Zheng Yong Liang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Low thermal budget dielectric for semiconductor devices
- Patent number 11,942,358
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240355733
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20240355805
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
- Publication number 20240170323
- Publication date May 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mrunal Abhijith KHADERBAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
- Publication number 20240030180
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zheng-Yong LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEBONDING STRUCTURES FOR WAFER BONDING
- Publication number 20220415696
- Publication date Dec 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES
- Publication number 20220293458
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal Abhijith Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS

Zheng Yong Liang

Person

Patents Grantslast 30 patents

Low thermal budget dielectric for semiconductor devices

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF FORMING SEMICONDUCTOR STRUCTURE

LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES

WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME

DEBONDING STRUCTURES FOR WAFER BONDING

LOW THERMAL BUDGET DIELECTRIC FOR SEMICONDUCTOR DEVICES