Zhiyuan Wu

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,990,368
- Issue date May 21, 2024
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line
- Patent number 11,784,127
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ruthenium liner and cap for back-end-of-line applications
- Patent number 11,764,157
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Binary metal liner layers
- Patent number 11,587,873
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Gang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped selective metal caps to improve copper electromigration with...
- Patent number 11,373,903
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Mehul B. Naik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming cobalt and ruthenium capping layers for interco...
- Patent number 11,171,046
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cobalt agglomeration resistance and gap-fill performance b...
- Patent number 11,043,415
- Issue date Jun 22, 2021
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed layers for copper interconnects
- Patent number 10,847,463
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,727,119
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microwave anneal to improve CVD metal gap-fill and throughput
- Patent number 10,438,849
- Issue date Oct 8, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced cobalt agglomeration resistance and gap-fill performance b...
- Patent number 10,410,918
- Issue date Sep 10, 2019
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration approach of selective tungsten via fill
- Patent number 10,256,144
- Issue date Apr 9, 2019
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for optimizing power and functionality in t...
- Patent number 10,037,992
- Issue date Jul 31, 2018
- Altera Corporation
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt resistance recovery by hydrogen anneal
- Patent number 9,711,397
- Issue date Jul 18, 2017
- Applied Materials, Inc.
- Nikolaos Bekiaris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt resistance recovery by hydrogen anneal
- Patent number 9,570,345
- Issue date Feb 14, 2017
- Applied Materials, Inc.
- Nikolaos Bekiaris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with stress inserts
- Patent number 8,350,253
- Issue date Jan 8, 2013
- Xilinx, Inc.
- Bei Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for making the same
- Patent number 8,329,568
- Issue date Dec 11, 2012
- Xilinx, Inc.
- Jae-Gyung Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diffusion regions having different depths
- Patent number 8,299,564
- Issue date Oct 30, 2012
- Xilinx, Inc.
- Yun Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of product performance improvement by selective feature sizi...
- Patent number 8,302,064
- Issue date Oct 30, 2012
- Xilinx, Inc.
- Sharmin Sadoughi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for improving a circuit layout using a hierarc...
- Patent number 7,793,238
- Issue date Sep 7, 2010
- Xilinx, Inc.
- Peter Rabkin
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COPPER REFLOW BY SURFACE MODIFICATION
- Publication number 20240420966
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL
- Publication number 20240420996
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION
- Publication number 20240420997
- Publication date Dec 19, 2024
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE PRECLEAN APPARATUS AND PROCESSING METHOD FOR IMPURITY REM...
- Publication number 20240404803
- Publication date Dec 5, 2024
- Applied Materials, Inc.
- Yoon Ah SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240339358
- Publication date Oct 10, 2024
- Applied Materials, Inc.
- Jesus Candelario Mendoza-Gutierrez
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20240332075
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION
- Publication number 20240321633
- Publication date Sep 26, 2024
- Applied Materials, Inc.
- Zhiyuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE
- Publication number 20240290655
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Zheng JU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA TREATMENT OF BARRIER AND LINER LAYERS
- Publication number 20240258103
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Jiajie Cen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-TREATMENT FOR REMOVING RESIDUES FROM DIELECTRIC SURFACE
- Publication number 20240194605
- Publication date Jun 13, 2024
- Applied Materials, Inc.
- Mohammad Mahdi TAVAKOLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to Deposit Metal Cap for Interconnect
- Publication number 20240186181
- Publication date Jun 6, 2024
- Applied Materials, Inc.
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO FORM METAL LINERS FOR INTERCONNECTS
- Publication number 20240153816
- Publication date May 9, 2024
- Ge QU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES
- Publication number 20230253248
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yang Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Metal Liner For Interconnect Structures
- Publication number 20230072614
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Ge Qu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220344275
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20220336271
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS
- Publication number 20220028795
- Publication date Jan 27, 2022
- Applied Materials, Inc.
- Wenjing Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Binary Metal Liner Layers
- Publication number 20210351136
- Publication date Nov 11, 2021
- Applied Materials, Inc.
- Gang Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...
- Publication number 20200321247
- Publication date Oct 8, 2020
- Applied Materials, Inc.
- FENG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...
- Publication number 20200235006
- Publication date Jul 23, 2020
- Applied Materials, Inc.
- Zhiyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20190157145
- Publication date May 23, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING CAPPING PROTECTION FOR AN INTERCONNECTION STRUC...
- Publication number 20190148150
- Publication date May 16, 2019
- Applied Materials, Inc.
- Joung Joo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEED LAYERS FOR COPPER INTERCONNECTS
- Publication number 20190067201
- Publication date Feb 28, 2019
- Applied Materials, Inc.
- Zhiyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL
- Publication number 20180315650
- Publication date Nov 1, 2018
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...
- Publication number 20180211872
- Publication date Jul 26, 2018
- Applied Materials, Inc.
- Zhiyuan WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromigration Improvement Using Tungsten For Selective Cobalt De...
- Publication number 20180144973
- Publication date May 24, 2018
- Applied Materials, Inc.
- Weifeng Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...
- Publication number 20180096888
- Publication date Apr 5, 2018
- Applied Materials, Inc.
- Mehul B. NAIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROWAVE ANNEAL TO IMPROVE CVD METAL GAP-FILL AND THROUGHPUT
- Publication number 20170309515
- Publication date Oct 26, 2017
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Doped selective metal caps to improve copper electromigration with...

Ruthenium liner and cap for back-end-of-line

Ruthenium liner and cap for back-end-of-line applications

Binary metal liner layers

Doped selective metal caps to improve copper electromigration with...

Methods for forming cobalt and ruthenium capping layers for interco...

Enhanced cobalt agglomeration resistance and gap-fill performance b...

Seed layers for copper interconnects

Process integration approach of selective tungsten via fill

Microwave anneal to improve CVD metal gap-fill and throughput

Enhanced cobalt agglomeration resistance and gap-fill performance b...

Process integration approach of selective tungsten via fill

Methods and apparatuses for optimizing power and functionality in t...

Cobalt resistance recovery by hydrogen anneal

Cobalt resistance recovery by hydrogen anneal

Integrated circuit with stress inserts

Semiconductor device and method for making the same

Diffusion regions having different depths

Method of product performance improvement by selective feature sizi...

Method and apparatus for improving a circuit layout using a hierarc...

Patents Applicationslast 30 patents

COPPER REFLOW BY SURFACE MODIFICATION

SELECTIVE SELF-ASSEMBLED MONOLAYER (SAM) REMOVAL

SELECTIVE LINER DEPOSITION FOR VIA RESISTANCE REDUCTION

MICROWAVE PRECLEAN APPARATUS AND PROCESSING METHOD FOR IMPURITY REM...

METHOD OF FORMING A METAL LINER FOR INTERCONNECT STRUCTURES

GRADIENT METAL LINER FOR INTERCONNECT STRUCTURES

ULTRA-THIN LAYERS BY SELECTIVE PASSIVATION

SELECTIVE VIA-FILL WITH CONFORMAL SIDEWALL COVERAGE

PLASMA TREATMENT OF BARRIER AND LINER LAYERS

POST-TREATMENT FOR REMOVING RESIDUES FROM DIELECTRIC SURFACE

Method to Deposit Metal Cap for Interconnect

METHODS TO FORM METAL LINERS FOR INTERCONNECTS

METHODS OF FORMING METAL LINER FOR INTERCONNECT STRUCTURES

Method Of Forming A Metal Liner For Interconnect Structures

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

RUTHENIUM LINER AND CAP FOR BACK-END-OF-LINE APPLICATIONS

Binary Metal Liner Layers

METHODS FOR FORMING COBALT AND RUTHENIUM CAPPING LAYERS FOR INTERCO...

ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

METHODS FOR FORMING CAPPING PROTECTION FOR AN INTERCONNECTION STRUC...

SEED LAYERS FOR COPPER INTERCONNECTS

PROCESS INTEGRATION APPROACH OF SELECTIVE TUNGSTEN VIA FILL

ENHANCED COBALT AGGLOMERATION RESISTANCE AND GAP-FILL PERFORMANCE B...

Electromigration Improvement Using Tungsten For Selective Cobalt De...

DOPED SELECTIVE METAL CAPS TO IMPROVE COPPER ELECTROMIGRATION WITH...

MICROWAVE ANNEAL TO IMPROVE CVD METAL GAP-FILL AND THROUGHPUT