Yuya KITAGAWA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plate-like composite material
- Patent number 11,472,165
- Issue date Oct 18, 2022
- Nitto Denko Corporation
- Shunji Imamura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electromagnetic wave absorber
- Patent number 11,145,988
- Issue date Oct 12, 2021
- Nitto Denko Corporation
- Hiroichi Ukei
- G01 - MEASURING TESTING
Information Patent Grant
Electromagnetic wave absorber and molded article equipped with elec...
- Patent number 10,701,848
- Issue date Jun 30, 2020
- Nitto Denko Corporation
- Kazuto Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating resin material, metal layer-equipped insulating resin ma...
- Patent number 10,388,425
- Issue date Aug 20, 2019
- Nitto Denko Corporation
- Tomoyuki Kasagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Epoxy resin composition and electronic component device
- Patent number 9,796,828
- Issue date Oct 24, 2017
- Hitachi Chemical Company, Ltd.
- Yuta Ono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMAGNETIC WAVE ABSORBER
- Publication number 20220015275
- Publication date Jan 13, 2022
- Nitto Denko Corporation
- Hiroichi Ukei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING RESIN MATERIAL, METAL LAYER-EQUIPPED INSULATING RESIN MA...
- Publication number 20190074104
- Publication date Mar 7, 2019
- NITTO DENKO CORPORATION
- Tomoyuki Kasagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC WAVE ABSORBER AND MOLDED ARTICLE EQUIPPED WITH ELEC...
- Publication number 20180332742
- Publication date Nov 15, 2018
- NITTO DENKO CORPORATION
- Kazuto Yamagata
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTROMAGNETIC WAVE ABSORBER
- Publication number 20180319138
- Publication date Nov 8, 2018
- NITTO DENKO CORPORATION
- Hiroichi Ukei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUORORESIN POROUS BODY, METAL LAYER-EQUIPPED POROUS BODY USING SAM...
- Publication number 20180200985
- Publication date Jul 19, 2018
- NITTO DENKO CORPORATION
- Tomoyuki Kasagi
- B32 - LAYERED PRODUCTS
Information Patent Application
EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20160177055
- Publication date Jun 23, 2016
- Hitachi Chemical Company, Ltd.
- Yuta ONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELEC...
- Publication number 20130148304
- Publication date Jun 13, 2013
- Nitto Denko Corporation
- Yuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND...
- Publication number 20130012619
- Publication date Jan 10, 2013
- Nitto Denko Corporation
- Yuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTR...
- Publication number 20110224333
- Publication date Sep 15, 2011
- Nitto Denko Corporation
- Yuya KITAGAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yuya KITAGAWA

Person

Patents Grantslast 30 patents

Plate-like composite material

Electromagnetic wave absorber

Electromagnetic wave absorber and molded article equipped with elec...

Insulating resin material, metal layer-equipped insulating resin ma...

Epoxy resin composition and electronic component device

Patents Applicationslast 30 patents

ELECTROMAGNETIC WAVE ABSORBER

INSULATING RESIN MATERIAL, METAL LAYER-EQUIPPED INSULATING RESIN MA...

ELECTROMAGNETIC WAVE ABSORBER AND MOLDED ARTICLE EQUIPPED WITH ELEC...

ELECTROMAGNETIC WAVE ABSORBER

FLUORORESIN POROUS BODY, METAL LAYER-EQUIPPED POROUS BODY USING SAM...

EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELEC...

EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND...

RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTR...