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Zheng-Yong Liang
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Kaohsiung City, TW
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Patents Grants
last 30 patents
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Patent Grant
Low thermal budget dielectric for semiconductor devices
Patent number
11,942,358
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Mrunal Abhijith Khaderbad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Atomic layer deposition method
Patent number
10,522,361
Issue date
Dec 31, 2019
National Tsing Hua University
Zheng-Yong Liang
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Patents Applications
last 30 patents
Information
Patent Application
Surface Profile Control Of Passivation Layers In Integrated Circuit...
Publication number
20250014943
Publication date
Jan 9, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Zheng Yong LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
Publication number
20250006687
Publication date
Jan 2, 2025
Taiwan Semiconductor Manufacturing Co., Ltd.
Zheng-Yong Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240355733
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zheng-Yong LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
Publication number
20240355805
Publication date
Oct 24, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Ting Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE AND METHODS OF FORMING THE SAME
Publication number
20240282761
Publication date
Aug 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zheng Yong Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
Publication number
20240170323
Publication date
May 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mrunal Abhijith KHADERBAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
Publication number
20240030180
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Zheng-Yong LIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEBONDING STRUCTURES FOR WAFER BONDING
Publication number
20220415696
Publication date
Dec 29, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Ting YEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
Publication number
20220293458
Publication date
Sep 15, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Mrunal Abhijith Khaderbad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ATOMIC LAYER DEPOSITION METHOD
Publication number
20190362979
Publication date
Nov 28, 2019
National Tsing-Hua University
Zheng-Yong Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20170025360
Publication date
Jan 26, 2017
National Tsing-Hua University
Zheng-Yong Liang
H01 - BASIC ELECTRIC ELEMENTS