Zhian HE

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,859,300
- Issue date Jan 2, 2024
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 11,401,623
- Issue date Aug 2, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 11,225,727
- Issue date Jan 18, 2022
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Controlling plating electrolyte concentration on an electrochemical...
- Patent number 10,927,475
- Issue date Feb 23, 2021
- Lam Research Corporation
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,689,774
- Issue date Jun 23, 2020
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Gap fill process stability monitoring of an electroplating process...
- Patent number 10,358,738
- Issue date Jul 23, 2019
- Lam Research Corporation
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 10,351,968
- Issue date Jul 16, 2019
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anisotropic high resistance ionic current source (AHRICS)
- Patent number 10,301,739
- Issue date May 28, 2019
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,214,828
- Issue date Feb 26, 2019
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,214,829
- Issue date Feb 26, 2019
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 10,053,792
- Issue date Aug 21, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 10,023,970
- Issue date Jul 17, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of current density in an electroplating apparatus
- Patent number 10,011,917
- Issue date Jul 3, 2018
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for dynamic current distribution control durin...
- Patent number 9,909,228
- Issue date Mar 6, 2018
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 9,822,461
- Issue date Nov 21, 2017
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte flow dynamics for uniform electroplating
- Patent number 9,816,194
- Issue date Nov 14, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anisotropic high resistance ionic current source (AHRICS)
- Patent number 9,670,588
- Issue date Jun 6, 2017
- Lam Research Corporation
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating cup with contoured cup bottom
- Patent number 9,512,538
- Issue date Dec 6, 2016
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Geometry and process optimization for ultra-high RPM plating
- Patent number 9,481,942
- Issue date Nov 1, 2016
- Lam Research Corporation
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 9,340,893
- Issue date May 17, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 9,309,604
- Issue date Apr 12, 2016
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Control of electrolyte composition in a copper electroplating appar...
- Patent number 9,045,841
- Issue date Jun 2, 2015
- Novellus Systems, Inc.
- Bryan Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Front referenced anode
- Patent number 9,028,657
- Issue date May 12, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,540,857
- Issue date Sep 24, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,475,636
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating apparatus with vented electrolyte manifold
- Patent number 8,475,637
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,475,644
- Issue date Jul 2, 2013
- Novellus Systems, Inc.
- Steven Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating cup assembly
- Patent number 8,377,268
- Issue date Feb 19, 2013
- Novellus Systems, Inc.
- Robert Rash
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,308,931
- Issue date Nov 13, 2012
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and apparatus with multiple internally irrigated cha...
- Patent number 8,262,871
- Issue date Sep 11, 2012
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20240141540
- Publication date May 2, 2024
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...
- Publication number 20230313408
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Liu YANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20220333267
- Publication date Oct 20, 2022
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES
- Publication number 20220228287
- Publication date Jul 21, 2022
- LAM RESEARCH CORPORATION
- Andrew James PFAU
- G01 - MEASURING TESTING
Information Patent Application
IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS
- Publication number 20210366768
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Zhian HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20210130976
- Publication date May 6, 2021
- LAM RESEARCH CORPORATION
- Zhian He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20200277708
- Publication date Sep 3, 2020
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20190145018
- Publication date May 16, 2019
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...
- Publication number 20190127872
- Publication date May 2, 2019
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20180266005
- Publication date Sep 20, 2018
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20180266006
- Publication date Sep 20, 2018
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR DYNAMIC CURRENT DISTRIBUTION CONTROL DURIN...
- Publication number 20180142374
- Publication date May 24, 2018
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...
- Publication number 20180080140
- Publication date Mar 22, 2018
- LAM RESEARCH CORPORATION
- Quan Ma
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20180057955
- Publication date Mar 1, 2018
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20170362734
- Publication date Dec 21, 2017
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS)
- Publication number 20170236715
- Publication date Aug 17, 2017
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20170096745
- Publication date Apr 6, 2017
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING
- Publication number 20160273119
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS
- Publication number 20160273124
- Publication date Sep 22, 2016
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING
- Publication number 20160222535
- Publication date Aug 4, 2016
- LAM RESEARCH CORPORATION
- Jian Zhou
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20160222541
- Publication date Aug 4, 2016
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20160115615
- Publication date Apr 28, 2016
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
FRONT REFERENCED ANODE
- Publication number 20150211144
- Publication date Jul 30, 2015
- Novellus Systems, Inc.
- Jingbin Feng
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20150191843
- Publication date Jul 9, 2015
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS)
- Publication number 20140326608
- Publication date Nov 6, 2014
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR DYNAMIC CURRENT DISTRIBUTION CONTROL DURIN...
- Publication number 20140144781
- Publication date May 29, 2014
- LAM RESEARCH CORPORATION
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING
- Publication number 20130327650
- Publication date Dec 12, 2013
- Steven Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20130137242
- Publication date May 30, 2013
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING CUP WITH CONTOURED CUP BOTTOM
- Publication number 20130062197
- Publication date Mar 14, 2013
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS
- Publication number 20120181170
- Publication date Jul 19, 2012
- Vinay Prabhakar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Controlling plating electrolyte concentration on an electrochemical...

Controlling plating electrolyte concentration on an electrochemical...

Control of current density in an electroplating apparatus

Controlling plating electrolyte concentration on an electrochemical...

Control of current density in an electroplating apparatus

Gap fill process stability monitoring of an electroplating process...

Front referenced anode

Anisotropic high resistance ionic current source (AHRICS)

Control of current density in an electroplating apparatus

Control of current density in an electroplating apparatus

Plating cup with contoured cup bottom

Dynamic current distribution control apparatus and method for wafer...

Control of current density in an electroplating apparatus

Method and apparatus for dynamic current distribution control durin...

Dynamic current distribution control apparatus and method for wafer...

Control of electrolyte flow dynamics for uniform electroplating

Anisotropic high resistance ionic current source (AHRICS)

Plating cup with contoured cup bottom

Geometry and process optimization for ultra-high RPM plating

Front referenced anode

Method and apparatus for electroplating

Control of electrolyte composition in a copper electroplating appar...

Front referenced anode

Plating method and apparatus with multiple internally irrigated cha...

Method and apparatus for electroplating

Electroplating apparatus with vented electrolyte manifold

Method and apparatus for electroplating

Electroplating cup assembly

Method and apparatus for electroplating

Plating method and apparatus with multiple internally irrigated cha...

Patents Applicationslast 30 patents

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

PLATING-DEPLATING WAVEFORM BASED CONTACT CLEANING FOR A SUBSTRATE E...

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

ELECTROCHEMICAL DEPOSITION SYSTEM INCLUDING OPTICAL PROBES

IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

CONTROLLING PLATING ELECTROLYTE CONCENTRATION ON AN ELECTROCHEMICAL...

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

METHOD AND APPARATUS FOR DYNAMIC CURRENT DISTRIBUTION CONTROL DURIN...

GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS)

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

CONTROL OF ELECTROLYTE FLOW DYNAMICS FOR UNIFORM ELECTROPLATING

CONTROL OF CURRENT DENSITY IN AN ELECTROPLATING APPARATUS

GEOMETRY AND PROCESS OPTIMIZATION FOR ULTRA-HIGH RPM PLATING

FRONT REFERENCED ANODE

PLATING CUP WITH CONTOURED CUP BOTTOM

FRONT REFERENCED ANODE

PLATING CUP WITH CONTOURED CUP BOTTOM

ANISOTROPIC HIGH RESISTANCE IONIC CURRENT SOURCE (AHRICS)

METHOD AND APPARATUS FOR DYNAMIC CURRENT DISTRIBUTION CONTROL DURIN...

METHOD AND APPARATUS FOR ELECTROPLATING

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

PLATING CUP WITH CONTOURED CUP BOTTOM

WAFER ELECTROPLATING APPARATUS FOR REDUCING EDGE DEFECTS