Zhihong Wang

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inductive monitoring of conductive loops
- Patent number 10,741,459
- Issue date Aug 11, 2020
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrate zones of varying thickness i...
- Patent number 10,589,397
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Alain Duboust
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Modifying substrate thickness profiles
- Patent number 10,464,184
- Issue date Nov 5, 2019
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 10,199,281
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 10,103,073
- Issue date Oct 16, 2018
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate features for inductive monitoring of conductive trench depth
- Patent number 9,911,664
- Issue date Mar 6, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive monitoring of conductive trench depth
- Patent number 9,754,846
- Issue date Sep 5, 2017
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing control using weighting with default sequence
- Patent number 9,296,084
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint detection during polishing using integrated differential i...
- Patent number 9,248,544
- Issue date Feb 2, 2016
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Monitoring retaining ring thickness and pressure control
- Patent number 9,067,295
- Issue date Jun 30, 2015
- Applied Materials, Inc.
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature control of chemical mechanical polishing
- Patent number 9,005,999
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Kun Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection of layer clearing using spectral monitoring
- Patent number 8,860,932
- Issue date Oct 14, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Automatic selection of reference spectra library
- Patent number 8,755,928
- Issue date Jun 17, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Grant
Endpoint control of multiple substrates of varying thickness on the...
- Patent number 8,694,144
- Issue date Apr 8, 2014
- Applied Materials, Inc.
- Alain Duboust
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for evaluating polishing pad conditioning
- Patent number 7,699,972
- Issue date Apr 20, 2010
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and composition for conductive material removal by electroc...
- Patent number 7,582,564
- Issue date Sep 1, 2009
- Applied Materials, Inc.
- Zhihong Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrochemically mechanically polishing a conductive ma...
- Patent number 7,576,007
- Issue date Aug 18, 2009
- Applied Materials, Inc.
- You Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grooved retaining ring
- Patent number 7,520,795
- Issue date Apr 21, 2009
- Applied Materials, Inc.
- Shi-Ping Wang
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE LOOPS
- Publication number 20190035699
- Publication date Jan 31, 2019
- Applied Materials, Inc.
- Wei Lu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20180166347
- Publication date Jun 14, 2018
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...
- Publication number 20180056476
- Publication date Mar 1, 2018
- Applied Materials, Inc.
- Jimin Zhang
- G01 - MEASURING TESTING
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20170365532
- Publication date Dec 21, 2017
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...
- Publication number 20170151647
- Publication date Jun 1, 2017
- Applied Materials, Inc.
- Alain Duboust
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20150371913
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH
- Publication number 20150371907
- Publication date Dec 24, 2015
- Applied Materials, Inc.
- Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Modifying Substrate Thickness Profiles
- Publication number 20150321312
- Publication date Nov 12, 2015
- Applied Materials, Inc.
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING...
- Publication number 20140315381
- Publication date Oct 23, 2014
- You Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TRE...
- Publication number 20140308814
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- David Maxwell Gage
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20140222188
- Publication date Aug 7, 2014
- Applied Materials, Inc.
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PROCESS AND SLURRY CONTAINING SILICON...
- Publication number 20140199842
- Publication date Jul 17, 2014
- Vishwas V. Hardikar
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
In-Sequence Spectrographic Sensor
- Publication number 20140141694
- Publication date May 22, 2014
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Monitoring Retaining Ring Thickness And Pressure Control
- Publication number 20140027407
- Publication date Jan 30, 2014
- Sameer Deshpande
- B24 - GRINDING POLISHING
Information Patent Application
CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...
- Publication number 20140030956
- Publication date Jan 30, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Endpoint Detection During Polishing Using Integrated Differential I...
- Publication number 20140024291
- Publication date Jan 23, 2014
- Jimin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing Control Using Weighting With Default Sequence
- Publication number 20140024292
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
Control Of Overpolishing Of Multiple Substrates On the Same Platen...
- Publication number 20140024293
- Publication date Jan 23, 2014
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
- Publication number 20140004626
- Publication date Jan 2, 2014
- Applied Materials, Inc.
- KUN XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATIC SELECTION OF REFERENCE SPECTRA LIBRARY
- Publication number 20120276814
- Publication date Nov 1, 2012
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING
- Publication number 20120100781
- Publication date Apr 26, 2012
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...
- Publication number 20120053717
- Publication date Mar 1, 2012
- Alain Duboust
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF L...
- Publication number 20120034844
- Publication date Feb 9, 2012
- Applied Materials, Inc.
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR I...
- Publication number 20120034845
- Publication date Feb 9, 2012
- Xiaoyuan Hu
- B24 - GRINDING POLISHING
Information Patent Application
DETECTION OF LAYER CLEARING USING SPECTRAL MONITORING
- Publication number 20120026492
- Publication date Feb 2, 2012
- Jimin Zhang
- B24 - GRINDING POLISHING
Information Patent Application
ENDPOINT CONTROL DURING CHEMICAL MECHANICAL POLISHING BY DETECTING...
- Publication number 20120003759
- Publication date Jan 5, 2012
- Applied Materials, Inc.
- Xiaoyuan Hu
- B24 - GRINDING POLISHING
Information Patent Application
ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE
- Publication number 20090061741
- Publication date Mar 5, 2009
- Zhihong Wang
- B24 - GRINDING POLISHING
Information Patent Application
HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS
- Publication number 20090057264
- Publication date Mar 5, 2009
- APPLIED MATERIALS, INC.
- DAVID H. MAI
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
- Publication number 20080003931
- Publication date Jan 3, 2008
- Antoine P. Manens
- B24 - GRINDING POLISHING
Information Patent Application
Planarization of substrates at a high polishing rate using electroc...
- Publication number 20070243709
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Alain Duboust
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Zhihong Wang

Person

Patents Grantslast 30 patents

Inductive monitoring of conductive loops

Endpoint control of multiple substrate zones of varying thickness i...

Modifying substrate thickness profiles

Substrate features for inductive monitoring of conductive trench depth

Inductive monitoring of conductive trench depth

Substrate features for inductive monitoring of conductive trench depth

Inductive monitoring of conductive trench depth

Polishing control using weighting with default sequence

Endpoint detection during polishing using integrated differential i...

Monitoring retaining ring thickness and pressure control

Temperature control of chemical mechanical polishing

Detection of layer clearing using spectral monitoring

Automatic selection of reference spectra library

Endpoint control of multiple substrates of varying thickness on the...

Method and apparatus for evaluating polishing pad conditioning

Process and composition for conductive material removal by electroc...

Method for electrochemically mechanically polishing a conductive ma...

Grooved retaining ring

Patents Applicationslast 30 patents

INDUCTIVE MONITORING OF CONDUCTIVE LOOPS

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

MONITORING OF POLISHING PAD THICKNESS FOR CHEMICAL MECHANICAL POLIS...

INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

ENDPOINT CONTROL OF MULTIPLE SUBSTRATE ZONES OF VARYING THICKNESS I...

INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

SUBSTRATE FEATURES FOR INDUCTIVE MONITORING OF CONDUCTIVE TRENCH DEPTH

Modifying Substrate Thickness Profiles

INTERCONNECT FABRICATION AT AN INTEGRATED SEMICONDUCTOR PROCESSING...

CHEMICAL MECHANICAL POLISHING METHODS AND SYSTEMS INCLUDING PRE-TRE...

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

CHEMICAL MECHANICAL POLISHING PROCESS AND SLURRY CONTAINING SILICON...

In-Sequence Spectrographic Sensor

Monitoring Retaining Ring Thickness And Pressure Control

CONTROL OF POLISHING OF MULTIPLE SUBSTRATES ON THE SAME PLATEN IN C...

Endpoint Detection During Polishing Using Integrated Differential I...

Polishing Control Using Weighting With Default Sequence

Control Of Overpolishing Of Multiple Substrates On the Same Platen...

TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING

AUTOMATIC SELECTION OF REFERENCE SPECTRA LIBRARY

MULTIPLE MATCHING REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING

ENDPOINT CONTROL OF MULTIPLE SUBSTRATES OF VARYING THICKNESS ON THE...

SPECTROGRAPHIC MONITORING USING INDEX TRACKING AFTER DETECTION OF L...

TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR I...

DETECTION OF LAYER CLEARING USING SPECTRAL MONITORING

ENDPOINT CONTROL DURING CHEMICAL MECHANICAL POLISHING BY DETECTING...

ECMP POLISHING SEQUENCE TO IMPROVE PLANARITY AND DEFECT PERFORMANCE

HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS

SYSTEM AND METHOD FOR IN-SITU HEAD RINSE

Planarization of substrates at a high polishing rate using electroc...