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Jiangsu, CN
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Patents Grants
last 30 patents
Information
Patent Grant
Die package including substrate with molded device
Patent number
8,525,192
Issue date
Sep 3, 2013
Fairchild Semiconductor Corporation
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally enhanced molded leadless package
Patent number
8,120,169
Issue date
Feb 21, 2012
Fairchild Semiconductor Corporation
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die package including substrate with molded device
Patent number
8,106,406
Issue date
Jan 31, 2012
Fairchild Semiconductor Corporation
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die package including embedded flip chip
Patent number
7,768,108
Issue date
Aug 3, 2010
Fairchild Semiconductor Corporation
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pin substrate and package
Patent number
7,745,244
Issue date
Jun 29, 2010
Fairchild Semiconductor Corporation
Zhongfa Yuan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor die packages suitable for optoelectronic applications...
Patent number
7,589,338
Issue date
Sep 15, 2009
Fairchild Semiconductor Corporation
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE
Publication number
20120012993
Publication date
Jan 19, 2012
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PIN SUBSTRATE AND PACKAGE
Publication number
20090315171
Publication date
Dec 24, 2009
Zhongfa Yuan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Stacked Micro-Module Packages, Systems Using the Same, and Methods...
Publication number
20090256245
Publication date
Oct 15, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
Publication number
20090230537
Publication date
Sep 17, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY ENHANCED MOLDED LEADLESS PACKAGE
Publication number
20090212403
Publication date
Aug 27, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED DIE MOLDED LEADLESS PACKAGE
Publication number
20090212405
Publication date
Aug 27, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE PACKAGE INCLUDING SUBSTRATE WITH MOLDED DEVICE
Publication number
20090174048
Publication date
Jul 9, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGES SUITABLE FOR OPTOELECTRONIC APPLICATIONS...
Publication number
20090140179
Publication date
Jun 4, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE INCLUDING ORIENTED DEVICES
Publication number
20090140266
Publication date
Jun 4, 2009
Yong Liu
H01 - BASIC ELECTRIC ELEMENTS