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Zhengying Wei
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Shanghai, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming doped epitaxial layer of contact image sensor
Patent number
11,508,859
Issue date
Nov 22, 2022
Shanghai Huali Microelectronics Corporation
Chenchen Qiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for improving HDP filling defects through STI etching process
Patent number
11,342,217
Issue date
May 24, 2022
Shanghai Huali Microelectronics Corporation
Zhengying Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and structure for self aligned contact for integrated circuits
Patent number
8,507,378
Issue date
Aug 13, 2013
Semiconductor Manufacturing International (Shanghai) Corporation
ChiKang Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
CMOS IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME
Publication number
20240153980
Publication date
May 9, 2024
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Chenchen Qiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE-LAYER STACKED CMOS IMAGE SENSOR
Publication number
20240128296
Publication date
Apr 18, 2024
Shanghai Huali Microelectronics Corporation
Xing FANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Improving HDP Filling Defects through STI Etching Process
Publication number
20220148909
Publication date
May 12, 2022
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Zhengying Wei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming Doped Epitaxial Layer of Contact Image Sensor
Publication number
20220069145
Publication date
Mar 3, 2022
SHANGHAI HUALI MICROELECTRONICS CORPORATION
Chenchen Qiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD AND STRUCTURE FOR SELF ALIGNED CONTACT FOR INTEGRATED CIRCUITS
Publication number
20110037130
Publication date
Feb 17, 2011
Semiconductor Manufacturing International (Shanghai) Corporation
ChiKang Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Forming a Shallow Trench Isolation Structure
Publication number
20080081433
Publication date
Apr 3, 2008
Semiconductor Manufacturing International (Shanghai) Corporation
Leong Tce Koh
H01 - BASIC ELECTRIC ELEMENTS