Claims
- 1. A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and
- curing the composition under pressure to obtain electrical connection.
- 2. A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film,
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and
- (D) rigid particles having an average particles size smaller than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing in an uncured state of the composition, and
- curing the composition under pressure to obtain electrical connection.
- 3. The process for connecting circuits according to claim 1, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
- 4. The process for connecting circuits according to claim 3, wherein said predetermined temperature is 40.degree. C. to 250.degree. C.
- 5. The process for connecting circuits according to claim 4, wherein said predetermined temperature is 100.degree. C. to 170.degree. C.
- 6. The process for connecting circuits according to claim 1, wherein said coated particles are pressure activation coated particles in which the coating film is broken by applying pressure, and wherein said curing the composition includes applying sufficient pressure so as to break the coating film.
- 7. The process for connecting circuits according to claim 2, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
- 8. The process for connecting circuits according to claim 7, wherein said predetermined temperature is 40.degree. C. to 250.degree. C.
- 9. The process for connecting circuits according to claim 8, wherein said predetermined temperature is 100.degree. C. to 170.degree. C.
- 10. The process for connecting circuits according to claim 2, wherein said coated particles are thermal activation coated particles in which the coating film is broken at a predetermined temperature, and wherein said curing the composition includes heating the composition under pressure at at least said predetermined temperature to break the coating film.
- 11. A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film, and
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing, and
- curing the composition under pressure to obtain electrical connection.
- 12. A process for connecting circuits, which comprises
- placing a composition for circuit connection between circuits facing oppositely, said composition for circuit connection comprising
- (A) an epoxy resin-containing reactive adhesive,
- (B) coated particles obtained by substantially coating a nucleus of a curing agent with a coating film,
- (C) pressure-deformable electroconductive particles having an average particle size larger than that of the coated particles (B), and
- (D) the rigid particles having an average particle size smaller than that of the coated particles (B),
- the content of the electroconductive particles (C) being 0.1% to 15% by volume based on the total volume of the components (A) and (B),
- conducting electric current passing test for both circuits while pressing, and
- curing the composition under pressure to obtain electrical connection.
Priority Claims (4)
Number |
Date |
Country |
Kind |
63-307618 |
Dec 1988 |
JPX |
|
1-5540 |
Jan 1989 |
JPX |
|
1-5541 |
Jan 1989 |
JPX |
|
1-69973 |
Mar 1989 |
JPX |
|
Parent Case Info
This application is a divisional application of application Ser. No. 07/443,169 filed Nov. 30, 1989 now U.S. Pat. No. 5,001,542.
US Referenced Citations (4)
Foreign Referenced Citations (5)
Number |
Date |
Country |
0110307 |
Nov 1983 |
EPX |
0205686 |
Jun 1985 |
EPX |
2505543 |
May 1982 |
FRX |
51-101469 |
Sep 1976 |
JPX |
2089126 |
Dec 1981 |
GBX |
Non-Patent Literature Citations (1)
Entry |
Bolger & Mooney, "Die Attach in Hi-Rel P-Dips: Polyimides or Low Chloride Epoxies?" IEEE Transactions on Components, Hybrids and Manufacturing Technology CHMT-7 (1984) Dec., No. 4, New York, USA. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
443169 |
Nov 1989 |
|