adhesive film
- Patent number 4,731,282
- Issue date Mar 15, 1988
- Hitachi Chemical Co., Ltd.
- Isao Tsukagoshi
- H01 - BASIC ELECTRIC ELEMENTS

Yutaka Yamaguchi

Person

Patents Grantslast 30 patents

Process for connecting circuits and adhesive film used therefor

Process for connecting circuits and adhesive film used therefor

Process for repairing circuit connections

Method of using an anisotropically electroconductive adhesive havin...

Composition for circuit connection, method for connection using the...

Substrate for high-frequency circuit and process for making the same

Anisotropic-electroconductive adhesive composition, method for conn...

Anisotropic-electroconductive adhesive film