Yuzo Shimada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-axis motion table
- Patent number 7,263,897
- Issue date Sep 4, 2007
- Nihon University
- Yuzo Shimada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of inspecting optical waveguide substrate for optical conduc...
- Patent number 7,106,426
- Issue date Sep 12, 2006
- NEC Toppan Circuit Solutions, Inc.
- Hideo Kikuchi
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing optical waveguide and method of manufacturi...
- Patent number 6,999,643
- Issue date Feb 14, 2006
- NEC Toppan Circuit Solutions, Inc.
- Hideo Kikuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with decoupling capacitors mounted on conductors
- Patent number 6,949,815
- Issue date Sep 27, 2005
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical waveguide board and optical module
- Patent number 6,934,429
- Issue date Aug 23, 2005
- NEC Corporation
- Hideo Kikuchi
- G02 - OPTICS
Information Patent Grant
Transfer apparatus for arraying small conductive bumps on a substra...
- Patent number 6,926,188
- Issue date Aug 9, 2005
- NEC Corporation
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transfer apparatus for arraying small conductive bumps on substrate...
- Patent number 6,889,886
- Issue date May 10, 2005
- NEC Corporation
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical path control apparatus with mirror section, and manufacturi...
- Patent number 6,829,079
- Issue date Dec 7, 2004
- NEC Corporation
- Mikio Oda
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method for packaging same
- Patent number 6,703,705
- Issue date Mar 9, 2004
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging structure
- Patent number 6,670,699
- Issue date Dec 30, 2003
- NEC Corporation
- Kazuyuki Mikubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, and thin film capacitor
- Patent number 6,524,905
- Issue date Feb 25, 2003
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, capacitor mounting structure, method for manufacturing s...
- Patent number 6,515,324
- Issue date Feb 4, 2003
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device and method of manufacturing...
- Patent number 6,486,540
- Issue date Nov 26, 2002
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-electric combined substrate, optical waveguide and manufactur...
- Patent number 6,477,284
- Issue date Nov 5, 2002
- NEC Corporation
- Mikio Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module and manufacturing method thereof
- Patent number 6,430,327
- Issue date Aug 6, 2002
- NEC Corporation
- Yoshinobu Kaneyama
- G02 - OPTICS
Information Patent Grant
Method and apparatus for lining up micro-balls
- Patent number 6,422,452
- Issue date Jul 23, 2002
- Japan E M Co., Ltd.
- Takumi Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball arrangement device
- Patent number 6,378,756
- Issue date Apr 30, 2002
- NEC Corporation
- Nobuaki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packing stack module and method of producing the same
- Patent number 6,188,127
- Issue date Feb 13, 2001
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of manufacturing the same
- Patent number 6,130,111
- Issue date Oct 10, 2000
- NEC Corporation
- Kazuhiro Ikuina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate printed circuit board with a magnetic layer
- Patent number 6,111,479
- Issue date Aug 29, 2000
- NEC Corporation
- Osamu Myohga
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Fabrication method of plastic-molded lead component
- Patent number 6,096,259
- Issue date Aug 1, 2000
- NEC Corporation
- Nobuaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball arrangement device
- Patent number 6,095,398
- Issue date Aug 1, 2000
- NEC Corporation
- Nobuaki Takahashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting member and a connecting method with ball and tapered via
- Patent number 6,087,597
- Issue date Jul 11, 2000
- NEC Corporation
- Yuzo Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer glass ceramic substrate and process for producing the same
- Patent number 5,989,484
- Issue date Nov 23, 1999
- NEC Corporation
- Kazuhiro Ikuina
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Printed wiring board with integrated coil inductor
- Patent number 5,978,231
- Issue date Nov 2, 1999
- NEC Corporation
- Hirokazu Tohya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for arranging minute metallic balls
- Patent number 5,976,965
- Issue date Nov 2, 1999
- NEC Corporation
- Nobuaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked carrier three-dimensional memory module and semiconductor d...
- Patent number 5,973,392
- Issue date Oct 26, 1999
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device and method of manufacturing the same
- Patent number 5,952,712
- Issue date Sep 14, 1999
- NEC Corporation
- Kazuhiro Ikuina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package and IC probe card with organic substrate
- Patent number 5,936,845
- Issue date Aug 10, 1999
- NEC Corporation
- Koji Soejima
- G01 - MEASURING TESTING
Information Patent Grant
Electronic device assembly
- Patent number 5,923,535
- Issue date Jul 13, 1999
- NEC Corporation
- Yuzo Shimada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Three-axis motion table
- Publication number 20060293795
- Publication date Dec 28, 2006
- Yuzo Shimada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for packaging same
- Publication number 20040135264
- Publication date Jul 15, 2004
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer apparatus for arraying small conductive bumps on substrate...
- Publication number 20040094601
- Publication date May 20, 2004
- Ichiro Hazeyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical waveguide board and optical module
- Publication number 20030142896
- Publication date Jul 31, 2003
- NEC Corporation
- Hideo Kikuchi
- G02 - OPTICS
Information Patent Application
Method of manufacturing optical waveguide and method of manufacturi...
- Publication number 20030128907
- Publication date Jul 10, 2003
- NEC TOPPAN CIRCUIT SOLUTION, INC.
- Hideo Kikuchi
- G02 - OPTICS
Information Patent Application
Method of inspecting optical waveguide substrate for optical conduc...
- Publication number 20030117614
- Publication date Jun 26, 2003
- NEC Toppan Circuit Solutions, Inc.
- Hideo Kikuchi
- G01 - MEASURING TESTING
Information Patent Application
Optical path control apparatus with mirror section, and manufacturi...
- Publication number 20030117690
- Publication date Jun 26, 2003
- Mikio Oda
- G02 - OPTICS
Information Patent Application
Photo-electric combined substrate
- Publication number 20030053765
- Publication date Mar 20, 2003
- NEC Corporation
- Mikio Oda
- G02 - OPTICS
Information Patent Application
Semiconductor device packaging structure
- Publication number 20020185718
- Publication date Dec 12, 2002
- Kazuyuki Mikubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer apparatus for arraying small conductive bumps on substrate...
- Publication number 20020135064
- Publication date Sep 26, 2002
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for packaging same
- Publication number 20020074643
- Publication date Jun 20, 2002
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capacitor, capacitor mounting structure, method for manufacturing s...
- Publication number 20020070400
- Publication date Jun 13, 2002
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, production method thereof, and coil spring cu...
- Publication number 20020056922
- Publication date May 16, 2002
- NEC Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, manufacturing method therefor, and thin film...
- Publication number 20020025623
- Publication date Feb 28, 2002
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional semiconductor device and method of manufacturing...
- Publication number 20020022303
- Publication date Feb 21, 2002
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer capacitor, semiconductor device, and electrical circuit...
- Publication number 20020017700
- Publication date Feb 14, 2002
- NEC Corporation
- Toru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of fabricating the same
- Publication number 20010054762
- Publication date Dec 27, 2001
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for transferring micro-balls
- Publication number 20010015372
- Publication date Aug 23, 2001
- E .M Co., Ltd.,
- Takumi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for lining up micro-balls
- Publication number 20010009261
- Publication date Jul 26, 2001
- Japan E M Co., Ltd.
- Takumi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Yuzo Shimada

Person

Patents Grantslast 30 patents

Three-axis motion table

Method of inspecting optical waveguide substrate for optical conduc...

Method of manufacturing optical waveguide and method of manufacturi...

Semiconductor device with decoupling capacitors mounted on conductors

Optical waveguide board and optical module

Transfer apparatus for arraying small conductive bumps on a substra...

Transfer apparatus for arraying small conductive bumps on substrate...

Optical path control apparatus with mirror section, and manufacturi...

Semiconductor device and method for packaging same

Semiconductor device packaging structure

Semiconductor device, and thin film capacitor

Capacitor, capacitor mounting structure, method for manufacturing s...

Three-dimensional semiconductor device and method of manufacturing...

Photo-electric combined substrate, optical waveguide and manufactur...

Optical module and manufacturing method thereof

Method and apparatus for lining up micro-balls

Solder ball arrangement device

Semiconductor packing stack module and method of producing the same

Packaged semiconductor device and method of manufacturing the same

Laminate printed circuit board with a magnetic layer

Fabrication method of plastic-molded lead component

Solder ball arrangement device

Connecting member and a connecting method with ball and tapered via

Multilayer glass ceramic substrate and process for producing the same

Printed wiring board with integrated coil inductor

Method for arranging minute metallic balls

Stacked carrier three-dimensional memory module and semiconductor d...

Packaged semiconductor device and method of manufacturing the same

IC package and IC probe card with organic substrate

Electronic device assembly

Patents Applicationslast 30 patents

Three-axis motion table

Semiconductor device and method for packaging same

Transfer apparatus for arraying small conductive bumps on substrate...

Optical waveguide board and optical module

Method of manufacturing optical waveguide and method of manufacturi...

Method of inspecting optical waveguide substrate for optical conduc...

Optical path control apparatus with mirror section, and manufacturi...

Photo-electric combined substrate

Semiconductor device packaging structure

Transfer apparatus for arraying small conductive bumps on substrate...

Semiconductor device and method for packaging same

Capacitor, capacitor mounting structure, method for manufacturing s...

Semiconductor device, production method thereof, and coil spring cu...

Semiconductor device, manufacturing method therefor, and thin film...

Three-dimensional semiconductor device and method of manufacturing...

Multilayer capacitor, semiconductor device, and electrical circuit...

Semiconductor device and method of fabricating the same

Apparatus for transferring micro-balls

Method and apparatus for lining up micro-balls