Zhijie WANG

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circular bond finger pad
- Patent number 12,021,063
- Issue date Jun 25, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising inter-substrate gradient interconnect structure
- Patent number 11,581,251
- Issue date Feb 14, 2023
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and interconnect device configured f...
- Patent number 11,562,962
- Issue date Jan 24, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided embedded trace substrate
- Patent number 11,545,435
- Issue date Jan 3, 2023
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular capacitor array
- Patent number 11,322,490
- Issue date May 3, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba Buot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive device orientation in core for improved power delivery in p...
- Patent number 11,302,656
- Issue date Apr 12, 2022
- QUALCOMM Incorporated
- Hong Bok We
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising a substrate and a high-density interconnect stru...
- Patent number 11,289,453
- Issue date Mar 29, 2022
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground shield plane for ball grid array (BGA) package
- Patent number 10,971,455
- Issue date Apr 6, 2021
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split conductive pad for device terminal
- Patent number 10,879,158
- Issue date Dec 29, 2020
- QUALCOMM Incorporated
- Aniket Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal release interposer
- Patent number 10,679,919
- Issue date Jun 9, 2020
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE
- Publication number 20250062246
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...
- Publication number 20250062235
- Publication date Feb 20, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE INCLUDING DIRECT MEMORY ATTACHMENT ON THROUGH MOL...
- Publication number 20250046688
- Publication date Feb 6, 2025
- QUALCOMM Incorporated
- Zhijie WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...
- Publication number 20240332146
- Publication date Oct 3, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE
- Publication number 20240321752
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER WITH SOLDER RESIST POSTS
- Publication number 20240274516
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES
- Publication number 20240276739
- Publication date Aug 15, 2024
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...
- Publication number 20240250009
- Publication date Jul 25, 2024
- QUALCOMM Incorporated
- Seongryul Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL POCKET FANOUT PACKAGE
- Publication number 20240194545
- Publication date Jun 13, 2024
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A FLEXIBLE SUBSTRATE
- Publication number 20240105687
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES
- Publication number 20230369261
- Publication date Nov 16, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...
- Publication number 20230352390
- Publication date Nov 2, 2023
- QUALCOMM Incorporated
- Chin-Kwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...
- Publication number 20230307336
- Publication date Sep 28, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...
- Publication number 20230230908
- Publication date Jul 20, 2023
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A BRIDGE
- Publication number 20220375838
- Publication date Nov 24, 2022
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR BOND FINGER PAD
- Publication number 20220238488
- Publication date Jul 28, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND INTERCONNECT DEVICE CONFIGURED F...
- Publication number 20220223529
- Publication date Jul 14, 2022
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING INTER-SUBSTRATE GRADIENT INTERCONNECT STRUCTURE
- Publication number 20220148952
- Publication date May 12, 2022
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE DEVICE ORIENTATION IN CORE FOR IMPROVED POWER DELIVERY IN P...
- Publication number 20220028805
- Publication date Jan 27, 2022
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICORE SUBSTRATE
- Publication number 20210375736
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR CAPACITOR ARRAY
- Publication number 20210327864
- Publication date Oct 21, 2021
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT STRU...
- Publication number 20210272931
- Publication date Sep 2, 2021
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A DOUBLE-SIDED REDISTRIBUTION PORTION
- Publication number 20210175178
- Publication date Jun 10, 2021
- QUALCOMM Incorporated
- Hong Bok WE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDED EMBEDDED TRACE SUBSTRATE
- Publication number 20200388573
- Publication date Dec 10, 2020
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT CONDUCTIVE PAD FOR DEVICE TERMINAL
- Publication number 20200381344
- Publication date Dec 3, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND SHIELD PLANE FOR BALL GRID ARRAY (BGA) PACKAGE
- Publication number 20200350260
- Publication date Nov 5, 2020
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL RELEASE INTERPOSER
- Publication number 20190393120
- Publication date Dec 26, 2019
- QUALCOMM Incorporated
- Kuiwon KANG
- H01 - BASIC ELECTRIC ELEMENTS

Zhijie WANG

Person

Patents Grantslast 30 patents

Circular bond finger pad

Package comprising inter-substrate gradient interconnect structure

Package comprising a substrate and interconnect device configured f...

Double sided embedded trace substrate

Modular capacitor array

Passive device orientation in core for improved power delivery in p...

Package comprising a substrate and a high-density interconnect stru...

Ground shield plane for ball grid array (BGA) package

Split conductive pad for device terminal

High thermal release interposer

Patents Applicationslast 30 patents

STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDI...

INTEGRATED DEVICE INCLUDING DIRECT MEMORY ATTACHMENT ON THROUGH MOL...

INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING METAL POSTS THERMALLY COU...

PACKAGE SUBSTRATE COMPRISING EMBEDDED INTEGRATED DEVICE

INTERPOSER WITH SOLDER RESIST POSTS

DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES

EMBEDDED TRACE SUBSTRATES (ETSs) WITH T-SHAPED INTERCONNECTS WITH R...

METAL POCKET FANOUT PACKAGE

PACKAGE COMPRISING A FLEXIBLE SUBSTRATE

PACKAGE COMPRISING AN INTERCONNECTION DIE LOCATED BETWEEN SUBSTRATES

PACKAGE COMPRISING A SUBSTRATE WITH A BUMP PAD INTERCONNECT COMPRIS...

PACKAGE SUBSTRATES EMPLOYING PAD METALLIZATION LAYER FOR INCREASED...

PACKAGE COMPRISING A SUBSTRATE WITH POST INTERCONNECTS AND A SOLDER...

PACKAGE COMPRISING INTEGRATED DEVICES COUPLED THROUGH A BRIDGE

CIRCULAR BOND FINGER PAD

PACKAGE COMPRISING A SUBSTRATE AND INTERCONNECT DEVICE CONFIGURED F...

PACKAGE COMPRISING INTER-SUBSTRATE GRADIENT INTERCONNECT STRUCTURE

PASSIVE DEVICE ORIENTATION IN CORE FOR IMPROVED POWER DELIVERY IN P...

MULTICORE SUBSTRATE

MODULAR CAPACITOR ARRAY

PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT STRU...

PACKAGE COMPRISING A DOUBLE-SIDED REDISTRIBUTION PORTION

DOUBLE SIDED EMBEDDED TRACE SUBSTRATE

SPLIT CONDUCTIVE PAD FOR DEVICE TERMINAL

GROUND SHIELD PLANE FOR BALL GRID ARRAY (BGA) PACKAGE

HIGH THERMAL RELEASE INTERPOSER